[go: up one dir, main page]

FI20096110L - Method for processing material using a laser device - Google Patents

Method for processing material using a laser device Download PDF

Info

Publication number
FI20096110L
FI20096110L FI20096110A FI20096110A FI20096110L FI 20096110 L FI20096110 L FI 20096110L FI 20096110 A FI20096110 A FI 20096110A FI 20096110 A FI20096110 A FI 20096110A FI 20096110 L FI20096110 L FI 20096110L
Authority
FI
Finland
Prior art keywords
laser device
processing material
processing
laser
Prior art date
Application number
FI20096110A
Other languages
Finnish (fi)
Swedish (sv)
Other versions
FI20096110A7 (en
FI20096110A0 (en
Inventor
Antti Salminen
Heidi Piili
Tuomas Purtonen
Original Assignee
Lappeenrannan Teknillinen Yliopisto
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lappeenrannan Teknillinen Yliopisto filed Critical Lappeenrannan Teknillinen Yliopisto
Priority to FI20096110A priority Critical patent/FI20096110A7/en
Publication of FI20096110A0 publication Critical patent/FI20096110A0/en
Priority to RU2012122720/02A priority patent/RU2012122720A/en
Priority to EP10826178A priority patent/EP2493651A2/en
Priority to PCT/FI2010/050857 priority patent/WO2011051567A2/en
Publication of FI20096110L publication Critical patent/FI20096110L/en
Publication of FI20096110A7 publication Critical patent/FI20096110A7/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067Dividing the beam into multiple beams, e.g. multifocusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20Bonding
    • B23K26/21Bonding by welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/05Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
    • H01S3/06Construction or shape of active medium
    • H01S3/063Waveguide lasers, i.e. whereby the dimensions of the waveguide are of the order of the light wavelength
    • H01S3/067Fibre lasers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/30Organic material
    • B23K2103/38Fabrics, fibrous materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/30Organic material
    • B23K2103/40Paper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/30Organic material
    • B23K2103/42Plastics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Laser Beam Processing (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
  • Lasers (AREA)
FI20096110A 2009-10-28 2009-10-28 Method for processing material using a laser device FI20096110A7 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FI20096110A FI20096110A7 (en) 2009-10-28 2009-10-28 Method for processing material using a laser device
RU2012122720/02A RU2012122720A (en) 2009-10-28 2010-10-28 METHOD FOR PROCESSING MATERIAL USING A LASER DEVICE
EP10826178A EP2493651A2 (en) 2009-10-28 2010-10-28 Method for machining material by a laser device
PCT/FI2010/050857 WO2011051567A2 (en) 2009-10-28 2010-10-28 Method for machining material by a laser device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20096110A FI20096110A7 (en) 2009-10-28 2009-10-28 Method for processing material using a laser device

Publications (3)

Publication Number Publication Date
FI20096110A0 FI20096110A0 (en) 2009-10-28
FI20096110L true FI20096110L (en) 2011-04-29
FI20096110A7 FI20096110A7 (en) 2011-04-29

Family

ID=41263524

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20096110A FI20096110A7 (en) 2009-10-28 2009-10-28 Method for processing material using a laser device

Country Status (4)

Country Link
EP (1) EP2493651A2 (en)
FI (1) FI20096110A7 (en)
RU (1) RU2012122720A (en)
WO (1) WO2011051567A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2409808A1 (en) 2010-07-22 2012-01-25 Bystronic Laser AG Laser processing machine
EP2883647B1 (en) 2013-12-12 2019-05-29 Bystronic Laser AG Method for configuring a laser machining device
DE102014113323A1 (en) * 2014-09-16 2016-03-17 BMA Automation GmbH Method and apparatus for removing a plastic coating from a food loaf

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU6563986A (en) * 1985-12-06 1987-06-11 Hughes Technology Pty. Ltd. Laser sawmill
FR2794675B1 (en) * 1999-06-11 2001-08-31 Brodart LASER MICROPERFORATION OF THERMOPLASTIC OR CELLULOSIC FILMS BY OPTICAL FIBERS
DE10020559A1 (en) * 2000-04-27 2001-10-31 Hannover Laser Zentrum Laser processing of materials
FR2850308B1 (en) * 2003-01-28 2005-03-04 Commissariat Energie Atomique PERIPHERAL DEVICE FOR PRINTING AND CUTTING PAPER SHEETS USING LOW POWER LASER SOURCE
FR2897007B1 (en) * 2006-02-03 2008-04-11 Air Liquide METHOD OF CUTTING WITH A FIBER LASER WITH BEAM PARAMETER CONTROL
US20080174104A1 (en) * 2007-01-19 2008-07-24 Appleton Papers Inc. Secure documents - methods and applications

Also Published As

Publication number Publication date
WO2011051567A2 (en) 2011-05-05
FI20096110A7 (en) 2011-04-29
FI20096110A0 (en) 2009-10-28
EP2493651A2 (en) 2012-09-05
RU2012122720A (en) 2013-12-10
WO2011051567A3 (en) 2011-07-21

Similar Documents

Publication Publication Date Title
IL251198B (en) A method for sliding a chip
FI20085275L (en) A method for processing biomass
BRPI1010670A8 (en) method and apparatus for optical sensing
BR112012002222A2 (en) stereolithography machine and method
IT1396233B1 (en) APPARATUS AND CUTTING METHOD
BRPI1012210A2 (en) conveyor apparatus
IT1393147B1 (en) APPARATUS AND FEEDING METHOD
SI2453988T1 (en) Procedure for using a safety device
FI20105727A0 (en) A method for dissolving lignocellulosic materials
EE05608B1 (en) Method and apparatus for obtaining a disinfectant
IT1398433B1 (en) APPARATUS AND PROCEDURE FOR PROCESSING A SUBSTRATE
NO20084377L (en) Device for a winch-operated crushing plant
FI20095134L (en) Method for using a holding device and holding device
EP2474217A4 (en) DEVICE FOR WEEDING
FI20095616A0 (en) A method for processing a porous product and a porous product
BR112012010861A2 (en) freeze-free device and method for producing a freeze-free device
BRPI0922193A2 (en) method for operating a sensor apparatus and sensor apparatus
BR112012001052A2 (en) speaker device, and method for forming a speaker device
FI20095676A0 (en) Apparatus
IT1394973B1 (en) DISPOSAL DEVICE FOR A SUBSTANCE
BRPI0910400A2 (en) scale removal method and scale removal apparatus
FI20075729L (en) Method for processing lignocellulosic materials
FI20096110L (en) Method for processing material using a laser device
FI20090139L (en) Method for performing laser welding
FI20095003A0 (en) A method for processing wood

Legal Events

Date Code Title Description
FD Application lapsed