FR2846010B1 - Alliages metalliques a base de plomb et d'etain, et procede pour leur preparation - Google Patents
Alliages metalliques a base de plomb et d'etain, et procede pour leur preparationInfo
- Publication number
- FR2846010B1 FR2846010B1 FR0212867A FR0212867A FR2846010B1 FR 2846010 B1 FR2846010 B1 FR 2846010B1 FR 0212867 A FR0212867 A FR 0212867A FR 0212867 A FR0212867 A FR 0212867A FR 2846010 B1 FR2846010 B1 FR 2846010B1
- Authority
- FR
- France
- Prior art keywords
- tin
- lead
- preparation
- metal alloys
- alloys based
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
- C22C1/03—Making non-ferrous alloys by melting using master alloys
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C11/00—Alloys based on lead
- C22C11/06—Alloys based on lead with tin as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Adornments (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0212867A FR2846010B1 (fr) | 2002-10-16 | 2002-10-16 | Alliages metalliques a base de plomb et d'etain, et procede pour leur preparation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0212867A FR2846010B1 (fr) | 2002-10-16 | 2002-10-16 | Alliages metalliques a base de plomb et d'etain, et procede pour leur preparation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2846010A1 FR2846010A1 (fr) | 2004-04-23 |
| FR2846010B1 true FR2846010B1 (fr) | 2005-07-15 |
Family
ID=32050442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR0212867A Expired - Fee Related FR2846010B1 (fr) | 2002-10-16 | 2002-10-16 | Alliages metalliques a base de plomb et d'etain, et procede pour leur preparation |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2846010B1 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102703755A (zh) * | 2012-06-21 | 2012-10-03 | 上海锦众信息科技有限公司 | 铅酸蓄电池板栅合金材料的制备方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1478644A (en) * | 1974-08-19 | 1977-07-06 | Multicore Solders Ltd | Aluminium soldering |
| DE3545104A1 (de) * | 1985-12-19 | 1987-07-02 | Nippon Filler Metals Co | Verfahren zur verhinderung der oxidation von pb-, sn- und sn-pb-legierungen im geschmolzenen zustand |
| GB2201545B (en) * | 1987-01-30 | 1991-09-11 | Tanaka Electronics Ind | Method for connecting semiconductor material |
| DE3730764C1 (de) * | 1987-09-12 | 1988-07-14 | Demetron | Verwendung von Legierungen aus Zinn und/oder Blei als Weichlote zum Aufbringen von Halbleitern auf metallische Traeger |
| JP2807008B2 (ja) * | 1989-12-29 | 1998-09-30 | 田中電子工業株式会社 | 熱疲労特性に優れたPb合金ろう |
| EP0652072A1 (fr) * | 1993-11-09 | 1995-05-10 | Matsushita Electric Industrial Co., Ltd. | Soudure |
| DE19526822C2 (de) * | 1995-07-15 | 1998-07-02 | Euromat Gmbh | Lotlegierung, Verwendung der Lotlegierung und Verfahren zum Verbinden von Werkstücken durch Löten |
| JPH10233577A (ja) * | 1997-02-20 | 1998-09-02 | Taiho Kogyo Co Ltd | はんだペースト |
| JP3752064B2 (ja) * | 1997-05-23 | 2006-03-08 | 内橋エステック株式会社 | 半田材料及びそれを用いた電子部品 |
-
2002
- 2002-10-16 FR FR0212867A patent/FR2846010B1/fr not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102703755A (zh) * | 2012-06-21 | 2012-10-03 | 上海锦众信息科技有限公司 | 铅酸蓄电池板栅合金材料的制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2846010A1 (fr) | 2004-04-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |
Effective date: 20060630 |