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FI20145454A7 - Menetelmä MEMS-rakenteen valmistamiseksi ja menetelmän käyttö - Google Patents

Menetelmä MEMS-rakenteen valmistamiseksi ja menetelmän käyttö

Info

Publication number
FI20145454A7
FI20145454A7 FI20145454A FI20145454A FI20145454A7 FI 20145454 A7 FI20145454 A7 FI 20145454A7 FI 20145454 A FI20145454 A FI 20145454A FI 20145454 A FI20145454 A FI 20145454A FI 20145454 A7 FI20145454 A7 FI 20145454A7
Authority
FI
Finland
Prior art keywords
manufacturing
mems structure
mems
Prior art date
Application number
FI20145454A
Other languages
English (en)
Swedish (sv)
Other versions
FI127168B (fi
Inventor
Altti Torkkeli
Original Assignee
Murata Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co filed Critical Murata Manufacturing Co
Priority to FI20145454A priority Critical patent/FI127168B/fi
Priority to US14/706,095 priority patent/US9556021B2/en
Priority to PCT/IB2015/053480 priority patent/WO2015177681A1/en
Priority to EP15727469.7A priority patent/EP3145857B1/en
Priority to US14/712,987 priority patent/US9334160B2/en
Priority to EP15729235.0A priority patent/EP3145858B1/en
Priority to PCT/IB2015/053580 priority patent/WO2015177694A1/en
Priority to TW104115337A priority patent/TWI628138B/zh
Priority to TW104115724A priority patent/TWI612010B/zh
Publication of FI20145454A7 publication Critical patent/FI20145454A7/fi
Application granted granted Critical
Publication of FI127168B publication Critical patent/FI127168B/fi

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00388—Etch mask forming
    • B81C1/00412—Mask characterised by its behaviour during the etching process, e.g. soluble masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00349—Creating layers of material on a substrate
    • B81C1/00373—Selective deposition, e.g. printing or microcontact printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00388—Etch mask forming
    • B81C1/00396—Mask characterised by its composition, e.g. multilayer masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00388—Etch mask forming
    • B81C1/00404—Mask characterised by its size, orientation or shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00523—Etching material
    • B81C1/00531—Dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00555—Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity
    • B81C1/00611—Processes for the planarisation of structures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5642—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating bars or beams
    • G01C19/5656—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating bars or beams the devices involving a micromechanical structure
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5642—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating bars or beams
    • G01C19/5663—Manufacturing; Trimming; Mounting; Housings

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
  • Gyroscopes (AREA)
FI20145454A 2014-05-20 2014-05-20 Menetelmä MEMS-rakenteen valmistamiseksi ja menetelmän käyttö FI127168B (fi)

Priority Applications (9)

Application Number Priority Date Filing Date Title
FI20145454A FI127168B (fi) 2014-05-20 2014-05-20 Menetelmä MEMS-rakenteen valmistamiseksi ja menetelmän käyttö
US14/706,095 US9556021B2 (en) 2014-05-20 2015-05-07 Method of manufacturing a MEMS structure and use of the method
EP15727469.7A EP3145857B1 (en) 2014-05-20 2015-05-12 Method of manufacturing a mems structure and use of the method
PCT/IB2015/053480 WO2015177681A1 (en) 2014-05-20 2015-05-12 Method of manufacturing a mems structure and use of the method
US14/712,987 US9334160B2 (en) 2014-05-20 2015-05-15 Method of manufacturing a MEMS structure
EP15729235.0A EP3145858B1 (en) 2014-05-20 2015-05-15 Method of manufacturing a mems structure
PCT/IB2015/053580 WO2015177694A1 (en) 2014-05-20 2015-05-15 Method of manufacturing a mems structure
TW104115337A TWI628138B (zh) 2014-05-20 2015-05-15 一種製造一微機電系統結構的方法
TW104115724A TWI612010B (zh) 2014-05-20 2015-05-18 製造微機電系統結構的方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20145454A FI127168B (fi) 2014-05-20 2014-05-20 Menetelmä MEMS-rakenteen valmistamiseksi ja menetelmän käyttö

Publications (2)

Publication Number Publication Date
FI20145454A7 true FI20145454A7 (fi) 2015-11-21
FI127168B FI127168B (fi) 2017-12-29

Family

ID=53298567

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20145454A FI127168B (fi) 2014-05-20 2014-05-20 Menetelmä MEMS-rakenteen valmistamiseksi ja menetelmän käyttö

Country Status (5)

