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FR2715241B1 - Procédé et dispositif de compensation de déformations dans un système d'inspection optique automatique. - Google Patents

Procédé et dispositif de compensation de déformations dans un système d'inspection optique automatique.

Info

Publication number
FR2715241B1
FR2715241B1 FR9500304A FR9500304A FR2715241B1 FR 2715241 B1 FR2715241 B1 FR 2715241B1 FR 9500304 A FR9500304 A FR 9500304A FR 9500304 A FR9500304 A FR 9500304A FR 2715241 B1 FR2715241 B1 FR 2715241B1
Authority
FR
France
Prior art keywords
inspection system
optical inspection
automatic optical
compensating deformations
deformations
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9500304A
Other languages
English (en)
Other versions
FR2715241A1 (fr
Inventor
Ronald J Straayer
Scott P Snietka
Peter M Walsh
James P Kohler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gerber Systems Corp
Original Assignee
Gerber Systems Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gerber Systems Corp filed Critical Gerber Systems Corp
Publication of FR2715241A1 publication Critical patent/FR2715241A1/fr
Application granted granted Critical
Publication of FR2715241B1 publication Critical patent/FR2715241B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2805—Bare printed circuit boards
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/30—Determination of transform parameters for the alignment of images, i.e. image registration
    • G06T7/32—Determination of transform parameters for the alignment of images, i.e. image registration using correlation-based methods
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Analysis (AREA)
FR9500304A 1994-01-14 1995-01-12 Procédé et dispositif de compensation de déformations dans un système d'inspection optique automatique. Expired - Fee Related FR2715241B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/182,842 US5506793A (en) 1994-01-14 1994-01-14 Method and apparatus for distortion compensation in an automatic optical inspection system

Publications (2)

Publication Number Publication Date
FR2715241A1 FR2715241A1 (fr) 1995-07-21
FR2715241B1 true FR2715241B1 (fr) 1998-05-22

Family

ID=22670277

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9500304A Expired - Fee Related FR2715241B1 (fr) 1994-01-14 1995-01-12 Procédé et dispositif de compensation de déformations dans un système d'inspection optique automatique.

Country Status (5)

Country Link
US (1) US5506793A (fr)
JP (1) JP2733206B2 (fr)
DE (1) DE19500382A1 (fr)
FR (1) FR2715241B1 (fr)
GB (1) GB2285682B (fr)

