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FR2699039B1 - Electronic card with multilayer substrate. - Google Patents

Electronic card with multilayer substrate.

Info

Publication number
FR2699039B1
FR2699039B1 FR9214669A FR9214669A FR2699039B1 FR 2699039 B1 FR2699039 B1 FR 2699039B1 FR 9214669 A FR9214669 A FR 9214669A FR 9214669 A FR9214669 A FR 9214669A FR 2699039 B1 FR2699039 B1 FR 2699039B1
Authority
FR
France
Prior art keywords
multilayer substrate
electronic card
multilayer
card
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9214669A
Other languages
French (fr)
Other versions
FR2699039A1 (en
Inventor
Michel Poirier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sagem SA
Original Assignee
Sagem SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sagem SA filed Critical Sagem SA
Priority to FR9214669A priority Critical patent/FR2699039B1/en
Publication of FR2699039A1 publication Critical patent/FR2699039A1/en
Application granted granted Critical
Publication of FR2699039B1 publication Critical patent/FR2699039B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0256—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
    • H05K5/026—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms having standardized interfaces
    • H10W42/20—
    • H10W70/611—
    • H10W70/685—
    • H10W70/699—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H10W90/754—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
FR9214669A 1992-12-04 1992-12-04 Electronic card with multilayer substrate. Expired - Fee Related FR2699039B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9214669A FR2699039B1 (en) 1992-12-04 1992-12-04 Electronic card with multilayer substrate.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9214669A FR2699039B1 (en) 1992-12-04 1992-12-04 Electronic card with multilayer substrate.

Publications (2)

Publication Number Publication Date
FR2699039A1 FR2699039A1 (en) 1994-06-10
FR2699039B1 true FR2699039B1 (en) 1995-02-17

Family

ID=9436262

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9214669A Expired - Fee Related FR2699039B1 (en) 1992-12-04 1992-12-04 Electronic card with multilayer substrate.

Country Status (1)

Country Link
FR (1) FR2699039B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11854932B2 (en) 2019-12-19 2023-12-26 Intel Corporation Package wrap-around heat spreader

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE29514398U1 (en) * 1995-09-07 1995-10-19 Siemens AG, 80333 München Shielding for printed circuit boards
JP3202163B2 (en) * 1996-03-05 2001-08-27 ヒロセ電機株式会社 PC card and frame kit therefor
JP4218193B2 (en) * 2000-08-24 2009-02-04 三菱電機株式会社 Power module

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3492535A (en) * 1968-01-08 1970-01-27 Ncr Co Ceramic circuit card
FR2212740B1 (en) * 1972-12-28 1977-02-25 Honeywell Bull
GB8423618D0 (en) * 1984-09-18 1984-10-24 Howood Ind Ltd Heat sink structures
US4882454A (en) * 1988-02-12 1989-11-21 Texas Instruments Incorporated Thermal interface for a printed wiring board
GB2237147A (en) * 1989-10-13 1991-04-24 Electricity Council Printed circuit board arrangement.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11854932B2 (en) 2019-12-19 2023-12-26 Intel Corporation Package wrap-around heat spreader

Also Published As

Publication number Publication date
FR2699039A1 (en) 1994-06-10

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Legal Events

Date Code Title Description
TP Transmission of property
ST Notification of lapse

Effective date: 20090831