[go: up one dir, main page]

FI20030508A0 - Hapeton kupariseos - Google Patents

Hapeton kupariseos

Info

Publication number
FI20030508A0
FI20030508A0 FI20030508A FI20030508A FI20030508A0 FI 20030508 A0 FI20030508 A0 FI 20030508A0 FI 20030508 A FI20030508 A FI 20030508A FI 20030508 A FI20030508 A FI 20030508A FI 20030508 A0 FI20030508 A0 FI 20030508A0
Authority
FI
Finland
Prior art keywords
oxygen
copper alloy
free copper
free
alloy
Prior art date
Application number
FI20030508A
Other languages
English (en)
Swedish (sv)
Inventor
Ilm. Myoeh.
Original Assignee
Outokumpu Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Outokumpu Oy filed Critical Outokumpu Oy
Priority to FI20030508A priority Critical patent/FI20030508A0/fi
Publication of FI20030508A0 publication Critical patent/FI20030508A0/fi
Priority to FI20040375A priority patent/FI119646B/fi
Priority to TW093108493A priority patent/TW200426231A/zh
Priority to PCT/FI2004/000203 priority patent/WO2004087976A1/en
Priority to EP04725401A priority patent/EP1608788A1/en
Priority to US10/551,477 priority patent/US20060198757A1/en
Priority to CNA2004800087052A priority patent/CN1798854A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
FI20030508A 2003-04-03 2003-04-03 Hapeton kupariseos FI20030508A0 (fi)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FI20030508A FI20030508A0 (fi) 2003-04-03 2003-04-03 Hapeton kupariseos
FI20040375A FI119646B (fi) 2003-04-03 2004-03-10 Hapeton kupariseos ja menetelmä sen valmistamiseksi sekä kupariseoksen käyttö
TW093108493A TW200426231A (en) 2003-04-03 2004-03-29 Oxygen-free copper alloy and method for its manufacture and use of copper alloy
PCT/FI2004/000203 WO2004087976A1 (en) 2003-04-03 2004-04-02 Oxygen-free copper alloy and method for its manufacture and use of copper alloy
EP04725401A EP1608788A1 (en) 2003-04-03 2004-04-02 Oxygen-free copper alloy and method for its manufacture and use of copper alloy
US10/551,477 US20060198757A1 (en) 2003-04-03 2004-04-02 Oxygen-free copper alloy and method for its manufacture and use of copper alloy
CNA2004800087052A CN1798854A (zh) 2003-04-03 2004-04-02 无氧铜合金和它的生产方法以及铜合金的应用

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20030508A FI20030508A0 (fi) 2003-04-03 2003-04-03 Hapeton kupariseos

Publications (1)

Publication Number Publication Date
FI20030508A0 true FI20030508A0 (fi) 2003-04-03

Family

ID=8565920

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20030508A FI20030508A0 (fi) 2003-04-03 2003-04-03 Hapeton kupariseos

Country Status (6)

Country Link
US (1) US20060198757A1 (fi)
EP (1) EP1608788A1 (fi)
CN (1) CN1798854A (fi)
FI (1) FI20030508A0 (fi)
TW (1) TW200426231A (fi)
WO (1) WO2004087976A1 (fi)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110603338B (zh) 2017-05-10 2024-11-15 托普索公司 降低金属铜中氧含量的方法
CN111549254A (zh) * 2020-04-29 2020-08-18 铜陵有色金属集团股份有限公司金威铜业分公司 一种无氧铜基微合金及其制备方法和应用
JP7205567B2 (ja) * 2021-05-31 2023-01-17 三菱マテリアル株式会社 銅合金塑性加工材、銅合金棒材、電子・電気機器用部品、端子
KR20230031230A (ko) * 2020-06-30 2023-03-07 미쓰비시 마테리알 가부시키가이샤 구리 합금 소성 가공재, 구리 합금 봉재, 전자·전기 기기용 부품, 단자
JP7120389B1 (ja) 2021-05-31 2022-08-17 三菱マテリアル株式会社 銅合金塑性加工材、銅合金線材、電子・電気機器用部品、端子
JP7136157B2 (ja) 2020-06-30 2022-09-13 三菱マテリアル株式会社 銅合金、銅合金塑性加工材、電子・電気機器用部品、端子
WO2022004779A1 (ja) * 2020-06-30 2022-01-06 三菱マテリアル株式会社 銅合金、銅合金塑性加工材、電子・電気機器用部品、端子、バスバー、リードフレーム、放熱基板
CN115735013B (zh) * 2020-06-30 2024-01-26 三菱综合材料株式会社 铜合金塑性加工材、铜合金线材、电子电气设备用组件及端子
JP7793982B2 (ja) * 2021-12-28 2026-01-06 三菱マテリアル株式会社 銅合金、銅合金塑性加工材、電子・電気機器用部品、端子、バスバー、リードフレーム、放熱基板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4749548A (en) * 1985-09-13 1988-06-07 Mitsubishi Kinzoku Kabushiki Kaisha Copper alloy lead material for use in semiconductor device
JPH03291340A (ja) * 1990-04-10 1991-12-20 Mitsubishi Materials Corp 半導体装置用銅合金極細線及び半導体装置
JP2662209B2 (ja) * 1995-10-05 1997-10-08 古河電気工業株式会社 メッキ密着性及びハンダ接合性に優れた電子機器用銅合金とその製造法
JP2898627B2 (ja) * 1997-03-27 1999-06-02 日鉱金属株式会社 銅合金箔
JP3957391B2 (ja) * 1998-03-06 2007-08-15 株式会社神戸製鋼所 剪断加工性に優れる高強度、高導電性銅合金

Also Published As

Publication number Publication date
WO2004087976A1 (en) 2004-10-14
US20060198757A1 (en) 2006-09-07
EP1608788A1 (en) 2005-12-28
TW200426231A (en) 2004-12-01
CN1798854A (zh) 2006-07-05

Similar Documents

Publication Publication Date Title
PT1697561T (pt) Eletrodeposição de cobre em microeletrónica
DE602004011631D1 (de) Verschleissfeste legierung auf kupferbasis
DE112004003147A5 (de) Al-Zn-Mg-Cu-Legierung
DE502004003964D1 (de) Metallkomplexe
TWI371499B (en) Copper alloy
EP1529126A4 (en) SOLUTIONS FOR GALVANIC COPPER
DE50309710D1 (de) Metallelektrode
DE602004001404D1 (de) Metallkapselung
ATA18042003A (de) Aluminiumlegierung
EP1731624A4 (en) Copper alloy and method for production thereof
DE602004020396D1 (de) Leitfähige metallpaste
DE602004006951D1 (de) Leitfähige paste
NO2015005I1 (no) Flutemetamol (18F)
DE60313879D1 (de) Amorphe legierung auf kupfer-basis
EP1873266A4 (en) COPPER ALLOY
DE602005015496D1 (de) Bleifreier Kupferlegierungs-Gleitwerkstoff
DE60214976D1 (de) Verschleissfeste kupferbasislegierung
DE602004029302D1 (de) Stromrichterschaltung
EP1669153A4 (en) ASSEMBLED COPPER / ALUMINUM STRUCTURE
FI20030508A0 (fi) Hapeton kupariseos
DE602004021693D1 (de) Gewinnung von platingruppenmetallen
ATE454987T1 (de) Verbindungsschaltung
DE60336844D1 (de) Feinteiliges kupfer-pyrithion
NO20034731D0 (no) Aluminiumslegering
FI20031082L (fi) Menetelmä kuparirikasteiden sulattamiseksi

Legal Events

Date Code Title Description
FD Application lapsed