[go: up one dir, main page]

FI964115L - Elektroninen komponentti ja sen valmistusmenetelmä - Google Patents

Elektroninen komponentti ja sen valmistusmenetelmä Download PDF

Info

Publication number
FI964115L
FI964115L FI964115A FI964115A FI964115L FI 964115 L FI964115 L FI 964115L FI 964115 A FI964115 A FI 964115A FI 964115 A FI964115 A FI 964115A FI 964115 L FI964115 L FI 964115L
Authority
FI
Finland
Prior art keywords
manufacturing
electronic component
electronic
component
Prior art date
Application number
FI964115A
Other languages
English (en)
Swedish (sv)
Other versions
FI964115A0 (fi
FI964115A7 (fi
Inventor
Wilfried Laun
Peter Radvan
Christian Haelsig
Original Assignee
Tele Filter Tft Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tele Filter Tft Gmbh filed Critical Tele Filter Tft Gmbh
Publication of FI964115A0 publication Critical patent/FI964115A0/fi
Publication of FI964115L publication Critical patent/FI964115L/fi
Publication of FI964115A7 publication Critical patent/FI964115A7/fi

Links

Classifications

    • H10W42/20—
    • H10W72/30—
    • H10W70/682—
    • H10W72/073—
    • H10W72/07339—
    • H10W72/884—
    • H10W90/734—
    • H10W90/754—
FI964115A 1994-04-15 1995-04-13 Elektroninen komponentti ja sen valmistusmenetelmä FI964115A7 (fi)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4413529A DE4413529C2 (de) 1994-04-15 1994-04-15 Verfahren zur Herstellung elektronischer Oberflächenwellenbauelemente sowie ein nach dem Verfahren hergestelltes elektronisches Bauelement
PCT/DE1995/000511 WO1995028739A1 (de) 1994-04-15 1995-04-13 Elektronisches bauelement und verfahren zu seiner herstellung

Publications (3)

Publication Number Publication Date
FI964115A0 FI964115A0 (fi) 1996-10-14
FI964115L true FI964115L (fi) 1996-12-13
FI964115A7 FI964115A7 (fi) 1996-12-13

Family

ID=6515837

Family Applications (1)

Application Number Title Priority Date Filing Date
FI964115A FI964115A7 (fi) 1994-04-15 1995-04-13 Elektroninen komponentti ja sen valmistusmenetelmä

Country Status (6)

Country Link
EP (1) EP0755573A1 (fi)
AU (1) AU2254195A (fi)
DE (1) DE4413529C2 (fi)
FI (1) FI964115A7 (fi)
NO (1) NO964367L (fi)
WO (1) WO1995028739A1 (fi)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6180261B1 (en) 1997-10-21 2001-01-30 Nitto Denko Corporation Low thermal expansion circuit board and multilayer wiring circuit board

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US515942A (en) * 1894-03-06 scates
EP0051165A1 (en) * 1980-11-03 1982-05-12 BURROUGHS CORPORATION (a Michigan corporation) Repairable IC package with thermoplastic chip attach
US4346124A (en) * 1981-05-04 1982-08-24 Laurier Associates, Inc. Method of applying an adhesive to a circuit chip
CA1222071A (en) * 1984-01-30 1987-05-19 Joseph A. Aurichio Conductive die attach tape
US4624724A (en) * 1985-01-17 1986-11-25 General Electric Company Method of making integrated circuit silicon die composite having hot melt adhesive on its silicon base
US4908086A (en) * 1985-06-24 1990-03-13 National Semiconductor Corporation Low-cost semiconductor device package process
DE3907261C2 (de) * 1989-03-07 2001-04-05 Nematel Dr Rudolf Eidenschink Klebstoff
US5212115A (en) * 1991-03-04 1993-05-18 Motorola, Inc. Method for microelectronic device packaging employing capacitively coupled connections

Also Published As

Publication number Publication date
EP0755573A1 (de) 1997-01-29
AU2254195A (en) 1995-11-10
NO964367D0 (no) 1996-10-14
WO1995028739A1 (de) 1995-10-26
FI964115A0 (fi) 1996-10-14
NO964367L (no) 1996-10-14
FI964115A7 (fi) 1996-12-13
DE4413529C2 (de) 1996-07-25
DE4413529A1 (de) 1995-10-19

Similar Documents

Publication Publication Date Title
KR960015789A (ko) 전자부품과 그 제조방법
DE69718693D1 (de) Elektronisches Bauteil und Herstellungsverfahren
DE69840246D1 (de) Elektronisches Bauteil und Herstellungsverfahren
FI951340A7 (fi) SOI-substraatti ja menetelmä sen valmistamiseksi
KR960705068A (ko) 복합재와 그의 제조방법
FI962544L (fi) Lattakaapeli ja menetelmä sen valmistamiseksi
KR960012578A (ko) 표시 장치 및 그 제조 방법
KR950034612A (ko) 반도체 구조물 및 그 제조 방법
FI952616L (fi) Työkalu ja menetelmä sen valmistamiseksi
KR960008149A (ko) 유체봉입식엔진마운트 및 그 제조방법
FI941951L (fi) Sirutyyppinen piirikomponentti ja menetelmä sen valmistamiseksi
FI981731A0 (fi) Optoelektroninen komponentti ja valmistusmenetelmä
KR960012601A (ko) 원-직선편파변환기 및 그의 제조방법
FI955912A7 (fi) Elektroluminesenssivärilaite ja menetelmä sen valmistamiseksi
FI942014A0 (fi) Rakenneosa ja sen valmistusmenetelmä
FI953550L (fi) Komposiittimetallilevy ja menetelmä sen valmistamiseksi
KR960009144A (ko) 리드프레임과 그 제조방법
DE69536130D1 (de) Halbleiterbauelement und dessen Herstellungsverfahren
FI914475A7 (fi) Kolmiulotteinen elektroninen laite ja menetelmä sen valmistamiseksi
FI921936A0 (fi) Menetelmä elementtirakenteen valmistamiseksi ja elementtirakenne
FI943212L (fi) Hirsielementti ja menetelmä sen valmistamiseksi
FI964115L (fi) Elektroninen komponentti ja sen valmistusmenetelmä
DE69314158D1 (de) Elektronisches bauelement und dessen herstellungsverfahren
KR960013698A (ko) 장식판 및 이의 제조방법
KR970004980A (ko) 회로기판 및 그 제조방법

Legal Events

Date Code Title Description
FD Application lapsed