FI106736B - Aerial under floor construction in a building - Google Patents

Description

106736

Ventilated floor structure of the building

Background of the Invention

The present invention relates to a ventilated subfloor structure of a building comprising load-bearing floor beams, a heat sink 5 structure, and a floor structure mounted on top of the floor beams.

In such a structure, the thermal insulation is traditionally provided by a thermal insulation installed between the floor beams, for example mineral wool, which is supported by a planking or slab attached to the underside of the floor beams.

10 The problem with the bottom sole structure described above is the so-called bottom sole. humidity in the crawl space, which for many reasons is often too high, causing rot and mold damage to the subfloor. When, as a rule, load-bearing structures of biodegradable material, usually wood, are thus damaged, the cost of repair will be disproportionate, not to mention the health problems caused by mold that may have spread throughout the structure.

Excessive humidity is caused by inadequate ventilation of the crawl space, too low crawl space, location of the crawl space lower than the surface of the outside of the plinth of the building, insufficient or inadequate insulation of the ground, lower temperature of the crawl space, humidity from the inside, through the bottom of the inert and room temperature at different temperatures, etc. Thus, for these reasons, moisture-related decay damage occurs in about half of the crawl space and mild 25 mold growth in almost all.

However, the ventilated underfloor solution is a good solution when operating and is recommended especially in radon areas as it significantly reduces the amount of radon rising from the ground.

However, even if proper construction is to avoid all of the above-mentioned causes of excessive humidity, for example, the amount of humidity rising from the ground is not always accurately known and high ground heat capacity causes the creep temperatures to not follow the outdoor temperatures. To minimize these problems, the house should be built on pillars or 35 crawl spaces should be man-sized in addition to minimizing all other moisture-generating factors, but this is often not possible, but requires a reasonable height of up to about one meter in height. blinds with vents.

If the relative humidity of the air is high and the average crawl space temperature is lower than the average outdoor temperature, the condensation of moisture to the substrate 5 structures and thus the damage to the biodegradable structures could not be completely prevented. The coldest surfaces, the edges of the plinth and the bottom, are the first to be at risk. Thus, prior art boarding or paneling, or even load-bearing beams, attached to the underside of load-bearing beams may be in danger of decomposing and mildewing, even if all current regulations were followed in construction.

Known base structures are shown e.g. RT K-30916 in the HomeCon Brochure (1988) and U.S. Patent 5,729,940. RT K-30916 discloses the conventional use of styrofoam as an additional insulator for the underfloor, whereby it is installed on the underside of the floor beams. The actual insulating material is a chipping filler. The HomeCon brochure and U.S. Patent 5,729,940 disclose a styrofoam insulated on the underside of a concrete concrete floor.

DESCRIPTION OF THE INVENTION

It is an object of the present invention to eliminate the above drawbacks in a structure of the type mentioned above without necessarily having to abandon completely the use of biodegradable materials, especially in load-bearing beams. This object is achieved by a base structure according to the invention, characterized in that the thermal insulation structure consists essentially of a dense, moisture impermeable structure attached to the underside of the floor beams, and that at least the film on the underside of the dielectric structure is heat-reflective.

Preferably, the insulating structure below comprises an insulating material selected from the group consisting of polyurethane and polystyrene.

Both sides are coated, even if the material itself is non-biodegradable. For example, in the case of EPS polystyrene, this is also necessary because of its open cellularity.

The invention is based on the idea of insulating the underfloor structure at substantially the same temperature with the room air of the building with an insulating structure where at least its exterior surfaces are impermeable to moisture, preventing the main moisture or accumulation in the underfloor structure.

It is also preferred that at least the lower surface of the dielectric structure is designed to have low emissivity, since this property increases the temperature of said surface and the space below it, which in turn reduces condensation on said surface. The low emissivity can be achieved by means of a glossy surface, for example by using an aluminum film which may still be lacquered. The lacquer coating prevents oxidation of the aluminum surface, whereby the gloss of the surface is retained and the impurities impinging on the surface 10 do not adhere to it.

