FR2860099B1 - Procede de realisation d'un transistor a effet de champ et transistor ainsi obtenu - Google Patents
Procede de realisation d'un transistor a effet de champ et transistor ainsi obtenuInfo
- Publication number
- FR2860099B1 FR2860099B1 FR0310984A FR0310984A FR2860099B1 FR 2860099 B1 FR2860099 B1 FR 2860099B1 FR 0310984 A FR0310984 A FR 0310984A FR 0310984 A FR0310984 A FR 0310984A FR 2860099 B1 FR2860099 B1 FR 2860099B1
- Authority
- FR
- France
- Prior art keywords
- transistor
- producing
- field effect
- effect transistor
- field
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000005669 field effect Effects 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6757—Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/026—Manufacture or treatment of FETs having insulated gates [IGFET] having laterally-coplanar source and drain regions, a gate at the sides of the bulk channel, and both horizontal and vertical current flow
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
- H10D30/0321—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon
- H10D30/0323—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon comprising monocrystalline silicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
- H10D30/6735—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes having gates fully surrounding the channels, e.g. gate-all-around
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0310984A FR2860099B1 (fr) | 2003-09-18 | 2003-09-18 | Procede de realisation d'un transistor a effet de champ et transistor ainsi obtenu |
| US10/943,242 US7297578B2 (en) | 2003-09-18 | 2004-09-16 | Method for producing a field effect transistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0310984A FR2860099B1 (fr) | 2003-09-18 | 2003-09-18 | Procede de realisation d'un transistor a effet de champ et transistor ainsi obtenu |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2860099A1 FR2860099A1 (fr) | 2005-03-25 |
| FR2860099B1 true FR2860099B1 (fr) | 2006-01-06 |
Family
ID=34224341
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR0310984A Expired - Fee Related FR2860099B1 (fr) | 2003-09-18 | 2003-09-18 | Procede de realisation d'un transistor a effet de champ et transistor ainsi obtenu |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US7297578B2 (fr) |
| FR (1) | FR2860099B1 (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2897202B1 (fr) * | 2006-02-08 | 2008-09-12 | St Microelectronics Crolles 2 | Transistor mos a barriere de schottky sur film semi-conducteur entierement appauvri et procede de fabrication d'un tel transistor. |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3460863B2 (ja) * | 1993-09-17 | 2003-10-27 | 三菱電機株式会社 | 半導体装置の製造方法 |
| KR100205442B1 (ko) * | 1995-12-26 | 1999-07-01 | 구본준 | 박막트랜지스터 및 그의 제조방법 |
| US5753557A (en) * | 1996-10-07 | 1998-05-19 | Vanguard International Semiconductor Company | Bridge-free self aligned silicide process |
| JPH118390A (ja) * | 1997-06-18 | 1999-01-12 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
| FR2799305B1 (fr) * | 1999-10-05 | 2004-06-18 | St Microelectronics Sa | Procede de fabrication d'un dispositif semi-conducteur a grille enveloppante et dispositif obtenu |
| FR2806832B1 (fr) * | 2000-03-22 | 2002-10-25 | Commissariat Energie Atomique | Transistor mos a source et drain metalliques, et procede de fabrication d'un tel transistor |
| KR100414217B1 (ko) * | 2001-04-12 | 2004-01-07 | 삼성전자주식회사 | 게이트 올 어라운드형 트랜지스터를 가진 반도체 장치 및그 형성 방법 |
| US6803313B2 (en) * | 2002-09-27 | 2004-10-12 | Advanced Micro Devices, Inc. | Method for forming a hardmask employing multiple independently formed layers of a pecvd material to reduce pinholes |
| KR100481209B1 (ko) * | 2002-10-01 | 2005-04-08 | 삼성전자주식회사 | 다중 채널을 갖는 모스 트랜지스터 및 그 제조방법 |
| US7176041B2 (en) * | 2003-07-01 | 2007-02-13 | Samsung Electronics Co., Ltd. | PAA-based etchant, methods of using same, and resultant structures |
| US6921700B2 (en) * | 2003-07-31 | 2005-07-26 | Freescale Semiconductor, Inc. | Method of forming a transistor having multiple channels |
-
2003
- 2003-09-18 FR FR0310984A patent/FR2860099B1/fr not_active Expired - Fee Related
-
2004
- 2004-09-16 US US10/943,242 patent/US7297578B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US20050085024A1 (en) | 2005-04-21 |
| FR2860099A1 (fr) | 2005-03-25 |
| US7297578B2 (en) | 2007-11-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |
Effective date: 20100531 |