FI20125740L - Liitin - Google Patents
Liitin Download PDFInfo
- Publication number
- FI20125740L FI20125740L FI20125740A FI20125740A FI20125740L FI 20125740 L FI20125740 L FI 20125740L FI 20125740 A FI20125740 A FI 20125740A FI 20125740 A FI20125740 A FI 20125740A FI 20125740 L FI20125740 L FI 20125740L
- Authority
- FI
- Finland
- Prior art keywords
- coupling
- Prior art date
Links
- 230000008878 coupling Effects 0.000 title 1
- 238000010168 coupling process Methods 0.000 title 1
- 238000005859 coupling reaction Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
- H01R4/028—Soldered or welded connections comprising means for preventing flowing or wicking of solder or flux in parts not desired
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011146352 | 2011-06-30 | ||
| JP2011146352A JP5479406B2 (ja) | 2011-06-30 | 2011-06-30 | コネクタ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FI20125740L true FI20125740L (fi) | 2012-12-31 |
| FI124395B FI124395B (fi) | 2014-08-15 |
Family
ID=47391102
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FI20125740A FI124395B (fi) | 2011-06-30 | 2012-06-28 | Liitin |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8727810B2 (fi) |
| JP (1) | JP5479406B2 (fi) |
| CN (1) | CN102856696A (fi) |
| FI (1) | FI124395B (fi) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5917422B2 (ja) | 2013-01-30 | 2016-05-11 | 住友重機械工業株式会社 | 減速機 |
| JP6513465B2 (ja) * | 2015-04-24 | 2019-05-15 | 日本航空電子工業株式会社 | リード接合構造 |
| US20170245404A1 (en) * | 2016-02-19 | 2017-08-24 | Alpha Assembly Solutions Inc. | Rf shield with selectively integrated solder |
| CN107134674B (zh) * | 2016-02-29 | 2021-04-27 | 泰科电子(上海)有限公司 | 导电连接件及连接组件 |
| USD958092S1 (en) * | 2020-11-20 | 2022-07-19 | Samtec, Inc. | Contact |
Family Cites Families (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3864004A (en) * | 1972-11-30 | 1975-02-04 | Du Pont | Circuit board socket |
| US3989331A (en) * | 1974-08-21 | 1976-11-02 | Augat, Inc. | Dual-in-line socket |
| US4722470A (en) * | 1986-12-01 | 1988-02-02 | International Business Machines Corporation | Method and transfer plate for applying solder to component leads |
| US4948030A (en) * | 1989-01-30 | 1990-08-14 | Motorola, Inc. | Bond connection for components |
| US5281772A (en) * | 1991-10-28 | 1994-01-25 | Delco Electronics Corporation | Electrical connector having energy-formed solder stops and methods of making and using the same |
| US5367124A (en) * | 1993-06-28 | 1994-11-22 | International Business Machines Corporation | Compliant lead for surface mounting a chip package to a substrate |
| SG47417A1 (en) * | 1993-11-15 | 1998-04-17 | Connector Systems Tech Nv | Solderable connectors for high density electronic assemblies |
| JP3365882B2 (ja) * | 1995-02-03 | 2003-01-14 | 第一電子工業株式会社 | 電子部品端子の半田上がり防止構造 |
| JP3685875B2 (ja) | 1996-07-01 | 2005-08-24 | Smk株式会社 | コネクタターミナルの実装方法及び実装方法に用いるコネクタターミナルユニット |
| TW298347U (en) * | 1996-08-08 | 1997-02-11 | Hon Hai Prec Ind Co Ltd | Improved structure of connector terminal |
| JP3143089B2 (ja) * | 1996-12-31 | 2001-03-07 | 第一電子工業株式会社 | 電子部品 |
| US5957736A (en) * | 1997-11-19 | 1999-09-28 | Ddk Ltd. | Electronic part |
| TW383933U (en) * | 1998-03-03 | 2000-03-01 | Hon Hai Prec Ind Co Ltd | Electrical connector |
| JP4079527B2 (ja) * | 1998-07-15 | 2008-04-23 | 富士通コンポーネント株式会社 | リードピンの部分めっき方法 |
