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FI971881A7 - Method for installing a heat sink and a heat sink - Google Patents

Method for installing a heat sink and a heat sink Download PDF

Info

Publication number
FI971881A7
FI971881A7 FI971881A FI971881A FI971881A7 FI 971881 A7 FI971881 A7 FI 971881A7 FI 971881 A FI971881 A FI 971881A FI 971881 A FI971881 A FI 971881A FI 971881 A7 FI971881 A7 FI 971881A7
Authority
FI
Finland
Prior art keywords
heat sink
installing
sink
heat
Prior art date
Application number
FI971881A
Other languages
Finnish (fi)
Swedish (sv)
Other versions
FI971881A0 (en
FI971881L (en
Inventor
Tapio Tuomainen
Gösta Baarman
Seppo Pelkonen
Original Assignee
Nokia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Corp filed Critical Nokia Corp
Priority to FI971881A priority Critical patent/FI971881L/en
Publication of FI971881A0 publication Critical patent/FI971881A0/en
Priority to AU70481/98A priority patent/AU7048198A/en
Priority to PCT/FI1998/000374 priority patent/WO1998051137A1/en
Publication of FI971881A7 publication Critical patent/FI971881A7/en
Publication of FI971881L publication Critical patent/FI971881L/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H10W40/226—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10204—Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FI971881A 1997-05-02 1997-05-02 Method for installing a heat sink and heat sink FI971881L (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FI971881A FI971881L (en) 1997-05-02 1997-05-02 Method for installing a heat sink and heat sink
AU70481/98A AU7048198A (en) 1997-05-02 1998-04-30 Method for mounting a cooling element on an apparatus and such a cooling element
PCT/FI1998/000374 WO1998051137A1 (en) 1997-05-02 1998-04-30 Method for mounting a cooling element on an apparatus and such a cooling element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI971881A FI971881L (en) 1997-05-02 1997-05-02 Method for installing a heat sink and heat sink

Publications (3)

Publication Number Publication Date
FI971881A0 FI971881A0 (en) 1997-05-02
FI971881A7 true FI971881A7 (en) 1998-11-03
FI971881L FI971881L (en) 1998-11-03

Family

ID=8548777

Family Applications (1)

Application Number Title Priority Date Filing Date
FI971881A FI971881L (en) 1997-05-02 1997-05-02 Method for installing a heat sink and heat sink

Country Status (3)

Country Link
AU (1) AU7048198A (en)
FI (1) FI971881L (en)
WO (1) WO1998051137A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10246577A1 (en) * 2002-10-05 2004-04-15 Hella Kg Hueck & Co. Circuit board with metal housing, e.g. for motor vehicle control circuit, has spring member for making contact between circuit board or power semiconductor device and metal housing for heat removal
US8804337B2 (en) * 2012-03-26 2014-08-12 Hamilton Sundstrand Space Systems International, Inc. Structural assembly for cold plate cooling

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3972062A (en) * 1973-10-04 1976-07-27 Motorola, Inc. Mounting assemblies for a plurality of transistor integrated circuit chips
US5365399A (en) * 1992-08-03 1994-11-15 Motorola, Inc. Heat sinking apparatus for surface mountable power devices

Also Published As

Publication number Publication date
AU7048198A (en) 1998-11-27
FI971881A0 (en) 1997-05-02
WO1998051137A1 (en) 1998-11-12
FI971881L (en) 1998-11-03

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