Families Citing this family (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5844810A (en) * 1995-05-30 1998-12-01 General Electric Company Scaled adaptive lithography
DE59608537D1 (de) * 1995-10-25 2002-02-07 Infineon Technologies Ag Verfahren zur Kontrolle von Scheiben
US5859924A (en) * 1996-07-12 1999-01-12 Robotic Vision Systems, Inc. Method and system for measuring object features
US6075883A (en) * 1996-11-12 2000-06-13 Robotic Vision Systems, Inc. Method and system for imaging an object or pattern
US5760893A (en) * 1996-12-24 1998-06-02 Teradyne, Inc. Method and apparatus for inspecting component placement and solder connection in printed circuit board manufacture
IT1290345B1 (it) * 1997-02-18 1998-10-22 Circuit Line Spa Metodo e dispositivo per la correzione dell'errore di allineamento fra aghi di test e punti di test nella fase di test elettrico di
DE19709939A1 (de) * 1997-03-11 1998-09-17 Atg Test Systems Gmbh Verfahren und Vorrichtung zum Prüfen von Leiterplatten
US6122397A (en) * 1997-07-03 2000-09-19 Tri Path Imaging, Inc. Method and apparatus for maskless semiconductor and liquid crystal display inspection
DE19731545C1 (de) * 1997-07-23 1999-05-27 Basler Gmbh Vorrichtung und Verfahren zum optischen Erfassen der Verformung einer Fläche
US6038336A (en) * 1997-12-04 2000-03-14 Daewoo Electronics Co., Ltd. PCB testing circuit for an automatic inserting apparatus and a testing method therefor
JP4002655B2 (ja) * 1998-01-06 2007-11-07 株式会社日立製作所 パターン検査方法およびその装置
DE19831393B4 (de) 1998-07-14 2016-12-08 Ernst Schulte Türschließer
US6438561B1 (en) * 1998-11-19 2002-08-20 Navigation Technologies Corp. Method and system for using real-time traffic broadcasts with navigation systems
US6266436B1 (en) * 1999-04-09 2001-07-24 Kimberly-Clark Worldwide, Inc. Process control using multiple detections
US20030054390A1 (en) * 1999-01-19 2003-03-20 Maxygen, Inc. Oligonucleotide mediated nucleic acid recombination
US6917882B2 (en) * 1999-01-19 2005-07-12 Maxygen, Inc. Methods for making character strings, polynucleotides and polypeptides having desired characteristics
AU2415200A (en) * 1999-01-18 2000-08-01 Maxygen, Inc. Methods of populating data structures for use in evolutionary simulations
US6376246B1 (en) 1999-02-05 2002-04-23 Maxygen, Inc. Oligonucleotide mediated nucleic acid recombination
US7873477B1 (en) 2001-08-21 2011-01-18 Codexis Mayflower Holdings, Llc Method and system using systematically varied data libraries
US8457903B1 (en) 1999-01-19 2013-06-04 Codexis Mayflower Holdings, Llc Method and/or apparatus for determining codons
US7702464B1 (en) 2001-08-21 2010-04-20 Maxygen, Inc. Method and apparatus for codon determining
US20070065838A1 (en) * 1999-01-19 2007-03-22 Maxygen, Inc. Oligonucleotide mediated nucleic acid recombination
US7024312B1 (en) * 1999-01-19 2006-04-04 Maxygen, Inc. Methods for making character strings, polynucleotides and polypeptides having desired characteristics
US6165658A (en) * 1999-07-06 2000-12-26 Creo Ltd. Nonlinear image distortion correction in printed circuit board manufacturing
US6912304B1 (en) * 1999-08-02 2005-06-28 Applied Materials, Inc. Two-dimensional scatter plot technique for defect inspection
US7430477B2 (en) * 1999-10-12 2008-09-30 Maxygen, Inc. Methods of populating data structures for use in evolutionary simulations
CA2296143A1 (fr) * 2000-01-18 2001-07-18 9071 9410 Quebec Inc. Systeme d'inspection optique
US6603542B1 (en) 2000-06-14 2003-08-05 Qc Optics, Inc. High sensitivity optical inspection system and method for detecting flaws on a diffractive surface
DE10043728C2 (de) * 2000-09-05 2003-12-04 Atg Test Systems Gmbh Verfahren zum Prüfen von Leiterplatten und Verwendung einer Vorrichtung zum Ausführen des Verfahrens
JP2002251604A (ja) * 2001-02-23 2002-09-06 Ibiden Co Ltd 画像データ作成方法およびその装置
US6493064B2 (en) 2001-02-28 2002-12-10 Creo Il, Ltd. Method and apparatus for registration control in production by imaging
US6593066B2 (en) 2001-02-28 2003-07-15 Creo Il. Ltd. Method and apparatus for printing patterns on substrates
KR100855426B1 (ko) * 2001-05-25 2008-08-29 지멘스 악티엔게젤샤프트 이미지 데이터를 처리하기 위한 장치 및 방법
