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FI20080541A0 - Anordning och förfarande i samband med ett belysningsaggregat - Google Patents

Anordning och förfarande i samband med ett belysningsaggregat

Info

Publication number
FI20080541A0
FI20080541A0 FI20080541A FI20080541A FI20080541A0 FI 20080541 A0 FI20080541 A0 FI 20080541A0 FI 20080541 A FI20080541 A FI 20080541A FI 20080541 A FI20080541 A FI 20080541A FI 20080541 A0 FI20080541 A0 FI 20080541A0
Authority
FI
Finland
Prior art keywords
arrangement
connection
lighting equipment
lighting
equipment
Prior art date
Application number
FI20080541A
Other languages
English (en)
Finnish (fi)
Other versions
FI20080541L (sv
FI122908B (sv
Inventor
Pekka Jahkonen
Original Assignee
Kone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kone Corp filed Critical Kone Corp
Priority to FI20080541A priority Critical patent/FI122908B/sv
Publication of FI20080541A0 publication Critical patent/FI20080541A0/sv
Priority to PCT/FI2009/000084 priority patent/WO2010034873A1/en
Publication of FI20080541L publication Critical patent/FI20080541L/sv
Application granted granted Critical
Publication of FI122908B publication Critical patent/FI122908B/sv

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B66—HOISTING; LIFTING; HAULING
    • B66B—ELEVATORS; ESCALATORS OR MOVING WALKWAYS
    • B66B11/00—Main component parts of lifts in, or associated with, buildings or other structures
    • B66B11/02—Cages, i.e. cars
    • B66B11/0226—Constructional features, e.g. walls assembly, decorative panels, comfort equipment, thermal or sound insulation
    • B66B11/0233—Lighting systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Civil Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Structural Engineering (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
FI20080541A 2008-09-26 2008-09-26 Arrangemang och förfarande för kylning av en LED -ljuskälla, belysningsarrangemang för ett transportsystem och LED -ljuskälla FI122908B (sv)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FI20080541A FI122908B (sv) 2008-09-26 2008-09-26 Arrangemang och förfarande för kylning av en LED -ljuskälla, belysningsarrangemang för ett transportsystem och LED -ljuskälla
PCT/FI2009/000084 WO2010034873A1 (en) 2008-09-26 2009-09-15 Arrangement and method in connection with a lighting apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20080541A FI122908B (sv) 2008-09-26 2008-09-26 Arrangemang och förfarande för kylning av en LED -ljuskälla, belysningsarrangemang för ett transportsystem och LED -ljuskälla
FI20080541 2008-09-26

Publications (3)

Publication Number Publication Date
FI20080541A0 true FI20080541A0 (sv) 2008-09-26
FI20080541L FI20080541L (sv) 2010-03-27
FI122908B FI122908B (sv) 2012-08-31

Family

ID=39852202

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20080541A FI122908B (sv) 2008-09-26 2008-09-26 Arrangemang och förfarande för kylning av en LED -ljuskälla, belysningsarrangemang för ett transportsystem och LED -ljuskälla

Country Status (2)

Country Link
FI (1) FI122908B (sv)
WO (1) WO2010034873A1 (sv)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015159126A1 (en) * 2014-04-16 2015-10-22 Stefan Kreidler Flexible led

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6045240A (en) * 1996-06-27 2000-04-04 Relume Corporation LED lamp assembly with means to conduct heat away from the LEDS
JP2004140150A (ja) * 2002-08-20 2004-05-13 Tanaka Kikinzoku Kogyo Kk 発光ダイオードデバイス用の基板
US20040188593A1 (en) * 2003-03-20 2004-09-30 Patrick Mullins Photosensor control unit
CN101151741B (zh) * 2005-03-30 2010-06-23 皇家飞利浦电子股份有限公司 柔性led阵列
US20070247852A1 (en) * 2006-04-21 2007-10-25 Xiaoping Wang Multi chip LED lamp
JP2007314271A (ja) * 2006-05-24 2007-12-06 Royal Lighting Co Ltd Ｌｅｄランプ使用の非常灯

Also Published As

Publication number Publication date
FI20080541L (sv) 2010-03-27
WO2010034873A1 (en) 2010-04-01
FI122908B (sv) 2012-08-31

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