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FI890132L - Foerfarande foer framstaellning av en elektrisk ledar skiva. - Google Patents

Foerfarande foer framstaellning av en elektrisk ledar skiva. Download PDF

Info

Publication number
FI890132L
FI890132L FI890132A FI890132A FI890132L FI 890132 L FI890132 L FI 890132L FI 890132 A FI890132 A FI 890132A FI 890132 A FI890132 A FI 890132A FI 890132 L FI890132 L FI 890132L
Authority
FI
Finland
Prior art keywords
electrisk
ledar
skiva
foerfarande foer
foer framstaellning
Prior art date
Application number
FI890132A
Other languages
English (en)
Other versions
FI890132A0 (fi
FI890132A7 (fi
Inventor
Gerhard Dieter Wolf
Kirkor Sirinyan
Gizycki Ulrich Von
Rudolf Merten
Friedrich Langer
Original Assignee
Bayer Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bayer Ag filed Critical Bayer Ag
Publication of FI890132A0 publication Critical patent/FI890132A0/fi
Publication of FI890132L publication Critical patent/FI890132L/fi
Publication of FI890132A7 publication Critical patent/FI890132A7/fi

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
FI890132A 1988-01-13 1989-01-11 Menetelmä sähköjohdinlevyjen valmistamiseksi FI890132A7 (fi)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3800682A DE3800682A1 (de) 1988-01-13 1988-01-13 Verfahren zur herstellung von elektrischen leiterplatten

Publications (3)

Publication Number Publication Date
FI890132A0 FI890132A0 (fi) 1989-01-11
FI890132L true FI890132L (fi) 1989-07-14
FI890132A7 FI890132A7 (fi) 1989-07-14

Family

ID=6345144

Family Applications (1)

Application Number Title Priority Date Filing Date
FI890132A FI890132A7 (fi) 1988-01-13 1989-01-11 Menetelmä sähköjohdinlevyjen valmistamiseksi

Country Status (5)

Country Link
US (1) US4913768A (fi)
EP (1) EP0324189A3 (fi)
JP (1) JPH01225390A (fi)
DE (1) DE3800682A1 (fi)
FI (1) FI890132A7 (fi)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5182135A (en) * 1986-08-12 1993-01-26 Bayer Aktiengesellschaft Process for improving the adherency of metallic coatings deposited without current on plastic surfaces
JP2538043B2 (ja) * 1989-04-05 1996-09-25 松下電器産業株式会社 パタ―ン形成用材料とそれを用いたパタ―ン形成基板の作製方法
EP0460548A3 (en) * 1990-06-08 1993-03-24 Amp-Akzo Corporation Printed circuits and base materials precatalyzed for etal deposition
JPH04355990A (ja) * 1990-09-18 1992-12-09 Fujitsu Ltd 回路基板およびその製造方法
US5304284A (en) * 1991-10-18 1994-04-19 International Business Machines Corporation Methods for etching a less reactive material in the presence of a more reactive material
DE4238644C1 (de) * 1992-11-16 1993-12-16 Siemens Nixdorf Inf Syst Verfahren zum Behandeln von Leiterplatten bei Tauchvorgängen in chemischen Medien
JP3219897B2 (ja) * 1993-05-07 2001-10-15 イビデン株式会社 プリント配線板
DE69535768D1 (de) * 1994-12-01 2008-07-24 Ibiden Co Ltd Mehrschichtige leiterplatte und verfahren für deren herstellung
US6023842A (en) * 1996-09-24 2000-02-15 Macdermid, Incorporated Process for the manufacture of printed circuit boards
US6120639A (en) * 1997-11-17 2000-09-19 Macdermid, Incorporated Method for the manufacture of printed circuit boards
TW561802B (en) * 2001-09-26 2003-11-11 Triplex Electronic Co Ltd Printed circuit board and the manufacturing process thereof
US10183258B2 (en) * 2016-06-30 2019-01-22 L'air Liquide Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Metallopolyimide precursor fibers for aging-resistant carbon molecular sieve hollow fiber membranes with enhanced selectivity

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3306830A (en) * 1963-06-13 1967-02-28 Bell Telephone Labor Inc Printed circuit boards and their fabrication
US3620933A (en) * 1969-12-31 1971-11-16 Macdermid Inc Forming plastic parts having surfaces receptive to adherent coatings
US3959523A (en) * 1973-12-14 1976-05-25 Macdermid Incorporated Additive printed circuit boards and method of manufacture
JPS5471371A (en) * 1977-11-18 1979-06-07 Tokyo Shibaura Electric Co Preparation of printing plug board
US4260449A (en) * 1977-12-22 1981-04-07 Gould Inc. Method of forming a printed circuit
DE2920940A1 (de) * 1979-05-21 1980-12-04 Schering Ag Verfahren zur herstellung von gedruckten schaltungen
US4582564A (en) * 1982-01-04 1986-04-15 At&T Technologies, Inc. Method of providing an adherent metal coating on an epoxy surface
US4512829A (en) * 1983-04-07 1985-04-23 Satosen Co., Ltd. Process for producing printed circuit boards
DE3510201A1 (de) * 1985-03-21 1986-09-25 Bayer Ag, 5090 Leverkusen Elektrische leiterplatten
DE3510202A1 (de) * 1985-03-21 1986-09-25 Bayer Ag, 5090 Leverkusen Elektrische leiterplatten
US4820547A (en) * 1987-04-24 1989-04-11 Surface Technology, Inc. Activators for colloidal catalysts in electroless plating processes

Also Published As

Publication number Publication date
JPH01225390A (ja) 1989-09-08
EP0324189A3 (de) 1990-03-07
US4913768A (en) 1990-04-03
EP0324189A2 (de) 1989-07-19
FI890132A0 (fi) 1989-01-11
DE3800682A1 (de) 1989-07-27
FI890132A7 (fi) 1989-07-14

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Legal Events

Date Code Title Description
FA Application withdrawn [patent]

Owner name: BAYER AKTIENGESELLSCHAFT