ES8608020A1 - Procedimiento de fabricar estratificados para usos electri- cos - Google Patents
Procedimiento de fabricar estratificados para usos electri- cosInfo
- Publication number
- ES8608020A1 ES8608020A1 ES539962A ES539962A ES8608020A1 ES 8608020 A1 ES8608020 A1 ES 8608020A1 ES 539962 A ES539962 A ES 539962A ES 539962 A ES539962 A ES 539962A ES 8608020 A1 ES8608020 A1 ES 8608020A1
- Authority
- ES
- Spain
- Prior art keywords
- epoxy resin
- resin composition
- preparing laminates
- mat
- manufacture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G14/00—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00
- C08G14/02—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes
- C08G14/04—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols
- C08G14/06—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols and monomers containing hydrogen attached to nitrogen
- C08G14/10—Melamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
- C08G59/623—Aminophenols
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
Landscapes
- Chemical & Material Sciences (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Epoxy Resins (AREA)
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
- Processing Of Terminals (AREA)
- Manufacturing Of Electric Cables (AREA)
Abstract
PROCEDIMIENTO PARA LA FABRICACION DE ESTRATIFICADOS QUE TIENEN APLICACION EN EL CAMPO DE LA ELECTRONICA EN LA FABRICACION DE PLACAS ELECTRICAS DE CIRCUITOS IMPRESOS. COMPRENDE LA IMPREGNACION DE BANDAS DE REFUERZO CON UN BARNIZ DE RESINA EPOXIDICA QUE CONTIENE 20-80% DE RESINA, Y UN DISOLVENTE ORGANICO Y UN AGENTE DE CURADO, ADUCTO DE UN FENOL POLIHIDROXILADO Y UN HEXAALQUILETER DE UNA HEXAMETILOLMELAMINA, DE FORMULA (I), EN LA QUE R ES ALQUILO C1-4; CALENTAMIENTO DE LA ESTERILLA ASI PREPARADA A UNA TEMPERATURA COMPRENDIDA ENTRE 100JC Y 200JC; Y TRANSFORMAR LA ESTERILLA CON RESINA EN UN ESTRATIFICADO ADECUADO.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3403172 | 1984-01-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| ES539962A0 ES539962A0 (es) | 1986-04-16 |
| ES8608020A1 true ES8608020A1 (es) | 1986-04-16 |
Family
ID=6226300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES539962A Expired ES8608020A1 (es) | 1984-01-31 | 1985-01-30 | Procedimiento de fabricar estratificados para usos electri- cos |
Country Status (18)
| Country | Link |
|---|---|
| US (1) | US4661568A (es) |
| EP (2) | EP0155469B1 (es) |
| JP (1) | JPS61501154A (es) |
| KR (2) | KR920002615B1 (es) |
| AT (1) | ATE35817T1 (es) |
| AU (1) | AU557131B2 (es) |
| BR (1) | BR8505172A (es) |
| CA (1) | CA1276358C (es) |
| DE (1) | DE3563852D1 (es) |
| DK (1) | DK440085D0 (es) |
| ES (1) | ES8608020A1 (es) |
| FI (1) | FI853743A0 (es) |
| IE (1) | IE57890B1 (es) |
| IL (1) | IL74199A (es) |
| IN (1) | IN164123B (es) |
| NO (1) | NO161266C (es) |
| SG (1) | SG87488G (es) |
| WO (1) | WO1985003515A1 (es) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8519290D0 (en) * | 1985-07-31 | 1985-09-04 | Dow Chemical Rheinwerk Gmbh | Resin composition |
| IL80277A0 (en) * | 1985-10-15 | 1987-01-30 | President Eng Corp | Process for the production of prepregs and metal-laminated base material for circuit boards,and apparatus for carrying out this process |
| US4808652A (en) * | 1988-06-08 | 1989-02-28 | Monsanto Company | Crosslinker compositions comprising amino resins, epoxies and styrene allyl alcohol copolymers |
| US5210157A (en) * | 1989-08-15 | 1993-05-11 | Akzo N.V. | Interpenetrating network of ring-containing allyl polymers and epoxy resin, and a laminate prepared therefrom |
| MY131084A (en) * | 1991-04-03 | 2007-07-31 | Dow Chemical Co | Epoxy resin compositions for use in electrical laminates. |
| US5364925A (en) * | 1992-01-27 | 1994-11-15 | The Dow Chemical Company | Epoxy resin advanced with a dihydric phenol and further chain extended with an additional dihydric phenol for use in electrical laminates |
| CA2199390A1 (en) * | 1994-09-08 | 1996-03-14 | Jan Andre Jozef Schutyser | Allyl-containing epoxy resin composition comprising a copolymer of an ethylenically unsaturated anhydride and a vinyl compound |
| WO1996028490A1 (en) * | 1995-03-14 | 1996-09-19 | Nissan Chemical Industries, Ltd. | Heat-resistant epoxy resin composition |
| ATE210161T1 (de) | 1996-10-29 | 2001-12-15 | Isola Laminate Systems Corp | Copolymer aus styrol und maleinsäureanhydrid enthaltende epoxidharzzusammensetzung und covernetzer |
| JPH11279376A (ja) * | 1998-03-27 | 1999-10-12 | Hitachi Chem Co Ltd | 印刷配線板用エポキシ樹脂組成物およびこれを用いた印刷配線板 |
