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FI20085945A0 - Elektroniikkalaitteen jäähdytysrakenne ja menetelmä - Google Patents

Elektroniikkalaitteen jäähdytysrakenne ja menetelmä

Info

Publication number
FI20085945A0
FI20085945A0 FI20085945A FI20085945A FI20085945A0 FI 20085945 A0 FI20085945 A0 FI 20085945A0 FI 20085945 A FI20085945 A FI 20085945A FI 20085945 A FI20085945 A FI 20085945A FI 20085945 A0 FI20085945 A0 FI 20085945A0
Authority
FI
Finland
Prior art keywords
procedure
electronic device
cooling structure
cooling
electronic
Prior art date
Application number
FI20085945A
Other languages
English (en)
Swedish (sv)
Other versions
FI20085945L (fi
FI20085945A7 (fi
Inventor
Matti Smalen
Timo Koivuluoma
Matti Laitinen
Original Assignee
Abb Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Abb Oy filed Critical Abb Oy
Priority to FI20085945A priority Critical patent/FI20085945A7/fi
Publication of FI20085945A0 publication Critical patent/FI20085945A0/fi
Priority to PCT/FI2009/050792 priority patent/WO2010040896A1/en
Priority to EP09748360A priority patent/EP2347643B1/en
Priority to CN200980139724.1A priority patent/CN102172109B/zh
Publication of FI20085945L publication Critical patent/FI20085945L/fi
Publication of FI20085945A7 publication Critical patent/FI20085945A7/fi
Priority to US13/080,191 priority patent/US8379384B2/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FI20085945A 2008-10-08 2008-10-08 Elektroniikkalaitteen jäähdytysrakenne ja menetelmä FI20085945A7 (fi)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FI20085945A FI20085945A7 (fi) 2008-10-08 2008-10-08 Elektroniikkalaitteen jäähdytysrakenne ja menetelmä
PCT/FI2009/050792 WO2010040896A1 (en) 2008-10-08 2009-10-01 Cooling structure for electronic device, and a method
EP09748360A EP2347643B1 (en) 2008-10-08 2009-10-01 Cooling structure for electronic device, and a method
CN200980139724.1A CN102172109B (zh) 2008-10-08 2009-10-01 用于电子装置的冷却装置和方法
US13/080,191 US8379384B2 (en) 2008-10-08 2011-04-05 Cooling structure for electronic device, and a method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20085945A FI20085945A7 (fi) 2008-10-08 2008-10-08 Elektroniikkalaitteen jäähdytysrakenne ja menetelmä

Publications (3)

Publication Number Publication Date
FI20085945A0 true FI20085945A0 (fi) 2008-10-08
FI20085945L FI20085945L (fi) 2010-04-09
FI20085945A7 FI20085945A7 (fi) 2010-04-09

Family

ID=39924590

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20085945A FI20085945A7 (fi) 2008-10-08 2008-10-08 Elektroniikkalaitteen jäähdytysrakenne ja menetelmä

Country Status (5)

Country Link
US (1) US8379384B2 (fi)
EP (1) EP2347643B1 (fi)
CN (1) CN102172109B (fi)
FI (1) FI20085945A7 (fi)
WO (1) WO2010040896A1 (fi)

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US9192079B2 (en) * 2008-09-26 2015-11-17 Rockwell Automation Technologies, Inc. Power electronic module cooling system and method
CN101950197A (zh) * 2010-05-24 2011-01-19 深圳市傲星泰科技有限公司 一种计算机电源
JP5348623B2 (ja) * 2010-09-10 2013-11-20 株式会社安川電機 電子機器装置
EP2557676B1 (de) * 2011-08-09 2014-02-26 Siemens Aktiengesellschaft Umrichteranordnung mit einem Luftkühlsystem
US8634193B2 (en) * 2011-12-05 2014-01-21 Rockwell Automation Technologies, Inc. Device and method using induction to improve natural convection cooling
US8842432B2 (en) * 2012-09-22 2014-09-23 Facebook, Inc. Arrangement of computing assets in a data center
KR102094887B1 (ko) * 2013-07-08 2020-03-30 엘지전자 주식회사 디지털 사이니지 및 그 구동방법
CN105684565B (zh) * 2014-09-16 2017-08-29 深圳市大疆创新科技有限公司 散热装置及采用该散热装置的uav
KR102478570B1 (ko) 2016-08-31 2022-12-19 엘지전자 주식회사 파워 스택
US10653992B2 (en) * 2017-10-12 2020-05-19 Quanta Computer Inc. Server dust collector
EP3490353A1 (de) * 2017-11-27 2019-05-29 Siemens Aktiengesellschaft Kühlsystem mit parallelen kühlkanälen
JP2021528829A (ja) * 2018-06-28 2021-10-21 シグニファイ ホールディング ビー ヴィＳｉｇｎｉｆｙ Ｈｏｌｄｉｎｇ Ｂ．Ｖ． 街路照明ポール
EP3912441B1 (en) * 2019-01-18 2024-06-26 BITZER Electronics A/S Heat transfer assembly and power electronics device
US10908657B2 (en) * 2019-02-15 2021-02-02 Pensando Systems Inc. Methods and systems for thermal control
US12075593B2 (en) 2020-03-27 2024-08-27 Sony Interactive Entertainment Inc. Electronic apparatus
US12324124B2 (en) 2020-03-27 2025-06-03 Sony Interactive Entertainment Inc. Electronic apparatus
IT202200026742A1 (it) * 2022-12-23 2024-06-23 Friem S P A Apparato convertitore elettronico di potenza comprendente moduli convertitori tra loro sovrapposti ed una unità di raffreddamento a ventilazione forzata

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DE2151010B2 (de) 1971-10-08 1978-07-20 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Aufgesetzte wetterschutzhaube fuer durchzugsbelueftete elektrische maschinen
JP2525806B2 (ja) 1987-05-19 1996-08-21 株式会社東芝 冷却空気瀘過装置付回転電機
EP0356991B1 (en) * 1988-08-31 1995-01-11 Hitachi, Ltd. Inverter device
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US7423871B2 (en) * 2003-11-14 2008-09-09 Det International Holding Limited Electric device with improved cooling and casing therefor
FI20031714A0 (fi) * 2003-11-24 2003-11-24 Abb Oy Invertteri
JP3784813B2 (ja) * 2003-11-26 2006-06-14 本田技研工業株式会社 車両モータ用高圧電装の冷却装置及びハイブリッド車両
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US7345873B2 (en) * 2004-09-29 2008-03-18 General Electric Company System and method for cooling electronic systems
PL193094B1 (pl) * 2004-11-15 2007-01-31 Adb Polska Sp Urządzenie elektroniczne z płytą montażową z obwodami drukowanymi i płyta montażowa z obwodami drukowanymi
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Also Published As

Publication number Publication date
US8379384B2 (en) 2013-02-19
FI20085945L (fi) 2010-04-09
EP2347643A1 (en) 2011-07-27
CN102172109A (zh) 2011-08-31
CN102172109B (zh) 2014-05-14
EP2347643B1 (en) 2013-03-20
US20110198064A1 (en) 2011-08-18
FI20085945A7 (fi) 2010-04-09
WO2010040896A1 (en) 2010-04-15

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Legal Events

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