FI981032L - Lämmitysmenetelmä ja piirilevy - Google Patents

Lämmitysmenetelmä ja piirilevy Download PDF

Info

Publication number: FI981032L
Authority: FI; Finland
Prior art keywords: circuit board; heating method; heating; board; circuit
Prior art date: 1998-05-08

Application number

FI981032A

Other languages

English (en)

Swedish (sv)

Other versions

FI981032A0 (fi

FI981032A7 (fi

Inventor

Arto Isokoski

Jari Marjakangas

Original Assignee

Nokia Networks Oy

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1998-05-08

Filing date

1998-05-08

Publication date

1999-11-09

1998-05-08 Application filed by Nokia Networks Oy filed Critical Nokia Networks Oy

1998-05-08 Priority to FI981032A priority Critical patent/FI981032A7/fi

1998-05-08 Publication of FI981032A0 publication Critical patent/FI981032A0/fi

1999-05-04 Priority to AU39345/99A priority patent/AU3934599A/en

1999-05-04 Priority to PCT/FI1999/000373 priority patent/WO1999059387A1/en

1999-05-04 Priority to CN99800709.9A priority patent/CN1269120A/zh

1999-05-04 Priority to JP2000549076A priority patent/JP2002515654A/ja

1999-05-04 Priority to EP99922215A priority patent/EP0995346A1/en

1999-11-09 Publication of FI981032L publication Critical patent/FI981032L/fi

1999-11-09 Publication of FI981032A7 publication Critical patent/FI981032A7/fi

2000-01-06 Priority to US09/478,584 priority patent/US6184494B1/en

2000-01-07 Priority to NO20000081A priority patent/NO20000081D0/no

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0212—Printed circuits or mounted components having integral heating means
- H10W40/10—
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/062—Means for thermal insulation, e.g. for protection of parts
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09645—Patterning on via walls; Plural lands around one hole
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0969—Apertured conductors
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09772—Conductors directly under a component but not electrically connected to the component
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Structure Of Printed Boards (AREA)
Cooling Or The Like Of Electrical Apparatus (AREA)

FI981032A 1998-05-08 1998-05-08 Lämmitysmenetelmä ja piirilevy FI981032A7 (fi)

Priority Applications (8)

Application Number	Priority Date	Filing Date	Title
FI981032A FI981032A7 (fi)	1998-05-08	1998-05-08	Lämmitysmenetelmä ja piirilevy
AU39345/99A AU3934599A (en)	1998-05-08	1999-05-04	A heating method for a printed circuit board and a printed circuit board comprising a heating element
PCT/FI1999/000373 WO1999059387A1 (en)	1998-05-08	1999-05-04	A heating method for a printed circuit board and a printed circuit board comprising a heating element
CN99800709.9A CN1269120A (zh)	1998-05-08	1999-05-04	印刷电路板用的加热方法及包括加热元件的印刷电路板
JP2000549076A JP2002515654A (ja)	1998-05-08	1999-05-04	プリント回路板の加熱方法及び加熱素子を含むプリント回路板
EP99922215A EP0995346A1 (en)	1998-05-08	1999-05-04	A heating method for a printed circuit board and a printed circuit board comprising a heating element
US09/478,584 US6184494B1 (en)	1998-05-08	2000-01-06	Printed circuit board having a heating element and heating method thereof
NO20000081A NO20000081D0 (no)	1998-05-08	2000-01-07	Fremgangsmåte for oppvarming av et trykt kretskort, samt trykt kretskort som omfatter et varmeelement

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
FI981032A FI981032A7 (fi)	1998-05-08	1998-05-08	Lämmitysmenetelmä ja piirilevy

Publications (3)

Publication Number	Publication Date
FI981032A0 FI981032A0 (fi)	1998-05-08
FI981032L true FI981032L (fi)	1999-11-09
FI981032A7 FI981032A7 (fi)	1999-11-09

Family

ID=8551687

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
FI981032A FI981032A7 (fi)	1998-05-08	1998-05-08	Lämmitysmenetelmä ja piirilevy

