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FR1310995A - Concentrated product for the preparation and regeneration of a nickel-plating bath without electric current and process for its preparation - Google Patents

Concentrated product for the preparation and regeneration of a nickel-plating bath without electric current and process for its preparation

Info

Publication number
FR1310995A
FR1310995A FR885160A FR885160A FR1310995A FR 1310995 A FR1310995 A FR 1310995A FR 885160 A FR885160 A FR 885160A FR 885160 A FR885160 A FR 885160A FR 1310995 A FR1310995 A FR 1310995A
Authority
FR
France
Prior art keywords
preparation
regeneration
nickel
electric current
plating bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR885160A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Riedel and Co
Original Assignee
Riedel and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Riedel and Co filed Critical Riedel and Co
Priority to FR885160A priority Critical patent/FR1310995A/en
Application granted granted Critical
Publication of FR1310995A publication Critical patent/FR1310995A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
FR885160A 1962-01-18 1962-01-18 Concentrated product for the preparation and regeneration of a nickel-plating bath without electric current and process for its preparation Expired FR1310995A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR885160A FR1310995A (en) 1962-01-18 1962-01-18 Concentrated product for the preparation and regeneration of a nickel-plating bath without electric current and process for its preparation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR885160A FR1310995A (en) 1962-01-18 1962-01-18 Concentrated product for the preparation and regeneration of a nickel-plating bath without electric current and process for its preparation

Publications (1)

Publication Number Publication Date
FR1310995A true FR1310995A (en) 1962-11-30

Family

ID=8770695

Family Applications (1)

Application Number Title Priority Date Filing Date
FR885160A Expired FR1310995A (en) 1962-01-18 1962-01-18 Concentrated product for the preparation and regeneration of a nickel-plating bath without electric current and process for its preparation

Country Status (1)

Country Link
FR (1) FR1310995A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0692554A1 (en) * 1994-07-14 1996-01-17 Matsushita Electric Industrial Co., Ltd. Electroless plating bath used for forming a wiring of a semiconductor device, and method of forming a wiring of a semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0692554A1 (en) * 1994-07-14 1996-01-17 Matsushita Electric Industrial Co., Ltd. Electroless plating bath used for forming a wiring of a semiconductor device, and method of forming a wiring of a semiconductor device
US5645628A (en) * 1994-07-14 1997-07-08 Matsushita Electric Industrial Co., Ltd. Electroless plating bath used for forming a wiring of a semiconductor device, and method of forming a wiring of a semiconductor device

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