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FI20045501A7 - Conductor pattern, connection pad and method of manufacturing conductor pattern and connection pad - Google Patents

Conductor pattern, connection pad and method of manufacturing conductor pattern and connection pad Download PDF

Info

Publication number
FI20045501A7
FI20045501A7 FI20045501A FI20045501A FI20045501A7 FI 20045501 A7 FI20045501 A7 FI 20045501A7 FI 20045501 A FI20045501 A FI 20045501A FI 20045501 A FI20045501 A FI 20045501A FI 20045501 A7 FI20045501 A7 FI 20045501A7
Authority
FI
Finland
Prior art keywords
conductor pattern
connection pad
manufacturing
wiring pattern
wiring
Prior art date
Application number
FI20045501A
Other languages
Finnish (fi)
Swedish (sv)
Other versions
FI20045501L (en
FI20045501A0 (en
Inventor
Seppo Ilmari Leppävuori
Juha Hagberg
Teija Kekonen
Janne Mettovaara
Original Assignee
Selmic Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Selmic Oy filed Critical Selmic Oy
Priority to FI20045501A priority Critical patent/FI20045501A7/en
Publication of FI20045501A0 publication Critical patent/FI20045501A0/en
Priority to PCT/FI2005/050466 priority patent/WO2006067280A1/en
Publication of FI20045501L publication Critical patent/FI20045501L/en
Publication of FI20045501A7 publication Critical patent/FI20045501A7/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H05K1/187—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding the patterned circuits being prefabricated circuits, which are not yet attached to a permanent insulating substrate, e.g. on a temporary carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

&sr;Ett ledningsmönster (100) bildas elektrolytiskt i öppningar av en mönstrad fotoresist (108) ovanpå ett separerande skikt (101). Ledningsmönstret (100) kan lösgöras från ett hjälpunderlag (106) med hjälp av det separerande skiktet (101). Ledningsmönstret (100) kan användas för framställning av ett kopplingsunderlag och komponenter kan inbäddas i kopplingsunderlaget.&sr;A wiring pattern (100) is electrolytically formed in openings of a patterned photoresist (108) on top of a separating layer (101). The wiring pattern (100) can be detached from an auxiliary substrate (106) using the separating layer (101). The wiring pattern (100) can be used to produce a wiring substrate and components can be embedded in the wiring substrate.

FI20045501A 2004-12-23 2004-12-23 Conductor pattern, connection pad and method of manufacturing conductor pattern and connection pad FI20045501A7 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FI20045501A FI20045501A7 (en) 2004-12-23 2004-12-23 Conductor pattern, connection pad and method of manufacturing conductor pattern and connection pad
PCT/FI2005/050466 WO2006067280A1 (en) 2004-12-23 2005-12-20 Conductive pattern, circuit board and their production method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20045501A FI20045501A7 (en) 2004-12-23 2004-12-23 Conductor pattern, connection pad and method of manufacturing conductor pattern and connection pad

Publications (3)

Publication Number Publication Date
FI20045501A0 FI20045501A0 (en) 2004-12-23
FI20045501L FI20045501L (en) 2006-06-24
FI20045501A7 true FI20045501A7 (en) 2006-06-24

Family

ID=33548097

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20045501A FI20045501A7 (en) 2004-12-23 2004-12-23 Conductor pattern, connection pad and method of manufacturing conductor pattern and connection pad

Country Status (2)

Country Link
FI (1) FI20045501A7 (en)
WO (1) WO2006067280A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101636041B (en) * 2008-07-24 2011-05-11 富葵精密组件(深圳)有限公司 Substrate plane planarization system and method thereof
EP2240005A1 (en) 2009-04-09 2010-10-13 ATOTECH Deutschland GmbH A method of manufacturing a circuit carrier layer and a use of said method for manufacturing a circuit carrier
US8687369B2 (en) 2012-02-20 2014-04-01 Apple Inc. Apparatus for creating resistive pathways
KR101466759B1 (en) * 2012-11-07 2014-11-28 주식회사 잉크테크 Manufacturing for metal printed circuit board
KR102035378B1 (en) * 2015-06-08 2019-11-18 주식회사 엘지화학 A laminate structure with metal wiring layer and a process for manufacturing same
CN107484334A (en) * 2016-06-07 2017-12-15 鹏鼎控股(深圳)股份有限公司 Circuit board and circuit board manufacturing method

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL108173C (en) * 1954-06-25
US3024151A (en) * 1957-09-30 1962-03-06 Automated Circuits Inc Printed electrical circuits and method of making the same
US4606787A (en) * 1982-03-04 1986-08-19 Etd Technology, Inc. Method and apparatus for manufacturing multi layer printed circuit boards
JPS60147192A (en) * 1984-01-11 1985-08-03 株式会社日立製作所 Method of producing printed circuit board
JPS62276894A (en) * 1986-02-21 1987-12-01 株式会社メイコー Manufacture of conductor circuit board with through hole
JPH0964514A (en) * 1995-08-29 1997-03-07 Matsushita Electric Works Ltd Production of printed wiring board
US6871396B2 (en) * 2000-02-09 2005-03-29 Matsushita Electric Industrial Co., Ltd. Transfer material for wiring substrate
JP2003347149A (en) * 2002-05-23 2003-12-05 Nitto Denko Corp Metal transfer sheet, method for manufacturing metal transfer sheet, and method for manufacturing ceramic capacitor
EP1542519A4 (en) * 2002-07-31 2010-01-06 Sony Corp INTEGRATED DEVICE CARD REALIZATION METHOD, INTEGRATED DEVICE CARD, PRINTED CARD PRODUCTION METHOD, PRINTED CARD
US6898850B2 (en) * 2002-08-06 2005-05-31 Matsushita Electric Industrial Co., Ltd. Method of manufacturing circuit board and communication appliance

Also Published As

Publication number Publication date
FI20045501L (en) 2006-06-24
WO2006067280A1 (en) 2006-06-29
FI20045501A0 (en) 2004-12-23

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Legal Events

Date Code Title Description
PC Transfer of assignment of patent

Owner name: ASPOCOMP TECHNOLOGY OY

Free format text: ASPOCOMP TECHNOLOGY OY

PC Transfer of assignment of patent

Owner name: SELMIC OY

Free format text: SELMIC OY

FD Application lapsed