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FI20020968A0 - Förfarande och laseranordning för att producera en stor optisk effekttäthet - Google Patents

Förfarande och laseranordning för att producera en stor optisk effekttäthet

Info

Publication number
FI20020968A0
FI20020968A0 FI20020968A FI20020968A FI20020968A0 FI 20020968 A0 FI20020968 A0 FI 20020968A0 FI 20020968 A FI20020968 A FI 20020968A FI 20020968 A FI20020968 A FI 20020968A FI 20020968 A0 FI20020968 A0 FI 20020968A0
Authority
FI
Finland
Prior art keywords
laser device
optical power
power density
producing high
high optical
Prior art date
Application number
FI20020968A
Other languages
English (en)
Finnish (fi)
Other versions
FI116010B (sv
Inventor
Taito Alahautala
Erkki Lassila
Original Assignee
Oseir Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oseir Oy filed Critical Oseir Oy
Priority to FI20020968A priority Critical patent/FI116010B/sv
Publication of FI20020968A0 publication Critical patent/FI20020968A0/sv
Priority to AU2003240879A priority patent/AU2003240879A1/en
Priority to JP2004506142A priority patent/JP2005531135A/ja
Priority to EP03730245.2A priority patent/EP1532718B1/en
Priority to CNB038176610A priority patent/CN100375354C/zh
Priority to PCT/FI2003/000386 priority patent/WO2003098758A1/en
Priority to US10/515,023 priority patent/US7817693B2/en
Priority to ES03730245T priority patent/ES2431308T3/es
Application granted granted Critical
Publication of FI116010B publication Critical patent/FI116010B/sv

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0004Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
    • G02B19/0028Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed refractive and reflective surfaces, e.g. non-imaging catadioptric systems
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0047Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
    • G02B19/0052Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a laser diode
    • G02B19/0057Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a laser diode in the form of a laser diode array, e.g. laser diode bar
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10Beam splitting or combining systems
    • G02B27/14Beam splitting or combining systems operating by reflection only
    • G02B27/145Beam splitting or combining systems operating by reflection only having sequential partially reflecting surfaces
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/40Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4012Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/40Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/40Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4087Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Semiconductor Lasers (AREA)
FI20020968A 2002-05-22 2002-05-22 Förfarande och laseranordning för att producera en stor optisk effekttäthet FI116010B (sv)

Priority Applications (8)

Application Number Priority Date Filing Date Title
FI20020968A FI116010B (sv) 2002-05-22 2002-05-22 Förfarande och laseranordning för att producera en stor optisk effekttäthet
AU2003240879A AU2003240879A1 (en) 2002-05-22 2003-05-20 A method and a laser device for producing high optical power density
JP2004506142A JP2005531135A (ja) 2002-05-22 2003-05-20 高光学出力密度を生成するための方法およびレーザ装置
EP03730245.2A EP1532718B1 (en) 2002-05-22 2003-05-20 A method and a laser device for producing high optical power density
CNB038176610A CN100375354C (zh) 2002-05-22 2003-05-20 产生高光功率密度的方法和激光设备
PCT/FI2003/000386 WO2003098758A1 (en) 2002-05-22 2003-05-20 A method and a laser device for producing high optical power density
US10/515,023 US7817693B2 (en) 2002-05-22 2003-05-20 Method and a laser device for producing high optical power density
ES03730245T ES2431308T3 (es) 2002-05-22 2003-05-20 Un procedimiento y un dispositivo láser de producción de densidad de potencia óptica elevada

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20020968 2002-05-22
FI20020968A FI116010B (sv) 2002-05-22 2002-05-22 Förfarande och laseranordning för att producera en stor optisk effekttäthet

Publications (2)

Publication Number Publication Date
FI20020968A0 true FI20020968A0 (sv) 2002-05-22
FI116010B FI116010B (sv) 2005-08-31

Family

ID=8563991

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20020968A FI116010B (sv) 2002-05-22 2002-05-22 Förfarande och laseranordning för att producera en stor optisk effekttäthet

Country Status (8)

Country Link
US (1) US7817693B2 (sv)
EP (1) EP1532718B1 (sv)
JP (1) JP2005531135A (sv)
CN (1) CN100375354C (sv)
AU (1) AU2003240879A1 (sv)
ES (1) ES2431308T3 (sv)
FI (1) FI116010B (sv)
WO (1) WO2003098758A1 (sv)

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US7515346B2 (en) 2006-07-18 2009-04-07 Coherent, Inc. High power and high brightness diode-laser array for material processing applications
US8416830B2 (en) * 2008-12-03 2013-04-09 Ipg Photonics Corporation Wavelength stabilized light emitter and system for protecting emitter from backreflected light
US9823480B2 (en) 2012-02-22 2017-11-21 TeraDiode, Inc. Wavelength beam combining laser systems with micro-optics
US9166369B2 (en) 2013-04-09 2015-10-20 Nlight Photonics Corporation Flared laser oscillator waveguide
US9214786B2 (en) 2013-04-09 2015-12-15 Nlight Photonics Corporation Diode laser packages with flared laser oscillator waveguides
JP6285650B2 (ja) * 2013-07-03 2018-02-28 浜松ホトニクス株式会社 レーザ装置
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WO2017127713A1 (en) * 2016-01-20 2017-07-27 Telebrands Corp. Illuminating apparatus
US9902911B1 (en) 2016-08-02 2018-02-27 Honeywell Limited Method for on-line imaging of mesophase particles
EP4154055A1 (en) 2020-06-15 2023-03-29 Univerza V Ljubljani A device and a method for speckle-free laser illumination
DE102020118421B4 (de) * 2020-07-13 2023-08-03 Focuslight Technologies Inc. Laservorrichtung
CN112909725B (zh) * 2021-01-13 2022-05-20 华中科技大学 基于星形反射的蓝光半导体激光器波长合束装置及方法
CN113552726A (zh) * 2021-07-12 2021-10-26 广东粤港澳大湾区硬科技创新研究院 激光合束装置及其组合式阶梯反射镜和填充率计算方法
CN118151477A (zh) * 2022-12-07 2024-06-07 晶典有限公司 Rgb三色雷射光源合成及光束分光装置
WO2025145164A1 (en) * 2023-12-29 2025-07-03 Leonardo Electronics Us Inc. Dual laser assembly

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Also Published As

Publication number Publication date
US20060098700A1 (en) 2006-05-11
EP1532718A1 (en) 2005-05-25
AU2003240879A1 (en) 2003-12-02
CN100375354C (zh) 2008-03-12
ES2431308T3 (es) 2013-11-25
WO2003098758A1 (en) 2003-11-27
FI116010B (sv) 2005-08-31
US7817693B2 (en) 2010-10-19
EP1532718B1 (en) 2013-07-17
JP2005531135A (ja) 2005-10-13
CN1672303A (zh) 2005-09-21

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