FR1292871A - Method for shaping semiconductor crystals - Google Patents
Method for shaping semiconductor crystalsInfo
- Publication number
- FR1292871A FR1292871A FR866070A FR866070A FR1292871A FR 1292871 A FR1292871 A FR 1292871A FR 866070 A FR866070 A FR 866070A FR 866070 A FR866070 A FR 866070A FR 1292871 A FR1292871 A FR 1292871A
- Authority
- FR
- France
- Prior art keywords
- semiconductor crystals
- shaping semiconductor
- shaping
- crystals
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
- H10D48/01—Manufacture or treatment
- H10D48/07—Manufacture or treatment of devices having bodies comprising cuprous oxide [Cu2O] or cuprous iodide [CuI]
- H10D48/078—Treatment of the complete device, e.g. electroforming or ageing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
- B24C1/04—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass
- B24C1/045—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass for cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C3/00—Abrasive blasting machines or devices; Plants
- B24C3/32—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks
- B24C3/322—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks for electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F3/00—Severing by means other than cutting; Apparatus therefor
- B26F3/004—Severing by means other than cutting; Apparatus therefor by means of a fluid jet
-
- H10P50/242—
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR866070A FR1292871A (en) | 1960-06-27 | 1961-06-26 | Method for shaping semiconductor crystals |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES69133A DE1151162B (en) | 1960-06-27 | 1960-06-27 | Process for the shaping processing, in particular for cutting, of semiconductor crystals by chemical means |
| FR866070A FR1292871A (en) | 1960-06-27 | 1961-06-26 | Method for shaping semiconductor crystals |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR1292871A true FR1292871A (en) | 1962-05-04 |
Family
ID=25996129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR866070A Expired FR1292871A (en) | 1960-06-27 | 1961-06-26 | Method for shaping semiconductor crystals |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR1292871A (en) |
-
1961
- 1961-06-26 FR FR866070A patent/FR1292871A/en not_active Expired
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