[go: up one dir, main page]

FR2251915B1 - - Google Patents

Info

Publication number
FR2251915B1
FR2251915B1 FR7436263A FR7436263A FR2251915B1 FR 2251915 B1 FR2251915 B1 FR 2251915B1 FR 7436263 A FR7436263 A FR 7436263A FR 7436263 A FR7436263 A FR 7436263A FR 2251915 B1 FR2251915 B1 FR 2251915B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7436263A
Other versions
FR2251915A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Publication of FR2251915A1 publication Critical patent/FR2251915A1/fr
Application granted granted Critical
Publication of FR2251915B1 publication Critical patent/FR2251915B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H10W76/132—
    • H10W76/153—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
FR7436263A 1973-11-21 1974-10-30 Expired FR2251915B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00418018A US3857993A (en) 1973-11-21 1973-11-21 Beam lead semiconductor package

Publications (2)

Publication Number Publication Date
FR2251915A1 FR2251915A1 (fr) 1975-06-13
FR2251915B1 true FR2251915B1 (fr) 1979-02-23

Family

ID=23656332

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7436263A Expired FR2251915B1 (fr) 1973-11-21 1974-10-30

Country Status (8)

Country Link
US (1) US3857993A (fr)
JP (1) JPS5081781A (fr)
CA (1) CA999384A (fr)
CH (1) CH581390A5 (fr)
DE (1) DE2454605C2 (fr)
FR (1) FR2251915B1 (fr)
GB (1) GB1447808A (fr)
SE (1) SE7413820L (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3918147A (en) * 1974-03-25 1975-11-11 Corning Glass Works Hermetic enclosure for electronic component
US4099200A (en) * 1976-03-26 1978-07-04 Raytheon Company Package for semiconductor beam lead devices
NL181963C (nl) * 1979-06-26 1987-12-01 Philips Nv Halfgeleiderlaserinrichting.
US4675626A (en) * 1985-11-27 1987-06-23 Rogers Corporation Carrier assembly for mounting a rolled coplanar delay line
DE3732075A1 (de) * 1987-09-23 1989-04-06 Siemens Ag Hermetisch dichtes glas-metallgehaeuse fuer halbleiterbauelemente und verfahren zu dessen herstellung
DE3822167A1 (de) * 1988-06-30 1990-02-08 Liess Hans Dieter Prof Dr Ing Lichtschranke
US5102029A (en) * 1990-06-22 1992-04-07 Watkins-Johnson Company Microwave integrated circuit package to eliminate alumina substrate cracking and method
US6229088B1 (en) * 1998-01-09 2001-05-08 Legacy Technologies, Inc. Low profile electronic enclosure
US7211877B1 (en) * 1999-09-13 2007-05-01 Vishay-Siliconix Chip scale surface mount package for semiconductor device and process of fabricating the same
US6744124B1 (en) * 1999-12-10 2004-06-01 Siliconix Incorporated Semiconductor die package including cup-shaped leadframe
US7595547B1 (en) * 2005-06-13 2009-09-29 Vishay-Siliconix Semiconductor die package including cup-shaped leadframe
US6992251B1 (en) * 2004-08-31 2006-01-31 Sung Jung Minute Industry Co., Ltd. Rectification chip terminal structure
CN101536180A (zh) * 2006-11-15 2009-09-16 株式会社大真空 电子部件的封装体

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3239596A (en) * 1963-02-25 1966-03-08 Sylvania Electric Prod Support for electrical elements having separate conductive segments for connecting the elements to support leads
US3405442A (en) * 1964-02-13 1968-10-15 Gen Micro Electronics Inc Method of packaging microelectronic devices
US3262022A (en) * 1964-02-13 1966-07-19 Gen Micro Electronics Inc Packaged electronic device
US3486892A (en) * 1966-01-13 1969-12-30 Raytheon Co Preferential etching technique
YU34342B (en) * 1969-08-11 1979-04-30 Inst Za Elektroniko In Vakuums Socket for electronic components and micro-circuits
US3747829A (en) * 1971-12-13 1973-07-24 Raytheon Co Semiconductor lead bonding machine

Also Published As

Publication number Publication date
DE2454605C2 (de) 1986-11-20
FR2251915A1 (fr) 1975-06-13
SE7413820L (fr) 1975-05-22
CA999384A (en) 1976-11-02
CH581390A5 (fr) 1976-10-29
DE2454605A1 (de) 1975-06-19
GB1447808A (en) 1976-09-02
US3857993A (en) 1974-12-31
JPS5081781A (fr) 1975-07-02

Similar Documents

Publication Publication Date Title
AR201758A1 (fr)
AR201235Q (fr)
AR201231Q (fr)
AU465453B2 (fr)
FR2251915B1 (fr)
AR201229Q (fr)
AR199451A1 (fr)
AU477823B2 (fr)
AR210729A1 (fr)
AR196382A1 (fr)
AR197627A1 (fr)
AU477824B2 (fr)
AR201432A1 (fr)
AR195948A1 (fr)
AU476873B1 (fr)
AU447540B2 (fr)
AR200885A1 (fr)
AR193950A1 (fr)
AR195311A1 (fr)
AR196212Q (fr)
AR196123Q (fr)
AU1891376A (fr)
CH559985A5 (fr)
BG19278A1 (fr)
BG19346A1 (fr)

Legal Events

Date Code Title Description
ST Notification of lapse