In practice, the dielectric structure may be formed from elements having the dielectric structure described above and interconnected by points which form a wedge-shaped upward opening for the sealant. The wedge-shaped slot allows the sealing foam to expand upwards, which prevents the elements from tearing apart.

Advantages of the subfloor structure according to the invention over traditional mineral wool insulation subfloor are: - load-bearing structures are located in low relative humidity 20 - the underfloor with joints and pipe penetrations can be implemented very tightly - low heat penetration coefficient of the structure without damaging the structure - water damage caused by pipeline leakage can be repaired without dismantling the structure - completely sealed against radon.

Since the load-bearing floor batten is located completely above the insulating structure 30, there is an approximate indoor heat and humidity condition.

• <Under these conditions, the wood will remain undamaged for a very long time. Even with occasional high levels of relative humidity in the air, sudden changes in humidity are not reflected in the air surrounding the beams due to the floor structure. If the space between the beams is ventilated to 35 rooms via baseboards, the humidity conditions also vary between the space between the beams 4 106736. With humidity levels within the normal range, this does not harm the construction.

Carefully sealing the insulating structure elements will result in a very tight construction of the underfloor structure, both in terms of air and moisture. At the same time, it is possible to make sure that the joint is successful. Critical points of tightness, such as plinth joints, fireplace and chimney joints, are made more tight than mineral wool insoles. This avoids tedious flooring in the edges. Also, the pipe-inlets can be easily sealed with a seam foam.

10 The heat transfer coefficient of the underfloor is lowered by an insulating layer less than half that of polyurethane.

In a ventilated crawl space, especially in late summer, humidity conditions are favorable for mold and rotting fungi. This requires a suitable growth and nutrient medium. When the bottom floor structure of the invention is completely organic-free, it is not prone to biological degradation by mold and decay fungi.

In the structure, there is an empty space between the load-bearing floor beam between the insulating structure and any soundproofing material. The height of the free space depends on the height of the floor beam used. The empty space can be utilized 20 for transporting pipes and various wiring in the structure as needed. This allows the pipes to be transported in a warm environment without risk of freezing. Larger tubes in the structure can only be transported parallel to the beams. Smaller piping and wiring can also be done through the load-bearing beams and between the beams' insulation layer.

·. 25 If water enters the floor structure for any reason, the structure can be easily dried without breaking it. This may be due, for example, to breakage of the pipes passing between the beams. Damaged pipe can be repaired through the bottom by sawing a sufficiently large service opening in the underfloor structure to carry out the repair. After repair, the underfloor structure can be dried by providing mechanical ventilation in the cavity above the underfloor insulation layer. When the floor structure has dried, the openings created during repair and drying are patched with a sheet of the same insulation structure and sealant foam. In addition, humidity sensors can be permanently installed in the underfloor structure to detect any water damage early enough.

5, 106736

A small temporary amount of water entering the underfloor structure will not cause moisture problems when pads are installed between the insulation structure and the floor beams to prevent water from contacting the floor beams and because of the ability to evaporate - 5.0 kg / day.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will now be explained in more detail with reference to the accompanying drawings, in which: Figure 1 shows a cross-sectional view of a bottom floor structure according to the invention in the direction of load-bearing floor beams;

Figure 2 is a cross-sectional view of the bottom floor construction of the invention in transverse direction to the load-bearing floor beams; and

Fig. 3 shows a tongue and groove joint between the insulating panels according to the invention.

DETAILED DESCRIPTION OF THE INVENTION

2 and 3 comprise a load-bearing floor beams 3 supported on a building foundation, e.g., a block or concrete plinth 1, a heat insulating structure 4 mounted on the lower surface of the beams 3, and a sound insulation 5 mounted in the upper space between the beams 3, and a floor structure 6 mounted on the upper surface of the beams 3.

• The load-bearing beams 3 can be all conventional solutions, such as beams of wood, solid wood and glulam. Thin-core beams such as titanium, grid, 25 and grate beams are also suitable as load-bearing structures. Since no cold bridges are created with respect to the location of the insulating layer 4, in principle, materials with a higher thermal conductivity, such as steel, can also be used.