Country Status (8)

Country	Link
US (1)	US6184494B1 (fi)
EP (1)	EP0995346A1 (fi)
JP (1)	JP2002515654A (fi)
CN (1)	CN1269120A (fi)
AU (1)	AU3934599A (fi)
FI (1)	FI981032A7 (fi)
NO (1)	NO20000081D0 (fi)
WO (1)	WO1999059387A1 (fi)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US6082358A (en) *	1998-05-05	2000-07-04	1263152 Ontario Inc.	Indicating device for aerosol container
JP2001185881A (ja) *	1999-12-22	2001-07-06	Nec Saitama Ltd	内部温度制御装置および内部温度制御方法
US6423939B1 (en) *	2000-10-02	2002-07-23	Agilent Technologies, Inc.	Micro soldering method and apparatus
WO2002054489A2 (en) *	2000-12-29	2002-07-11	Advanced Micro Devices, Inc.	Temperature measurement system and method
US6423940B1 (en) *	2001-03-02	2002-07-23	Agilent Technologies, Inc.	Temperature stabilization scheme for a circuit board
EP1876608A3 (en) *	2001-09-10	2008-04-16	Microbridge Technologies Inc.	Method for effective trimming of resistors using pulsed heating
ATE371936T1 (de) *	2001-09-10	2007-09-15	Microbridge Technologies Inc	Verfahren zum effektiven trimmen von widerständen durch wärmepulse
US6911624B2 (en) *	2002-08-23	2005-06-28	Micron Technology, Inc.	Component installation, removal, and replacement apparatus and method
CN100382666C (zh) *	2003-12-24	2008-04-16	华为技术有限公司	一种加热系统
DE202005001163U1 (de) *	2005-01-24	2005-03-31	Juma Leiterplattentechologie M	Leiterplatte oder Platine mit Heizdraht
CN101227808B (zh) *	2007-01-15	2011-05-18	研华股份有限公司	电路板的加热模块
FR2912029B1 (fr) *	2007-01-31	2010-10-22	Hispano Suiza Sa	Carte electronique incorporant une resistance chauffante.
US9012811B2 (en) *	2012-01-13	2015-04-21	Viasystems Technologies Corp. L.L.C.	Printed circuit board with embedded heater
US20130270255A1 (en) *	2012-04-17	2013-10-17	Gerald Ho Kim	Silicon-Based Cooling Package With Preheating Capability For Compact Heat-Generating Devices
US8981259B2 (en)	2012-07-24	2015-03-17	Mildef Crete Inc.	Heating apparatus for heating electronic components on a printed circuit board in low temperature environment
EP2693851A1 (en) *	2012-07-30	2014-02-05	Mildef Crete Inc.	Heating apparatus for heating electronic components on a printed circuit board in low temperature environment
FR3037672B1 (fr) *	2015-06-16	2017-06-16	Parrot	Drone comportant des moyens perfectionnes de compensation du biais de la centrale inertielle en fonction de la temperature
US10306776B1 (en)	2017-11-29	2019-05-28	Lam Research Corporation	Substrate processing system printed-circuit control board assembly with one or more heater layers

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3440407A (en) *	1966-12-29	1969-04-22	Rca Corp	Temperature controlled circuit boards
GB2038102B (en) *	1978-12-20	1982-12-15	Ferranti Ltd	Circuit board temperature controller
JPS5635383A (en) *	1979-08-29	1981-04-08	Kyoto Ceramic	Semiconductor integrated circuit support with heating mechanism
US4582975A (en) *	1983-04-04	1986-04-15	Honeywell Inc.	Circuit chip
JPH01143164A (ja) *	1987-11-27	1989-06-05	Ibiden Co Ltd	表面実装用プリント配線板
JPH04206480A (ja) *	1990-11-30	1992-07-28	Hitachi Chem Co Ltd	表面回路付印刷配線板における表面実装用端子
US5466484A (en) *	1993-09-29	1995-11-14	Motorola, Inc.	Resistor structure and method of setting a resistance value
GB9508631D0 (en) *	1995-04-28	1995-06-14	Smiths Industries Ltd	Electrical circuits
FI965301L (fi) *	1996-12-31	1998-07-01	Nokia Telecommunications Oy	Menetelmä ja järjestely komponentin lämmittämiseksi

