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FI20070318A0 - Procedure and arrangement for cooling device housing - Google Patents

Procedure and arrangement for cooling device housing

Info

Publication number
FI20070318A0
FI20070318A0 FI20070318A FI20070318A FI20070318A0 FI 20070318 A0 FI20070318 A0 FI 20070318A0 FI 20070318 A FI20070318 A FI 20070318A FI 20070318 A FI20070318 A FI 20070318A FI 20070318 A0 FI20070318 A0 FI 20070318A0
Authority
FI
Finland
Prior art keywords
procedure
arrangement
cooling device
device housing
housing
Prior art date
Application number
FI20070318A
Other languages
Finnish (fi)
Swedish (sv)
Other versions
FI20070318L (en
FI121949B (en
Original Assignee
Epec Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epec Oy filed Critical Epec Oy
Priority to FI20070318A priority Critical patent/FI121949B/en
Publication of FI20070318A0 publication Critical patent/FI20070318A0/en
Priority to PCT/FI2008/050210 priority patent/WO2008129134A1/en
Priority to EP08750453.6A priority patent/EP2143313A4/en
Publication of FI20070318L publication Critical patent/FI20070318L/en
Application granted granted Critical
Publication of FI121949B publication Critical patent/FI121949B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FI20070318A 2007-04-23 2007-04-23 Procedure and arrangement for cooling device housing FI121949B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FI20070318A FI121949B (en) 2007-04-23 2007-04-23 Procedure and arrangement for cooling device housing
PCT/FI2008/050210 WO2008129134A1 (en) 2007-04-23 2008-04-22 Method and arrangement for cooling equipment box
EP08750453.6A EP2143313A4 (en) 2007-04-23 2008-04-22 Method and arrangement for cooling equipment box

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20070318A FI121949B (en) 2007-04-23 2007-04-23 Procedure and arrangement for cooling device housing
FI20070318 2007-04-23

Publications (3)

Publication Number Publication Date
FI20070318A0 true FI20070318A0 (en) 2007-04-23
FI20070318L FI20070318L (en) 2008-10-24
FI121949B FI121949B (en) 2011-06-15

Family

ID=38009856

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20070318A FI121949B (en) 2007-04-23 2007-04-23 Procedure and arrangement for cooling device housing

Country Status (3)

Country Link
EP (1) EP2143313A4 (en)
FI (1) FI121949B (en)
WO (1) WO2008129134A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019207039B4 (en) * 2019-05-15 2025-06-18 Fronius International Gmbh Inverter housings, especially photovoltaic inverter housings
CN210725817U (en) * 2019-09-04 2020-06-09 中兴通讯股份有限公司 Composite tooth radiator and communication base station
CN113543575A (en) * 2020-04-21 2021-10-22 深圳市英维克科技股份有限公司 Radiators and Communication Equipment

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4520425A (en) * 1982-08-12 1985-05-28 Mitsubishi Denki Kabushiki Kaisha Control apparatus with improved structure for cooling circuit elements
AT384343B (en) * 1985-04-16 1987-10-27 Siemens Ag Oesterreich HOUSING ARRANGEMENT FOR VENTILATED DEVICES, PREFERABLY THE POWER ELECTRONICS
EP0356991B1 (en) * 1988-08-31 1995-01-11 Hitachi, Ltd. Inverter device
DE10143547B4 (en) * 2001-09-06 2005-03-10 Rexroth Indramat Gmbh Active outdoor-cooled housing with at least one heat dissipation-generating electronic component
JP2003298268A (en) * 2002-03-29 2003-10-17 Denso Corp Casing structure of electronic controller, and cooling structure for the electronic controller
JP2005044953A (en) * 2003-07-28 2005-02-17 Hitachi Industrial Equipment Systems Co Ltd Power converter
GB2411050A (en) * 2004-02-16 2005-08-17 E2V Tech Uk Ltd Electrical apparatus cooling system
JP4265505B2 (en) * 2004-08-09 2009-05-20 オムロン株式会社 Heat dissipation structure of electronic equipment
US7142423B2 (en) * 2004-10-26 2006-11-28 Comarco Wireless Technologies, Inc. Power adapter with fan assembly

Also Published As

Publication number Publication date
WO2008129134A1 (en) 2008-10-30
EP2143313A1 (en) 2010-01-13
FI20070318L (en) 2008-10-24
EP2143313A4 (en) 2016-11-16
FI121949B (en) 2011-06-15

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