The floor structure 6 can again be any sub-area of this type. · A solution used in connection with a base structure, such as a board floor, a plasterboard or particle board board and a surface material such as parquet, cork, plastic mat, cork, etc. for the step-sound insulation, the floor structure chosen by itself 6. However, in most cases a soft mineral wool of about 50 mm thickness provides good sound insulation. The soundproofing material 5 is supported, for example, by a porous fiber board 35 or a thin board 7 supported on beams 3 by battens 8.

e 106736

The lower thermal insulating structure 4 is a dense, moisture impermeable structure, most preferably comprising a layer of insulating material 9 which is a cellular plastic such as polyurethane or polystyrene (EPS or XPS polystyrene). The best choice is polyurethane, whose propellant pentane is an insulator that is 5 clearer than air.

However, the thermal conductivity of unprotected polyurethane degrades over time. This is because the air tends to penetrate the cellular plastic and the cellular gas exits accordingly. This phenomenon is considerably slowed down when the insulating material is coated on both sides with a dense, wear-resistant bioha-10 impermeable film 10, for example, a 50 μητη thick aluminum film. In addition, from the viewpoint of surface emissivity, it is advantageous for the film to be as heat-reflecting as possible, i.e. having low emissivity. For this reason, it is also preferred that the film is, for example, lacquered, which prevents oxidation of the aluminum surface in particular. As the surface of the film 10 remains shiny, the emissivity of the surface 15 remains low. This is particularly important on the underside of the dielectric structure in order to keep the surface and the space below it as high as possible.

In practice, the insulating structure 4 below is formed, as shown in Fig. 3, by interconnected plate elements 11 having male and female 20 tongues 12 and 13 which, when joined together, form a seam having a wedge-up opening 14 for the sealant 15. The seams of the insulating elements 11 and their fastening means 16 (e.g. wooden screws of sufficient length) for securing the beams 3 are sealed from below with aluminum tape (not shown in the drawing). In addition, between the insulating elements 11 and the floor beams 3, prior to attachment of the elements 11, for example, nailing the most preferably plastic platform blocks 17 about 20 mm high, the interior spaces 18 between the beams 3 are in fluid communication with each other. Then, while the floor structure 6 with baseboards 20 is a short distance from the wall 21 of the building, the spaces 18 between the floor beams 3 and thus the entire bottom structure 30 are ventilated to the room 22 of the building. in turn, insulated such that air from creep space 23 does not pass above the insulating structure. This requires an absolute tightness of the joints between the elements 11 as well as the joints between the elements 11 and the building plinth 1, intermediate walls 35, fireplaces, penetrations, etc.

7 106736

The inner surface of the plinth 1 and both sides of the partitions supporting the load-bearing partitions (not shown in the drawing), for example, should be insulated with a urethane plate 24 of about 50 mm thickness and sealed between it and the insulating structure 4. Correspondingly, the spaces between the lower tree 2 and the insulating structure 4 on the lower side of the beams 3 are also filled with strips 25 of urethane, for example, and the seams between them and the insulating structure 4 are sealed.

Preferably, a lightweight gravel or shingle insulating layer 27 having a thickness of about 100 mm is mounted on the ground 26, the gap 28 of which must be at least 600 mm in the creep space between the surface 28 and the bottom. Otherwise, the attachment of the elements 11 already causes difficulties.

The thickness of the insulating structure 4 depends on whether the space above it is made to be ventilated to room air or a closed structure. If the bottom floor structure is made closed, the thermal insulation capacity of the sound insulation 5 may be taken into account. If the sound insulation is a 50 mm thick mineral wool board, then under Finnish conditions the thickness of the polyurethane insulator is 100 mm. If the space between the beams 3 is ventilated to the room air, a thickness of 120 mm is used.

In the present solution, the insulation space is closed, whereby the thermal insulation capacity of the mineral wool 5 used as sound insulation is utilized. However, the mineral wool 5 allows the moisture to evaporate and to promote this, the mineral wool 5 is bent downwards on the walls of the building to increase the evaporation area. In this way, the temporary moisture stress that enters the underfloor structure can be effectively vented.

