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FI20030071A7 - Kameramoduulin sijoittaminen kannettavaan laitteeseen - Google Patents

Kameramoduulin sijoittaminen kannettavaan laitteeseen Download PDF

Info

Publication number
FI20030071A7
FI20030071A7 FI20030071A FI20030071A FI20030071A7 FI 20030071 A7 FI20030071 A7 FI 20030071A7 FI 20030071 A FI20030071 A FI 20030071A FI 20030071 A FI20030071 A FI 20030071A FI 20030071 A7 FI20030071 A7 FI 20030071A7
Authority
FI
Finland
Prior art keywords
camera module
circuit board
placing
portable device
zone
Prior art date
Application number
FI20030071A
Other languages
English (en)
Swedish (sv)
Other versions
FI20030071A0 (fi
FI20030071L (fi
Inventor
Janne Haavisto
Jari Hiltunen
Original Assignee
Nokia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Corp filed Critical Nokia Corp
Priority to FI20030071A priority Critical patent/FI20030071L/fi
Publication of FI20030071A0 publication Critical patent/FI20030071A0/fi
Priority to AT04701369T priority patent/ATE325524T1/de
Priority to KR1020057013123A priority patent/KR100696429B1/ko
Priority to EP04701369A priority patent/EP1584222B1/en
Priority to JP2005518702A priority patent/JP2006516358A/ja
Priority to DE602004000813T priority patent/DE602004000813T2/de
Priority to CNA2004800023845A priority patent/CN1799291A/zh
Priority to PCT/FI2004/000014 priority patent/WO2004066692A1/en
Priority to US10/760,120 priority patent/US20040212718A1/en
Publication of FI20030071A7 publication Critical patent/FI20030071A7/fi
Publication of FI20030071L publication Critical patent/FI20030071L/fi

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00—Television systems
    • H04N7/14—Systems for two-way working
    • H04N7/141—Systems for two-way working between two video terminals, e.g. videophone
    • H04N7/142—Constructional details of the terminal equipment, e.g. arrangements of the camera and the display
    • H04N2007/145—Handheld terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

Kannettava elektroninen laite, joka käsittää ainakin kameramoduulin (10) sekä piirilevyn (30) kameramoduulin (10) ja muiden rakenteiden sijoittamista varten. Kameramoduuli (10) käsittää valontuloaukon (12) käsittävän optiikkavyöhykkeen (11), ja liitinvyöhykkeen (14), joka käsittää kontaktit (15) kameramoduulin (10) liittämiseksi vastakontakteihin (22, 32). Laitteessa kameramoduulin (10) optiikkavyöhyke (11) ja liitinvyöhyke (14) ovat sijoittuneet piirilevyn (30) eri puolille. Lisäksi keksintö käsittää kameramoduulin (10), kehysrakenteen (20), piirilevyn (30), kehysrakenteen (20) ja piirilevyn (30) yhdistelmän sekä menetelmän kameramoduulin sijoittamiseksi kannettavaan elektroniseen laitteeseen. Fig. 1
FI20030071A 2003-01-17 2003-01-17 Kameramoduulin sijoittaminen kannettavaan laitteeseen FI20030071L (fi)

Priority Applications (9)

Application Number Priority Date Filing Date Title
FI20030071A FI20030071L (fi) 2003-01-17 2003-01-17 Kameramoduulin sijoittaminen kannettavaan laitteeseen
PCT/FI2004/000014 WO2004066692A1 (en) 2003-01-17 2004-01-12 Placement of a camera module in a portable device
JP2005518702A JP2006516358A (ja) 2003-01-17 2004-01-12 携帯用装置におけるカメラモジュールの配置
KR1020057013123A KR100696429B1 (ko) 2003-01-17 2004-01-12 휴대형 기기에서의 카메라모듈의 배치
EP04701369A EP1584222B1 (en) 2003-01-17 2004-01-12 Placement of a camera module in a portable device
AT04701369T ATE325524T1 (de) 2003-01-17 2004-01-12 Plazierung eines kameramoduls in einem tragbaren gerät
DE602004000813T DE602004000813T2 (de) 2003-01-17 2004-01-12 Plazierung eines kameramoduls in einem tragbaren gerät
CNA2004800023845A CN1799291A (zh) 2003-01-17 2004-01-12 照相机模块在便携式设备中的安置
US10/760,120 US20040212718A1 (en) 2003-01-17 2004-01-16 Placement of a camera module in a portable device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20030071A FI20030071L (fi) 2003-01-17 2003-01-17 Kameramoduulin sijoittaminen kannettavaan laitteeseen

Publications (3)

Publication Number Publication Date
FI20030071A0 FI20030071A0 (fi) 2003-01-17
FI20030071A7 true FI20030071A7 (fi) 2004-07-18
FI20030071L FI20030071L (fi) 2004-07-18