| US6354891B1 (en) * | 1999-05-21 | 2002-03-12 | Amphenol-Tuchel Electronics Gmbh | Contacting apparatus and contact element therefore |
| US6290555B1 (en) * | 2000-04-12 | 2001-09-18 | Hon Hai Precision Ind. Co., Ltd. | Housing to prevent wicking of molten solder and flux |
| FR2809871B1 (fr) * | 2000-06-05 | 2002-07-19 | Itt Mfg Entpr S Inc | Connecteur electrique a lames de contact perfectionnees pour le raccordement d'une carte a circuit(s) integre(s) |
| DE60134108D1 (de) * | 2000-10-25 | 2008-07-03 | Japan Aviation Electron | Eine elektronische Komponente und zugehöriges Herstellungsverfahren |
| TW560753U (en) * | 2000-10-26 | 2003-11-01 | Hon Hai Prec Ind Co Ltd | Electrical connector |
| US6641410B2 (en) * | 2001-06-07 | 2003-11-04 | Teradyne, Inc. | Electrical solder ball contact |
| JP2003243074A (ja) * | 2002-02-13 | 2003-08-29 | Matsushita Electric Works Ltd | カード用ソケット |
| TWI227579B (en) * | 2002-10-10 | 2005-02-01 | Matsushita Electric Works Ltd | Contact used in a connector, and method for manufacturing an element to be soldered |
| JP4003705B2 (ja) * | 2003-06-27 | 2007-11-07 | 松下電工株式会社 | 半田付け用端子の製造方法 |
| US20040224541A1 (en) * | 2003-05-09 | 2004-11-11 | Murata Co., Ltd. | Apparatus and method for forming solder wicking prevention zone and electronic part |
| JP4363261B2 (ja) * | 2004-06-16 | 2009-11-11 | パナソニック電工株式会社 | 接点と半田付け端子を有する電子部品及びその表面処理方法 |
| US20060196857A1 (en) * | 2005-03-03 | 2006-09-07 | Samtec, Inc. | Methods of manufacturing electrical contacts having solder stops |
| US7172438B2 (en) * | 2005-03-03 | 2007-02-06 | Samtec, Inc. | Electrical contacts having solder stops |
| KR100958771B1 (ko) * | 2005-08-23 | 2010-05-18 | 다이이치 덴시 고교 가부시키가이샤 | 초소형 콘택트 및 그 제조 방법 및 전자 부품 |
| CN2840358Y (zh) * | 2005-09-28 | 2006-11-22 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
| JP5060146B2 (ja) * | 2007-03-29 | 2012-10-31 | Jx日鉱日石金属株式会社 | 半田吸い上がりバリア部を持つ端子及びその製造方法 |
| JP4454036B2 (ja) * | 2007-06-06 | 2010-04-21 | ヒロセ電機株式会社 | 回路基板用雄電気コネクタ及び電気コネクタ組立体 |
| US7821111B2 (en) * | 2007-10-05 | 2010-10-26 | Texas Instruments Incorporated | Semiconductor device having grooved leads to confine solder wicking |
| JP4954050B2 (ja) * | 2007-12-20 | 2012-06-13 | モレックス インコーポレイテド | 端子及びコネクタ |
| JP4887412B2 (ja) * | 2009-09-18 | 2012-02-29 | ヒロセ電機株式会社 | 回路基板用電気コネクタ |
| JP5009972B2 (ja) * | 2009-12-21 | 2012-08-29 | 日立オートモティブシステムズ株式会社 | コネクタの製造方法 |
| CN201838746U (zh) * | 2010-02-03 | 2011-05-18 | 番禺得意精密电子工业有限公司 | 电连接器 |
| CN102456958A (zh) * | 2010-10-23 | 2012-05-16 | 富士康(昆山)电脑接插件有限公司 | 电连接器及其制造方法 |
| CN102544884B (zh) * | 2011-12-23 | 2015-04-01 | 富士康(昆山)电脑接插件有限公司 | 电连接器、电连接器壳体及其表面处理的方法 |
-
2011
- 2011-06-30 JP JP2011146352A patent/JP5479406B2/ja not_active Expired - Fee Related
-
2012
- 2012-06-27 US US13/534,434 patent/US8727810B2/en active Active
- 2012-06-28 FI FI20125740A patent/FI124395B/fi active IP Right Grant
- 2012-06-29 CN CN2012102249946A patent/CN102856696A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP5479406B2 (ja) | 2014-04-23 |
| JP2013016266A (ja) | 2013-01-24 |
| CN102856696A (zh) | 2013-01-02 |
| US8727810B2 (en) | 2014-05-20 |
| US20130005188A1 (en) | 2013-01-03 |
| FI124395B (fi) | 2014-08-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG | Patent granted |
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