The insulation elements 11 are preferably 1200 mm long and 900 25 mm wide. The dimensions of the plate are then optimal, taking into account transportation and easy installation. The polyurethane elements 11 then weigh only about 4 kg.

When calculating the thickness of the dielectric structure 4 and choosing the film to be applied to its surface, the following considerations are taken into account: 30 Due to the low thermal conductivity of the air, radiation controls the heat transfer event. Thus, the total thermal resistance of the air gap of the creep space 23 is significantly dependent on the emissivity of the surfaces. In addition, the direction of the heat flux in creep bottom structures is almost invariably down, from warm to cold. All objects with temperatures above an absolute 35 degrees zero emit or emit radiation. Most of the radiation is emitted by the so-called. black piece. The emissivity is called the ratio of the radiated power between the actual surface and the black surface of the 106736 8, whereby the radiated power of the actual surfaces is always less than the black surface. The emissivity of aluminum is about 0.09, while that of wood or fibreboard is about 0.9.

The heat transmittance coefficient, i.e., the k value, describes the heat flux passing through a component of size square meter with a temperature difference of one degree. In Finland, the required k-value for a ventilated sub-floor of a residential building is a maximum of 0.22 W / m2K. Using a polyurethane sheet coated on both sides with a 50 μητη sheet of aluminum gives a k value of 0,189.

Further, it can be noted that, with a k value of 0.2 for the polyurethane insulating structure 4 and a surface emissivity of 0, 09 for an internal temperature of 20 degrees and a surface temperature of 0 degrees respectively, the lower surface of the insulating structure 4 is about 5 degrees larger with an emissivity of 0.9.

The foregoing description of the invention is merely intended to illustrate the basic idea of the invention. The person skilled in the art can thus implement its details in several alternative ways within the scope of the appended claims. Thus, the actual insulating layer could be thought of as non-biodegradable materials as described above, even biodegradable wood fibers or mineral wool, as long as it is enclosed within an absolutely dense, moisture-impermeable biodegradable material.

Claims (11)

A ventilated subfloor structure of a building comprising load-bearing floor beams (3) supported by building foundations, a heat insulation structure (4) and a floor structure (6) mounted on the floor beams, characterized in that the heat insulation structure (4) is essentially impermeable secured to the underside of the floor beams (3), wherein the spaces (18) between the floor beams (3) are substantially free of the actual heat-insulating material, and that the insulating structure below is coated on both sides with a dense, wear-resistant biodegradable film (10) (4) the film (10) on the lower surface is reflective of thermal radiation. A bottom sole structure according to claim 1, characterized in that the lower insulating structure (4) comprises an insulating material (9) selected from a cellular plastic group comprising polyurethane and polystyrene. A bottom sole structure according to claim 1 or 2, characterized in that the membrane (10) is aluminum. Bottom structure according to one of Claims 1 to 3, characterized in that the film (10) is varnished. A bottom sole structure according to claim 1, characterized in that the lower insulating structure comprises a biodegradable material, such as wood fibers or mineral wool, enclosed within a dense, moisture-impermeable and abrasion-resistant biodegradable material. Bottom base structure according to one of the preceding claims, characterized in that the bottom insulating structure (4) comprises interlocking plate elements (11) having male and female tongues (12, 13) which, when joined together, form a joint. having a wedge-shaped upwardly opening slot (14) for the sealant (15). Bottom structure according to Claim 6, characterized in that the seams of the elements (11) and their fastening means (16) are sealed from below with aluminum tape. A floor structure according to any one of the preceding claims, characterized in that the insertion structure (4) and the floor beams (3) are provided with riser blocks (17), whereby the interior spaces (18) between the beams are in fluid communication with each other. 10 106736 Subfloor structure according to Claim 8, characterized in that there is a gap between the floor structure (6) and the wall (21) of the building, whereby the spaces (18) between the floor beams (3) are ventilated to the building room (22). 9 106736 Subfloor structure according to one of the preceding claims, characterized in that it further comprises an insulating structure (5) mainly between the floor structure (6) and the heat insulating structure (4), which at the same time allows the evaporation of moisture to form a wall (21). adjacent is bent downward to increase the evaporation area. 11 106736