Family

ID=8565357

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20030071A FI20030071L (fi) 2003-01-17 2003-01-17 Kameramoduulin sijoittaminen kannettavaan laitteeseen

Country Status (9)

Country Link
US (1) US20040212718A1 (fi)
EP (1) EP1584222B1 (fi)
JP (1) JP2006516358A (fi)
KR (1) KR100696429B1 (fi)
CN (1) CN1799291A (fi)
AT (1) ATE325524T1 (fi)
DE (1) DE602004000813T2 (fi)
FI (1) FI20030071L (fi)
WO (1) WO2004066692A1 (fi)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7495702B2 (en) * 2004-02-09 2009-02-24 Nokia Corporation Portable electronic device with camera
KR100652751B1 (ko) 2005-08-06 2006-12-01 엘지전자 주식회사 카메라 및 기판 지지용 지지부재를 구비한 휴대용 단말기
CN100502165C (zh) * 2005-12-02 2009-06-17 鸿富锦精密工业（深圳）有限公司 数码相机模组的治具
US7268335B2 (en) * 2006-01-27 2007-09-11 Omnivision Technologies, Inc. Image sensing devices, image sensor modules, and associated methods
KR101162215B1 (ko) * 2006-08-22 2012-07-04 엘지전자 주식회사 이동통신 단말기
DE102006039654A1 (de) * 2006-08-24 2008-03-13 Valeo Schalter Und Sensoren Gmbh Kamerasystem, inbesondere für ein Umfelderfassungssystem eines Fahrzeugs, und Montageverfahren
KR101294428B1 (ko) * 2007-01-17 2013-08-07 엘지이노텍 주식회사 카메라 모듈 조립체
DE102008062261A1 (de) 2008-12-15 2010-06-17 Amphenol-Tuchel-Electronics Gmbh Skalierbarer Kamerakontaktblock, Verfahren zur Herstellung des Kamerakontaktblocks und Verfahren zum Einbau insbesondere einer SMD-Kamera in das Gehäuse eines Mobiltelefons
DE102010010405A1 (de) 2010-03-05 2011-09-08 Conti Temic Microelectronic Gmbh Optische Vorrichtung und Verfahren zur Ausrichtung und Fixierung der optischen Vorrichtung
US8339787B2 (en) 2010-09-08 2012-12-25 Apple Inc. Heat valve for thermal management in a mobile communications device
KR101860156B1 (ko) * 2011-06-03 2018-05-21 엘지이노텍 주식회사 카메라 모듈
CN106982524B (zh) * 2017-04-26 2019-05-21 Oppo广东移动通信有限公司 显示组件及移动终端
CN106982525B (zh) * 2017-04-26 2019-05-21 Oppo广东移动通信有限公司 显示组件及移动终端
KR20230087825A (ko) * 2021-12-10 2023-06-19 삼성전자주식회사 카메라 모듈을 포함하는 전자 장치

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3836235B2 (ja) * 1997-12-25 2006-10-25 松下電器産業株式会社 固体撮像装置及びその製造方法
JP3607160B2 (ja) * 2000-04-07 2005-01-05 三菱電機株式会社 撮像装置
JP2001358997A (ja) * 2000-06-12 2001-12-26 Mitsubishi Electric Corp 半導体装置
JP4405062B2 (ja) * 2000-06-16 2010-01-27 株式会社ルネサステクノロジ 固体撮像装置
EP1180718A1 (fr) * 2000-08-11 2002-02-20 EM Microelectronic-Marin SA Appareil de prise d'images de petites dimensions, notamment appareil photographique ou caméra
US7304684B2 (en) * 2000-11-14 2007-12-04 Kabushiki Kaisha Toshiba Image pickup apparatus, method of making, and electric apparatus having image pickup apparatus
JP3630096B2 (ja) * 2000-11-30 2005-03-16 三菱電機株式会社 撮像装置搭載携帯電話機
JP2002252797A (ja) * 2001-02-26 2002-09-06 Sony Corp 固体撮像装置

Also Published As

Publication number Publication date
JP2006516358A (ja) 2006-06-29
DE602004000813D1 (de) 2006-06-08
EP1584222A1 (en) 2005-10-12
WO2004066692A1 (en) 2004-08-05
DE602004000813T2 (de) 2006-11-02
EP1584222B1 (en) 2006-05-03
ATE325524T1 (de) 2006-06-15
FI20030071A0 (fi) 2003-01-17
KR100696429B1 (ko) 2007-03-19
CN1799291A (zh) 2006-07-05
FI20030071L (fi) 2004-07-18
US20040212718A1 (en) 2004-10-28
KR20050094034A (ko) 2005-09-26

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