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FR1378154A - Interconnexions électriques pour panneaux de circuits imprimés - Google Patents

Interconnexions électriques pour panneaux de circuits imprimés

Info

Publication number
FR1378154A
FR1378154A FR948074A FR948074A FR1378154A FR 1378154 A FR1378154 A FR 1378154A FR 948074 A FR948074 A FR 948074A FR 948074 A FR948074 A FR 948074A FR 1378154 A FR1378154 A FR 1378154A
Authority
FR
France
Prior art keywords
printed circuit
circuit boards
electrical interconnections
interconnections
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR948074A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
North American Aviation Corp
Original Assignee
North American Aviation Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US225804A external-priority patent/US3335489A/en
Application filed by North American Aviation Corp filed Critical North American Aviation Corp
Priority to FR948074A priority Critical patent/FR1378154A/fr
Application granted granted Critical
Publication of FR1378154A publication Critical patent/FR1378154A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/526—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures the printed circuits being on the same board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1184—Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching
    • H05K3/346—

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
FR948074A 1962-09-24 1963-09-19 Interconnexions électriques pour panneaux de circuits imprimés Expired FR1378154A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR948074A FR1378154A (fr) 1962-09-24 1963-09-19 Interconnexions électriques pour panneaux de circuits imprimés

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US225804A US3335489A (en) 1962-09-24 1962-09-24 Interconnecting circuits with a gallium and indium eutectic
FR948074A FR1378154A (fr) 1962-09-24 1963-09-19 Interconnexions électriques pour panneaux de circuits imprimés

Publications (1)

Publication Number Publication Date
FR1378154A true FR1378154A (fr) 1964-11-13

Family

ID=26203467

Family Applications (1)

Application Number Title Priority Date Filing Date
FR948074A Expired FR1378154A (fr) 1962-09-24 1963-09-19 Interconnexions électriques pour panneaux de circuits imprimés

Country Status (1)

Country Link
FR (1) FR1378154A (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2218718A1 (en) * 1973-02-20 1974-09-13 Matsushita Electric Industrial Co Ltd Making electrical contacts - by plating bore of substrate internally
FR2463569A1 (fr) * 1979-08-09 1981-02-20 Schering Ag Procede de production de circuits imprimes
WO1983003944A1 (fr) * 1982-05-05 1983-11-10 Hughes Aircraft Company Plaque de connexions imprimees de haute densite
US4591411A (en) * 1982-05-05 1986-05-27 Hughes Aircraft Company Method for forming a high density printed wiring board
EP0144944A3 (en) * 1983-12-05 1986-10-22 E.I. Du Pont De Nemours And Company Process for forming conductive through-holes through a dielectric layer
EP0146061A3 (en) * 1983-12-05 1986-10-22 E.I. Du Pont De Nemours And Company Liquid chemical process for forming conductive through-holes through a dielectric layer
US4663497A (en) * 1982-05-05 1987-05-05 Hughes Aircraft Company High density printed wiring board

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2218718A1 (en) * 1973-02-20 1974-09-13 Matsushita Electric Industrial Co Ltd Making electrical contacts - by plating bore of substrate internally
FR2463569A1 (fr) * 1979-08-09 1981-02-20 Schering Ag Procede de production de circuits imprimes
WO1983003944A1 (fr) * 1982-05-05 1983-11-10 Hughes Aircraft Company Plaque de connexions imprimees de haute densite
US4591411A (en) * 1982-05-05 1986-05-27 Hughes Aircraft Company Method for forming a high density printed wiring board
US4663497A (en) * 1982-05-05 1987-05-05 Hughes Aircraft Company High density printed wiring board
EP0144944A3 (en) * 1983-12-05 1986-10-22 E.I. Du Pont De Nemours And Company Process for forming conductive through-holes through a dielectric layer
EP0146061A3 (en) * 1983-12-05 1986-10-22 E.I. Du Pont De Nemours And Company Liquid chemical process for forming conductive through-holes through a dielectric layer

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