FI20106100A7 - Substrat - Google Patents

Substrat

Info

Publication number: FI20106100A7
Authority: FI; Finland
Prior art keywords: chassis
Prior art date: 2010-10-25

Application number

FI20106100A

Other languages

English (en)

Finnish (fi)

Other versions

FI125379B (sv

FI20106100A0 (sv

FI20106100L (sv

Inventor

Tuomo Maemmilae

Original Assignee

Jot Automation Oy

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2010-10-25

Filing date

2010-10-25

Publication date

2012-04-26

2010-10-25 Application filed by Jot Automation Oy filed Critical Jot Automation Oy

2010-10-25 Publication of FI20106100A0 publication Critical patent/FI20106100A0/sv

2010-10-25 Priority to FI20106100A priority Critical patent/FI125379B/sv

2011-10-19 Priority to PCT/FI2011/050911 priority patent/WO2012056097A1/en

2011-10-19 Priority to MYPI2013001470A priority patent/MY174595A/en

2011-10-19 Priority to US13/881,329 priority patent/US9962790B2/en

2011-10-19 Priority to MX2013004604A priority patent/MX358305B/es

2011-10-19 Priority to CN201180056822.6A priority patent/CN103262233B/zh

2011-10-19 Priority to EP11835688.0A priority patent/EP2633549A4/en

2011-10-19 Priority to CA2815605A priority patent/CA2815605C/en

2012-04-26 Publication of FI20106100A7 publication Critical patent/FI20106100A7/sv

2012-04-26 Publication of FI20106100L publication Critical patent/FI20106100L/sv

2015-09-15 Application granted granted Critical

2015-09-15 Publication of FI125379B publication Critical patent/FI125379B/sv

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
- H05K13/0069—Holders for printed circuit boards
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits

Landscapes

Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
Optics & Photonics (AREA)
Plasma & Fusion (AREA)
Mechanical Engineering (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Laser Beam Processing (AREA)
Processing Of Stones Or Stones Resemblance Materials (AREA)

FI20106100A 2010-10-25 2010-10-25 Substrat FI125379B (sv)

Priority Applications (8)

Application Number	Priority Date	Filing Date	Title
FI20106100A FI125379B (sv)	2010-10-25	2010-10-25	Substrat
MX2013004604A MX358305B (es)	2010-10-25	2011-10-19	Soporte de tarjeta de circuitos para corte con laser.
MYPI2013001470A MY174595A (en)	2010-10-25	2011-10-19	Circuit board support for laser cutting
US13/881,329 US9962790B2 (en)	2010-10-25	2011-10-19	Circuit board support for laser cutting
PCT/FI2011/050911 WO2012056097A1 (en)	2010-10-25	2011-10-19	Circuit board support for laser cutting
CN201180056822.6A CN103262233B (zh)	2010-10-25	2011-10-19	用于激光切割的电路板支承物
EP11835688.0A EP2633549A4 (en)	2010-10-25	2011-10-19	Circuit board support for laser cutting
CA2815605A CA2815605C (en)	2010-10-25	2011-10-19	Circuit board support for laser cutting

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
FI20106100A FI125379B (sv)	2010-10-25	2010-10-25	Substrat
FI20106100		2010-10-25

Publications (4)

Publication Number	Publication Date
FI20106100A0 FI20106100A0 (sv)	2010-10-25
FI20106100A7 true FI20106100A7 (sv)	2012-04-26
FI20106100L FI20106100L (sv)	2012-04-26
FI125379B FI125379B (sv)	2015-09-15

Family

ID=43064258

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
FI20106100A FI125379B (sv)	2010-10-25	2010-10-25	Substrat

Country Status (8)

Country	Link
US (1)	US9962790B2 (sv)
EP (1)	EP2633549A4 (sv)
CN (1)	CN103262233B (sv)
CA (1)	CA2815605C (sv)
FI (1)	FI125379B (sv)
MX (1)	MX358305B (sv)
MY (1)	MY174595A (sv)
WO (1)	WO2012056097A1 (sv)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN103635023B (zh) *	2012-08-27	2016-08-24	富葵精密组件(深圳)有限公司	电路板的制作方法
CN103949780B (zh) *	2014-05-22	2016-05-11	傲科塑料制品（张家港）有限公司	一种激光切割用传送装置
EP3839676A1 (en) *	2019-12-16	2021-06-23	Bystronic Laser AG	Thickness compensation in a cutting and bending process