US6766736B2 (en) 2001-08-30 2004-07-27 Micron Technology, Inc. Printing stencils for electronic substrates
JP4254204B2 (ja) 2001-12-19 2009-04-15 富士ゼロックス株式会社 画像照合装置、画像形成装置及び画像照合プログラム
JP4375523B2 (ja) * 2002-12-20 2009-12-02 富士ゼロックス株式会社 画像処理装置、画像処理方法、画像処理プログラム、印刷物検査装置、印刷物検査方法、印刷物検査プログラム
CN100510720C (zh) * 2003-09-05 2009-07-08 英业达股份有限公司 降低自动光学检查机误判率的方法
US20050190959A1 (en) * 2004-02-26 2005-09-01 Kohler James P. Drill hole inspection method for printed circuit board fabrication
GB2425829A (en) * 2005-05-06 2006-11-08 Mv Res Ltd A classification system
US7951697B1 (en) 2007-06-20 2011-05-31 Amkor Technology, Inc. Embedded die metal etch stop fabrication method and structure
US7923645B1 (en) 2007-06-20 2011-04-12 Amkor Technology, Inc. Metal etch stop fabrication method and structure
US7958626B1 (en) 2007-10-25 2011-06-14 Amkor Technology, Inc. Embedded passive component network substrate fabrication method
JP2009276096A (ja) * 2008-05-12 2009-11-26 Seiko Precision Inc 基板変形認識方法及び基板変形認識装置及び基板変形認識プログラム
US8260030B2 (en) * 2009-03-30 2012-09-04 Koh Young Technology Inc. Inspection method
JP5407632B2 (ja) * 2009-07-22 2014-02-05 富士通株式会社 プリント基板試験支援装置、プリント基板試験支援方法、及びプリント基板試験支援プログラム
KR101231597B1 (ko) * 2010-11-15 2013-02-08 주식회사 고영테크놀러지 검사방법
KR101692277B1 (ko) 2010-11-23 2017-01-04 주식회사 고영테크놀러지 검사방법
US8791501B1 (en) 2010-12-03 2014-07-29 Amkor Technology, Inc. Integrated passive device structure and method
SG187694A1 (en) 2010-12-20 2013-03-28 Ev Group E Thallner Gmbh Receiving means for mounting of wafers
JP6054984B2 (ja) * 2011-11-16 2016-12-27 ディーシージー システムズ、 インコーポレイテッドDcg Systems Inc. 偏光ダイバーシティ撮像およびアライメントのための装置および方法
CN103185560A (zh) * 2011-12-29 2013-07-03 鸿富锦精密工业（深圳）有限公司 Pcb板线路的线宽检测系统及方法
CN102682166B (zh) * 2012-05-09 2014-01-15 上海望友信息科技有限公司 Smt设备快速制程系统及方法
CN103323468A (zh) * 2013-05-20 2013-09-25 晟光科技股份有限公司 一种单面多点非接触式图案的测试方法
JP6336493B2 (ja) * 2016-01-14 2018-06-06 エーファウ・グループ・エー・タルナー・ゲーエムベーハー ウェハの装着用受け取り手段
JP7042118B2 (ja) 2018-03-08 2022-03-25 株式会社東芝 検査装置、検査方法、及びプログラム
DE102018220236A1 (de) 2018-11-26 2020-05-28 Heidelberger Druckmaschinen Ag Schnelle Bildentzerrung für Bildinspektion
CN109738158B (zh) * 2019-01-24 2020-11-03 武汉精立电子技术有限公司 基于aoi平台的色度亮度数据的采集方法及装置
CN110109945B (zh) * 2019-04-10 2021-05-07 Tcl华星光电技术有限公司 应用于基板的aoi检测方法、装置、存储介质及aoi检测设备
JP7109489B2 (ja) * 2020-02-06 2022-07-29 エーファウ・グループ・エー・タルナー・ゲーエムベーハー ウェハの装着用受け取り手段
TWI753554B (zh) * 2020-08-28 2022-01-21 致茂電子股份有限公司 自動化調整電子設備的方法
TWI787781B (zh) * 2021-04-09 2022-12-21 住華科技股份有限公司 監控自動光學檢測裝置的方法及系統
CN116152210A (zh) * 2022-06-20 2023-05-23 苏州康代智能科技股份有限公司 Pcb缺陷修正方法及电路板制作方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5957431A (ja) * 1982-09-27 1984-04-03 Fujitsu Ltd 電子ビ−ム露光装置
US4628466A (en) * 1984-10-29 1986-12-09 Excellon Industries Method and apparatus for pattern forming
JP2521910B2 (ja) * 1986-05-07 1996-08-07 オムロン株式会社 プリント基板の位置ずれ補正装置
US4783826A (en) * 1986-08-18 1988-11-08 The Gerber Scientific Company, Inc. Pattern inspection system
US4835704A (en) * 1986-12-29 1989-05-30 General Electric Company Adaptive lithography system to provide high density interconnect
US5023917A (en) * 1988-08-15 1991-06-11 At&T Bell Laboratories Method and apparatus for pattern inspection
US5157762A (en) * 1990-04-10 1992-10-20 Gerber Systems Corporation Method and apparatus for providing a three state data base for use with automatic optical inspection systems
JP2757545B2 (ja) * 1990-07-27 1998-05-25 大日本スクリーン製造 株式会社 複数の画像読取りシステム相互の位置誤差補償方法
US5163128A (en) * 1990-07-27 1992-11-10 Gerber Systems Corporation Method and apparatus for generating a multiple tolerance, three state data base for use with automatic optical inspection systems
US5251271A (en) * 1991-10-21 1993-10-05 R. R. Donnelley & Sons Co. Method for automatic registration of digitized multi-plane images

Also Published As

Publication number Publication date
JP2733206B2 (ja) 1998-03-30
GB9425228D0 (en) 1995-02-08
FR2715241A1 (fr) 1995-07-21
GB2285682A (en) 1995-07-19
DE19500382A1 (de) 1995-07-20
GB2285682B (en) 1998-03-11
US5506793A (en) 1996-04-09
JPH0835936A (ja) 1996-02-06

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