[go: up one dir, main page]

FI954922L - Manufacturing method and contact bump structure for dense surface connections of semiconductor chips - Google Patents

Manufacturing method and contact bump structure for dense surface connections of semiconductor chips Download PDF

Info

Publication number
FI954922L
FI954922L FI954922A FI954922A FI954922L FI 954922 L FI954922 L FI 954922L FI 954922 A FI954922 A FI 954922A FI 954922 A FI954922 A FI 954922A FI 954922 L FI954922 L FI 954922L
Authority
FI
Finland
Prior art keywords
bump structure
manufacturing
semiconductor chips
contact bump
dense surface
Prior art date
Application number
FI954922A
Other languages
Finnish (fi)
Swedish (sv)
Other versions
FI954922A7 (en
FI954922A0 (en
Inventor
Ahti Aintila
Original Assignee
Picopak Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Picopak Oy filed Critical Picopak Oy
Priority to FI954922A priority Critical patent/FI954922L/en
Publication of FI954922A0 publication Critical patent/FI954922A0/en
Priority to PCT/FI1996/000536 priority patent/WO1997015070A2/en
Publication of FI954922A7 publication Critical patent/FI954922A7/en
Publication of FI954922L publication Critical patent/FI954922L/en

Links

Classifications

    • H10W72/20—
    • H10W70/093—
    • H10W72/012—
    • H10W90/701—
    • H10W72/251—
    • H10W72/952—

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)

Abstract

The invention relates to a method of forming contact bumps (4) onto metallic contact pad areas (2) on the surface of a substrate (1) and a contact bump structure made using the method. According to the invention, using an ALE process, onto the substrate (1) is formed an oxide passivation layer (5) which in the subsequent process step is opened at required points (4).
FI954922A 1995-10-16 1995-10-16 Manufacturing method and contact bump structure for dense surface connections of semiconductor chips FI954922L (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FI954922A FI954922L (en) 1995-10-16 1995-10-16 Manufacturing method and contact bump structure for dense surface connections of semiconductor chips
PCT/FI1996/000536 WO1997015070A2 (en) 1995-10-16 1996-10-10 Fabrication method and contact bump structure for high-density surface-mount connections of solid-state device chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI954922A FI954922L (en) 1995-10-16 1995-10-16 Manufacturing method and contact bump structure for dense surface connections of semiconductor chips

Publications (3)

Publication Number Publication Date
FI954922A0 FI954922A0 (en) 1995-10-16
FI954922A7 FI954922A7 (en) 1997-04-17
FI954922L true FI954922L (en) 1997-04-17

Family

ID=8544199

Family Applications (1)

Application Number Title Priority Date Filing Date
FI954922A FI954922L (en) 1995-10-16 1995-10-16 Manufacturing method and contact bump structure for dense surface connections of semiconductor chips

Country Status (2)

Country Link
FI (1) FI954922L (en)
WO (1) WO1997015070A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU785425B2 (en) 2001-03-30 2007-05-17 Genetic Technologies Limited Methods of genomic analysis
KR101423446B1 (en) 2003-05-16 2014-07-24 이 아이 듀폰 디 네모아 앤드 캄파니 Barrier films for plastic substrates fabricated by atomic layer deposition

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE393967B (en) * 1974-11-29 1977-05-31 Sateko Oy PROCEDURE AND PERFORMANCE OF LAYING BETWEEN THE STORAGE IN A LABOR PACKAGE
FI57975C (en) * 1979-02-28 1980-11-10 Lohja Ab Oy OVER ANCHORING VIDEO UPDATE FOR AVAILABILITY
US4389973A (en) * 1980-03-18 1983-06-28 Oy Lohja Ab Apparatus for performing growth of compound thin films
US5455459A (en) * 1992-03-27 1995-10-03 Martin Marietta Corporation Reconstructable interconnect structure for electronic circuits
FI946015A7 (en) * 1994-07-08 1996-01-09 Picopak Oy Electroless contact nodule formation method

Also Published As

Publication number Publication date
FI954922A7 (en) 1997-04-17
WO1997015070A3 (en) 1997-06-12
FI954922A0 (en) 1995-10-16
WO1997015070A2 (en) 1997-04-24

Similar Documents

Publication Publication Date Title
KR950004464A (en) Manufacturing method of chip bump
TW370695B (en) Semiconductor device and manufacturing method and testing method of the same
US5413964A (en) Photo-definable template for semiconductor chip alignment
TW330321B (en) Semiconductor chips suitable for improved die testing
WO1998030913A3 (en) A fiducial for aligning an integrated circuit die
TW340243B (en) Manufacturing method of semiconductor elements
EP0908938A3 (en) Buffer layer for improving control of layer thickness
GB2438788B (en) Structure and method for fabricating flip chip devices
US6025262A (en) Method of passivating semiconductor wafers
TW369710B (en) Semiconductor apparatus and its producing method
EP2849225A3 (en) System and method for providing a redistribution metal layer in an integrated circuit
FI954922L (en) Manufacturing method and contact bump structure for dense surface connections of semiconductor chips
EP0735576A3 (en) Integrated circuit fabrication
WO2005059957A3 (en) Metal interconnect system and method for direct die attachment
FI946015L (en) Electroless contact nodule formation method
TW336349B (en) Process for producing IC well construction
CA2280904A1 (en) Methods for forming a structured metallization on a semiconductor wafer
US20050136664A1 (en) Novel process for improved hot carrier injection
JPS57126132A (en) Manufacture of semiconductor device
JPH01122128A (en) Semiconductor device
SE8306663D0 (en) METHOD OF MANUFACTURE OF SEMICONDUCTOR DEVICE
KR950012654A (en) Manufacturing method of bonding pad of semiconductor device
KR100587031B1 (en) Wafer level package
JPS6469016A (en) Semiconductor device
JPS6413746A (en) Manufacture of semiconductor device