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FR2017780A1 - - Google Patents

Info

Publication number
FR2017780A1
FR2017780A1 FR6930572A FR6930572A FR2017780A1 FR 2017780 A1 FR2017780 A1 FR 2017780A1 FR 6930572 A FR6930572 A FR 6930572A FR 6930572 A FR6930572 A FR 6930572A FR 2017780 A1 FR2017780 A1 FR 2017780A1
Authority
FR
France
Prior art keywords
chips
plate
soldered
substrate
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR6930572A
Other languages
English (en)
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of FR2017780A1 publication Critical patent/FR2017780A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H10W76/157—
    • H10W40/77—
    • H10W70/682—
    • H10W72/07236—
    • H10W72/07353—
    • H10W72/252—
    • H10W72/334—
    • H10W72/5363—
    • H10W72/877—
    • H10W72/879—
    • H10W72/884—
    • H10W72/931—
    • H10W90/722—
    • H10W90/724—
    • H10W90/734—
    • H10W90/736—
    • H10W90/754—
    • H10W90/756—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FR6930572A 1968-09-11 1969-09-09 Withdrawn FR2017780A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP43064967A JPS51292B1 (de) 1968-09-11 1968-09-11

Publications (1)

Publication Number Publication Date
FR2017780A1 true FR2017780A1 (de) 1970-05-22

Family

ID=13273309

Family Applications (1)

Application Number Title Priority Date Filing Date
FR6930572A Withdrawn FR2017780A1 (de) 1968-09-11 1969-09-09

Country Status (4)

Country Link
JP (1) JPS51292B1 (de)
DE (1) DE1945899B2 (de)
FR (1) FR2017780A1 (de)
GB (1) GB1276682A (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3521572A1 (de) * 1985-06-15 1986-12-18 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul mit keramiksubstrat
GB9218233D0 (en) * 1992-08-27 1992-10-14 Dsk Technology International L Cooling of electronics equipment
US20080128895A1 (en) * 2006-12-05 2008-06-05 Oman Todd P Wafer applied thermal-mechanical interface
CN106171051B (zh) * 2015-03-20 2019-06-04 哈农系统 电动压缩机变频器冷却装置及设有其的变频器组装体
US10403594B2 (en) * 2018-01-22 2019-09-03 Toyota Motor Engineering & Manufacturing North America, Inc. Hybrid bonding materials comprising ball grid arrays and metal inverse opal bonding layers, and power electronics assemblies incorporating the same
WO2021049039A1 (ja) * 2019-09-13 2021-03-18 株式会社デンソー 半導体装置

Also Published As

Publication number Publication date
JPS51292B1 (de) 1976-01-07
GB1276682A (en) 1972-06-07
DE1945899B2 (de) 1972-04-20
DE1945899A1 (de) 1970-03-26

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Legal Events

Date Code Title Description
ST Notification of lapse