Country Link
US (2) US9556021B2 (fi)
EP (2) EP3145857B1 (fi)
FI (1) FI127168B (fi)
TW (2) TWI628138B (fi)
WO (2) WO2015177681A1 (fi)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105445495B (zh) * 2014-07-16 2018-11-02 中国科学院地质与地球物理研究所 一种对称的mems加速度敏感芯片及其制造工艺
CN106672896B (zh) * 2017-01-12 2017-11-07 广东工业大学 一种任意三维微结构的加工方法
US10807863B2 (en) 2017-05-30 2020-10-20 Murata Manufacturing Co., Ltd. Method for manufacturing micromechanical structures in a device wafer
EP3656733A1 (en) * 2018-11-23 2020-05-27 Murata Manufacturing Co., Ltd. Method for etching recessed structures
JP2020122740A (ja) * 2019-01-31 2020-08-13 セイコーエプソン株式会社 構造体形成方法およびデバイス
CN110161282B (zh) * 2019-05-22 2021-03-30 龙微科技无锡有限公司 基于son结构的压阻式加速度传感器的制作方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5045898A (en) * 1988-08-30 1991-09-03 At&T Bell Laboratories CMOS integrated circuit having improved isolation
US5919548A (en) * 1996-10-11 1999-07-06 Sandia Corporation Chemical-mechanical polishing of recessed microelectromechanical devices
US6811853B1 (en) 2000-03-06 2004-11-02 Shipley Company, L.L.C. Single mask lithographic process for patterning multiple types of surface features
US6627096B2 (en) * 2000-05-02 2003-09-30 Shipley Company, L.L.C. Single mask technique for making positive and negative micromachined features on a substrate
KR100373739B1 (ko) 2001-05-07 2003-02-26 조동일 단결정 실리콘 웨이퍼 한 장를 이용한 정전형 수직구동기의 제조 방법
TW521062B (en) 2002-03-05 2003-02-21 Walsin Lihwa Corp Corner compensation method and structure constructed by the same
TWI234819B (en) 2003-05-06 2005-06-21 Walsin Lihwa Corp Selective etch method for side wall protection and structure formed using the method
KR100574465B1 (ko) 2004-05-21 2006-04-27 삼성전자주식회사 수직 단차 구조물의 제작 방법
US7449355B2 (en) 2005-04-27 2008-11-11 Robert Bosch Gmbh Anti-stiction technique for electromechanical systems and electromechanical device employing same
JP2007219303A (ja) 2006-02-17 2007-08-30 Hitachi Ltd マイクロレンズ用型の製造方法
EP2098822B8 (en) 2008-03-05 2015-08-12 Colibrys S.A. Vibrating gyroscope with quadrature signals reduction
US8043973B2 (en) 2008-05-22 2011-10-25 Texas Instruments Incorporated Mask overhang reduction or elimination after substrate etch
WO2011148973A1 (ja) 2010-05-25 2011-12-01 ローム株式会社 圧力センサおよび圧力センサの製造方法
US7998776B1 (en) 2010-06-10 2011-08-16 Memsensing Microsystems Technology Co., Ltd. Methods for manufacturing MEMS sensor and thin film thereof with improved etching process
CN201828268U (zh) * 2010-09-28 2011-05-11 深迪半导体(上海)有限公司 一种超小型mems陀螺仪传感器
US8394718B1 (en) 2011-09-12 2013-03-12 International Business Machines Corporation Methods of forming self-aligned through silicon via
TW201322366A (zh) 2011-11-18 2013-06-01 王傳蔚 感測器製程
CN102602881B (zh) 2012-04-01 2014-04-09 杭州士兰集成电路有限公司 Mems封帽硅片的多硅槽形成方法及其刻蚀掩膜结构
US8673765B2 (en) * 2012-06-01 2014-03-18 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for back end of line semiconductor device processing

Also Published As

Publication number Publication date
EP3145857A1 (en) 2017-03-29
WO2015177694A1 (en) 2015-11-26
US20150336794A1 (en) 2015-11-26
EP3145858A1 (en) 2017-03-29
TWI612010B (zh) 2018-01-21
FI127168B (fi) 2017-12-29
WO2015177681A1 (en) 2015-11-26
TWI628138B (zh) 2018-07-01
US20150336793A1 (en) 2015-11-26
TW201604123A (zh) 2016-02-01
TW201609522A (zh) 2016-03-16
EP3145858B1 (en) 2019-03-27
US9334160B2 (en) 2016-05-10
US9556021B2 (en) 2017-01-31
EP3145857B1 (en) 2018-08-29

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