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FR1383804A - Electric semiconductor device - Google Patents

Electric semiconductor device

Info

Publication number
FR1383804A
FR1383804A FR946857A FR946857A FR1383804A FR 1383804 A FR1383804 A FR 1383804A FR 946857 A FR946857 A FR 946857A FR 946857 A FR946857 A FR 946857A FR 1383804 A FR1383804 A FR 1383804A
Authority
FR
France
Prior art keywords
semiconductor device
electric semiconductor
electric
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR946857A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maxar Space LLC
Original Assignee
Philco Ford Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US22932962 external-priority patent/US3235945A/en
Application filed by Philco Ford Corp filed Critical Philco Ford Corp
Priority to FR946857A priority Critical patent/FR1383804A/en
Application granted granted Critical
Publication of FR1383804A publication Critical patent/FR1383804A/en
Expired legal-status Critical Current

Links

Classifications

    • H10W72/075—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of less than 400°C
    • H01L2224/45105—Gallium (Ga) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of less than 400°C
    • H01L2224/45109—Indium (In) as principal constituent
    • H10W72/07532—
    • H10W72/07533—
    • H10W72/534—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/59—
    • H10W72/884—
    • H10W72/923—
    • H10W72/952—
    • H10W90/754—
FR946857A 1962-10-09 1963-09-06 Electric semiconductor device Expired FR1383804A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR946857A FR1383804A (en) 1962-10-09 1963-09-06 Electric semiconductor device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US22932962 US3235945A (en) 1962-10-09 1962-10-09 Connection of semiconductor elements to thin film circuits using foil ribbon
FR946857A FR1383804A (en) 1962-10-09 1963-09-06 Electric semiconductor device

Publications (1)

Publication Number Publication Date
FR1383804A true FR1383804A (en) 1965-01-04

Family

ID=26203261

Family Applications (1)

Application Number Title Priority Date Filing Date
FR946857A Expired FR1383804A (en) 1962-10-09 1963-09-06 Electric semiconductor device

Country Status (1)

Country Link
FR (1) FR1383804A (en)

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