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FI20055515L - Attaching a conductor structure to an object - Google Patents

Attaching a conductor structure to an object Download PDF

Info

Publication number
FI20055515L
FI20055515L FI20055515A FI20055515A FI20055515L FI 20055515 L FI20055515 L FI 20055515L FI 20055515 A FI20055515 A FI 20055515A FI 20055515 A FI20055515 A FI 20055515A FI 20055515 L FI20055515 L FI 20055515L
Authority
FI
Finland
Prior art keywords
conductor structure
attaching
press
thermoplastic
temperature
Prior art date
Application number
FI20055515A
Other languages
Finnish (fi)
Swedish (sv)
Other versions
FI20055515A7 (en
FI20055515A0 (en
Inventor
Juha Hagberg
Teija Kekonen
Original Assignee
Selmic Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Selmic Oy filed Critical Selmic Oy
Priority to FI20055515A priority Critical patent/FI20055515L/en
Publication of FI20055515A0 publication Critical patent/FI20055515A0/en
Priority to PCT/FI2006/050415 priority patent/WO2007036610A1/en
Publication of FI20055515A7 publication Critical patent/FI20055515A7/en
Publication of FI20055515L publication Critical patent/FI20055515L/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Insulated Conductors (AREA)

Abstract

A conductor structure (100) and an object (104) made of a thermoplastic material are pressed between a press (900) and a support substrate (910) into a mechanical contact with each other. The press (900) heats the conductor structure (100) to a temperature higher than the thermoplastic softening temperature, the heated conductor structure (100) producing in the object (104) a reversible temperature change that attaches the conductor structure (100) to the object (104) in such a way that the shape of the object (104) remains unchanged at least outside the point of attachment of the conductor structure (100).
FI20055515A 2005-09-28 2005-09-28 Attaching a conductor structure to an object FI20055515L (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FI20055515A FI20055515L (en) 2005-09-28 2005-09-28 Attaching a conductor structure to an object
PCT/FI2006/050415 WO2007036610A1 (en) 2005-09-28 2006-09-28 Attachment of conductor structure to object

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20055515A FI20055515L (en) 2005-09-28 2005-09-28 Attaching a conductor structure to an object

Publications (3)

Publication Number Publication Date
FI20055515A0 FI20055515A0 (en) 2005-09-28
FI20055515A7 FI20055515A7 (en) 2007-07-06
FI20055515L true FI20055515L (en) 2007-07-06

Family

ID=35151481

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20055515A FI20055515L (en) 2005-09-28 2005-09-28 Attaching a conductor structure to an object

Country Status (2)

Country Link
FI (1) FI20055515L (en)
WO (1) WO2007036610A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102484308A (en) * 2009-04-21 2012-05-30 莫列斯公司 Three-dimensional antenna
US8896488B2 (en) * 2011-03-01 2014-11-25 Apple Inc. Multi-element antenna structure with wrapped substrate
US9093745B2 (en) 2012-05-10 2015-07-28 Apple Inc. Antenna and proximity sensor structures having printed circuit and dielectric carrier layers

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3214315A (en) * 1962-03-28 1965-10-26 Burton Solomon Method for forming stamped electrical circuits
US3589224A (en) * 1968-10-14 1971-06-29 Buckee Mears Co Die punching printed circuit
DE3031751A1 (en) * 1980-08-22 1982-04-15 Wilhelm Ruf KG, 8000 München METHOD FOR PRODUCING ELECTROTECHNICAL COMPONENTS AND SLIDING OR TURNING RESISTANCE PRODUCED BY THIS METHOD
US4980016A (en) * 1985-08-07 1990-12-25 Canon Kabushiki Kaisha Process for producing electric circuit board
JP3168389B2 (en) * 1995-01-26 2001-05-21 矢崎総業株式会社 Circuit board manufacturing method
JP2000509909A (en) * 1997-02-21 2000-08-02 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Method for selectively metallizing substrates using thermal foil embossing technology
GB2345196B (en) * 1998-12-23 2003-11-26 Nokia Mobile Phones Ltd An antenna and method of production
US6936336B2 (en) * 2002-03-15 2005-08-30 Kyocera Corporation Transfer sheet and production method of the same and wiring board and production method of the same
JP4142954B2 (en) * 2003-01-10 2008-09-03 京セラ株式会社 Printed wiring board manufacturing equipment
CN1751546A (en) * 2003-03-05 2006-03-22 英滕电路公司 Method for manufacturing an electrically conductive pattern
FI20045235A7 (en) * 2004-06-22 2005-12-23 Intune Circuits Oy Method for processing an electrically conductive pattern

Also Published As

Publication number Publication date
FI20055515A7 (en) 2007-07-06
WO2007036610A8 (en) 2007-06-07
FI20055515A0 (en) 2005-09-28
WO2007036610A1 (en) 2007-04-05

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Legal Events

Date Code Title Description
PC Transfer of assignment of patent

Owner name: SELMIC OY

Free format text: SELMIC OY

PC Transfer of assignment of patent

Owner name: ASPACT OY

Free format text: ASPACT OY

MA Patent expired