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2796843A (en)	1956-01-25	1957-06-25	Steatite Res Corp	Ceramic welding ring
US3688080A (en)	1969-09-08	1972-08-29	Andrew John Cartwright	Welding
IT1281359B1 (it) *	1995-09-26	1998-02-18	Fiat Ricerche	Superficie anti-riflettente a rugosita' predeterminata, particolarmente per plance di autoveicoli
JPH09298339A (ja) *	1996-04-30	1997-11-18	Rohm Co Ltd	半導体レーザの製法
DE69703339T2 (de)	1996-09-19	2001-04-12	Koninklijke Philips Electronics N.V., Eindhoven	Herstellungsverfahren einer gemusterten oberfläche auf einem transparenten körper
US6967722B2 (en) *	1997-10-28	2005-11-22	Manning Christopher J	Tilt-compensated interferometers
JP2968784B1 (ja) *	1998-06-19	1999-11-02	日本電気株式会社	研磨方法およびそれに用いる装置
DE19908630A1 (de)	1999-02-27	2000-08-31	Bosch Gmbh Robert	Abschirmung gegen Laserstrahlen
JP3484396B2 (ja) *	2000-05-09	2004-01-06	新光電気工業株式会社	ウェハーの切断方法
US6518502B2 (en) *	2001-05-10	2003-02-11	Lamina Ceramics, In	Ceramic multilayer circuit boards mounted on a patterned metal support substrate
JP3956350B2 (ja) *	2002-03-25	2007-08-08	東京エレクトロン株式会社	位置決め機能を有する基板処理装置及び位置決め機能を有する基板処理方法
US6580054B1 (en) *	2002-06-10	2003-06-17	New Wave Research	Scribing sapphire substrates with a solid state UV laser
US6960813B2 (en)	2002-06-10	2005-11-01	New Wave Research	Method and apparatus for cutting devices from substrates
US6806544B2 (en)	2002-11-05	2004-10-19	New Wave Research	Method and apparatus for cutting devices from conductive substrates secured during cutting by vacuum pressure
JP4398686B2 (ja) *	2003-09-11	2010-01-13	株式会社ディスコ	ウエーハの加工方法
JP4251054B2 (ja) *	2003-10-01	2009-04-08	株式会社デンソー	半導体装置の製造方法
JP2005129607A (ja) *	2003-10-22	2005-05-19	Disco Abrasive Syst Ltd	ウエーハの分割方法
JP2005203541A (ja)	2004-01-15	2005-07-28	Disco Abrasive Syst Ltd	ウエーハのレーザー加工方法
US7208346B2 (en) *	2004-06-14	2007-04-24	David Lee	Methods of forming interposers on surfaces of dies of a wafer
CN101065844B (zh) *	2005-01-04	2010-12-15	株式会社映煌	固体摄像装置及其制造方法
US7083041B1 (en) *	2006-01-18	2006-08-01	Keith Investments, Llc	Slat conveyor having conveying slats and lifting slats
DE202006006174U1 (de) *	2006-04-18	2006-07-06	Faber, Stefan	Schneidtisch für eine Schneidanlage
JP4979291B2 (ja) *	2006-07-25	2012-07-18	アピックヤマダ株式会社	レーザ切断装置
DE102006036500B8 (de) *	2006-07-26	2008-07-24	Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.	Wandelement zum Schutz vor Laserstrahlung
CN101406988B (zh) *	2007-10-12	2011-06-22	深圳市大族激光科技股份有限公司	一种激光割圆设备及其方法

2010
- 2010-10-25 FI FI20106100A patent/FI125379B/sv active IP Right Grant
2011
- 2011-10-19 CA CA2815605A patent/CA2815605C/en active Active
- 2011-10-19 US US13/881,329 patent/US9962790B2/en not_active Expired - Fee Related
- 2011-10-19 WO PCT/FI2011/050911 patent/WO2012056097A1/en not_active Ceased
- 2011-10-19 MY MYPI2013001470A patent/MY174595A/en unknown
- 2011-10-19 MX MX2013004604A patent/MX358305B/es active IP Right Grant
- 2011-10-19 CN CN201180056822.6A patent/CN103262233B/zh active Active
- 2011-10-19 EP EP11835688.0A patent/EP2633549A4/en not_active Withdrawn

Also Published As

Publication number	Publication date
CA2815605C (en)	2018-07-17
FI125379B (sv)	2015-09-15
MX2013004604A (es)	2013-12-02
MX358305B (es)	2018-08-14
CN103262233B (zh)	2016-04-06
MY174595A (en)	2020-04-29
US9962790B2 (en)	2018-05-08
CN103262233A (zh)	2013-08-21
WO2012056097A1 (en)	2012-05-03
CA2815605A1 (en)	2012-05-03
EP2633549A1 (en)	2013-09-04
FI20106100A0 (sv)	2010-10-25
FI20106100L (sv)	2012-04-26
US20140091072A1 (en)	2014-04-03
EP2633549A4 (en)	2017-10-11

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