1998
- 1998-05-08 FI FI981032A patent/FI981032A7/fi unknown
1999
- 1999-05-04 JP JP2000549076A patent/JP2002515654A/ja active Pending
- 1999-05-04 AU AU39345/99A patent/AU3934599A/en not_active Abandoned
- 1999-05-04 EP EP99922215A patent/EP0995346A1/en not_active Withdrawn
- 1999-05-04 CN CN99800709.9A patent/CN1269120A/zh active Pending
- 1999-05-04 WO PCT/FI1999/000373 patent/WO1999059387A1/en not_active Ceased
2000
- 2000-01-06 US US09/478,584 patent/US6184494B1/en not_active Expired - Fee Related
- 2000-01-07 NO NO20000081A patent/NO20000081D0/no not_active Application Discontinuation

Also Published As

Publication number	Publication date
NO20000081L (no)	2000-01-07
JP2002515654A (ja)	2002-05-28
AU3934599A (en)	1999-11-29
NO20000081D0 (no)	2000-01-07
FI981032A0 (fi)	1998-05-08
FI981032A7 (fi)	1999-11-09
US6184494B1 (en)	2001-02-06
CN1269120A (zh)	2000-10-04
WO1999059387A1 (en)	1999-11-18
EP0995346A1 (en)	2000-04-26

Publication	Publication Date	Title
DE69942468D1 (de)	2010-07-15	Leiterplatte und Herstellungsverfahren dafür
DE69919138D1 (de)	2004-09-09	Electronischer dimmer
DE69812570T2 (de)	2004-01-29	Gerät mit Leiterplatte und dessen Zusammenbauverfahren
DE69936483D1 (de)	2007-08-23	Laminierte Leiterplatte und Herstellungsverfahren
SG86345A1 (en)	2002-02-19	Circuit board and method of manufacturing the same
DE69530133T2 (de)	2004-01-29	Hochfrequenz-Schaltungselement
BR9504582A (pt)	1997-10-07	Estrutura laminar empilhável para placas de circuitos dotada de capacitânia placas circuitos dotada de capacitânia e método para confeccioná-las
DE69913621D1 (de)	2004-01-29	Elektronisches vorschaltgerät
DE69716698D1 (de)	2002-12-05	Elektronisches vorschaltgerät
FI981032L (fi)	1999-11-09	Lämmitysmenetelmä ja piirilevy
DE69830987D1 (de)	2005-09-01	Elektronisches bauelement
DE69814322D1 (de)	2003-06-12	Verbinder für eine gedruckte Leiterplatte und Herstellungsverfahren dafür
DE69705119D1 (de)	2001-07-12	Schaltungsplatte
GB9820932D0 (en)	1998-11-18	Circuit board and connection method
DE69942467D1 (de)	2010-07-15	Leiterplatte und Herstellungsverfahren dafür
DE69707677D1 (de)	2001-11-29	Verzögerungsschaltung und -verfahren
ATA68094A (de)	1996-06-15	Schaltungsträger
DE69937428D1 (de)	2007-12-13	Gleichtaktrückkopplungsschaltung und Verfahren
DE69808362D1 (de)	2002-11-07	Multiplizierverfahren und Multiplizierschaltung
KR970053035U (ko)	1997-09-08	전자 제어 장치
DE69636329D1 (de)	2006-08-17	Merschichtige gedruckte leiterplatte
ATA3997A (de)	2000-02-15	Umlaufwasserheizer
DE69828217D1 (de)	2005-01-27	Hochfrequenz-Schaltungselement
DE59911608D1 (de)	2005-03-17	Elektronisches steuergerät
DE69903035D1 (de)	2002-10-24	Erwärmungsverfahren