| US6855738B2 (en) | 2003-06-06 | 2005-02-15 | Dow Global Technologies Inc. | Nanoporous laminates |
| CN103119079A (zh) * | 2010-09-29 | 2013-05-22 | 日本电石工业株式会社 | 三聚氰胺环氧树脂单体及树脂组合物 |
| WO2014059424A2 (en) | 2012-10-12 | 2014-04-17 | High Voltage Graphics, Inc. | Flexible heat sealable decorative articles and method for making the same |
| WO2014070155A1 (en) * | 2012-10-31 | 2014-05-08 | Empire Technology Development Llc | Multifunctional melamine epoxy resins, methylols and amines |
| WO2014126626A1 (en) | 2013-02-15 | 2014-08-21 | Empire Technology Development Llc | Phenolic epoxy compounds |
| US9868683B2 (en) | 2013-06-13 | 2018-01-16 | Empire Technology Development Llc | Multi-functional phenolic resins |
| US10106494B2 (en) | 2013-12-02 | 2018-10-23 | Empire Technology Development Llc | Gemini surfactant and their use |
| US9526185B2 (en) * | 2014-04-08 | 2016-12-20 | Finisar Corporation | Hybrid PCB with multi-unreinforced laminate |
| ES2949449T3 (es) | 2015-02-27 | 2023-09-28 | Huntsman Adv Mat Licensing Switzerland Gmbh | Un proceso para fabricar un artículo compuesto reforzado con fibras, el artículo compuesto obtenido y el uso del mismo |
| CN117120248A (zh) * | 2021-02-16 | 2023-11-24 | 维斯塔斯风力系统有限公司 | 涉及风力涡轮机组件的制造的改进 |
| US20230374337A1 (en) * | 2022-05-20 | 2023-11-23 | Epoxy Technology, Inc. | High performance conformal coatings |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB622675A (en) * | 1946-10-02 | 1949-05-05 | Donald Atherton | Manufacture of new synthetic resinous condensation products |
| US3449228A (en) * | 1965-04-01 | 1969-06-10 | Ppg Industries Inc | Aqueous compositions adapted for electrodeposition |
| US4499268A (en) * | 1982-02-23 | 1985-02-12 | Ciba Geigy Corporation | Process for the preparation of isomelamines |
| US4467070A (en) * | 1982-09-30 | 1984-08-21 | Ford Motor Company | Thermosetting coating composition comprising polymeric catalyst - III |
| US4393181A (en) * | 1982-06-30 | 1983-07-12 | Shell Oil Company | Polyfunctional phenolic-melamine epoxy resin curing agents |
-
1985
- 1985-01-29 CA CA000473035A patent/CA1276358C/en not_active Expired - Fee Related
- 1985-01-30 DE DE8585100914T patent/DE3563852D1/de not_active Expired
- 1985-01-30 BR BR8505172A patent/BR8505172A/pt not_active IP Right Cessation
- 1985-01-30 WO PCT/EP1985/000026 patent/WO1985003515A1/en not_active Ceased
- 1985-01-30 AT AT85100914T patent/ATE35817T1/de not_active IP Right Cessation
- 1985-01-30 JP JP60500642A patent/JPS61501154A/ja active Granted
- 1985-01-30 US US06/776,558 patent/US4661568A/en not_active Expired - Fee Related
- 1985-01-30 KR KR1019850700238A patent/KR920002615B1/ko not_active Expired
- 1985-01-30 IL IL74199A patent/IL74199A/xx unknown
- 1985-01-30 ES ES539962A patent/ES8608020A1/es not_active Expired
- 1985-01-30 EP EP85100914A patent/EP0155469B1/en not_active Expired
- 1985-01-30 EP EP85900668A patent/EP0169865A1/en active Pending
- 1985-01-30 FI FI853743A patent/FI853743A0/fi not_active Application Discontinuation
- 1985-01-30 IE IE224/85A patent/IE57890B1/en not_active IP Right Cessation
- 1985-01-30 AU AU39342/85A patent/AU557131B2/en not_active Ceased
- 1985-01-31 IN IN87/MAS/85A patent/IN164123B/en unknown
- 1985-09-27 DK DK440085A patent/DK440085D0/da not_active Application Discontinuation
- 1985-09-27 NO NO85853822A patent/NO161266C/no unknown
- 1985-09-28 KR KR1019850700238A patent/KR850700252A/ko active Granted
-
1988
- 1988-12-14 SG SG874/88A patent/SG87488G/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| IE850224L (en) | 1985-07-31 |
| IL74199A0 (en) | 1985-04-30 |
| BR8505172A (pt) | 1986-01-21 |
| US4661568A (en) | 1987-04-28 |
| AU3934285A (en) | 1985-08-27 |
| JPS61501154A (ja) | 1986-06-12 |
| EP0155469B1 (en) | 1988-07-20 |
| DE3563852D1 (en) | 1988-08-25 |
| KR850700252A (ko) | 1985-12-26 |
| WO1985003515A1 (en) | 1985-08-15 |
| JPH0369364B2 (es) | 1991-10-31 |
| CA1276358C (en) | 1990-11-13 |
| NO853822L (no) | 1985-09-27 |
| IL74199A (en) | 1988-07-31 |
| NO161266C (no) | 1989-07-26 |
| ES539962A0 (es) | 1986-04-16 |
| KR920002615B1 (ko) | 1992-03-30 |
| DK440085A (da) | 1985-09-27 |
| IN164123B (es) | 1989-01-14 |
| DK440085D0 (da) | 1985-09-27 |
| NO161266B (no) | 1989-04-17 |
| EP0155469A1 (en) | 1985-09-25 |
| FI853743L (fi) | 1985-09-27 |
| FI853743A7 (fi) | 1985-09-27 |
| SG87488G (en) | 1989-06-16 |
| IE57890B1 (en) | 1993-05-05 |
| FI853743A0 (fi) | 1985-09-27 |
| ATE35817T1 (de) | 1988-08-15 |
| EP0169865A1 (en) | 1986-02-05 |
| AU557131B2 (en) | 1986-12-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FD1A | Patent lapsed |
Effective date: 19970401 |