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ES553544A0 - Procedimiento para adherir dos superficies metalicas de material sintetico reforzado de vidrio, de material de friccion o ceramico. - Google Patents

Procedimiento para adherir dos superficies metalicas de material sintetico reforzado de vidrio, de material de friccion o ceramico.

Info

Publication number
ES553544A0
ES553544A0 ES553544A ES553544A ES553544A0 ES 553544 A0 ES553544 A0 ES 553544A0 ES 553544 A ES553544 A ES 553544A ES 553544 A ES553544 A ES 553544A ES 553544 A0 ES553544 A0 ES 553544A0
Authority
ES
Spain
Prior art keywords
adhere
ceramic
procedure
nitrogen
glass reinforced
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES553544A
Other languages
English (en)
Other versions
ES8802245A1 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Novartis AG
Original Assignee
Ciba Geigy AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ciba Geigy AG filed Critical Ciba Geigy AG
Publication of ES553544A0 publication Critical patent/ES553544A0/es
Publication of ES8802245A1 publication Critical patent/ES8802245A1/es
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Cable Accessories (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Insulating Bodies (AREA)
  • Laminated Bodies (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
ES553544A 1985-04-02 1986-03-31 Procedimiento para adherir dos superficies metalicas de material sintetico reforzado de vidrio, de material de friccion o ceramico. Expired ES8802245A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8508628 1985-04-02

Publications (2)

Publication Number Publication Date
ES553544A0 true ES553544A0 (es) 1988-04-16
ES8802245A1 ES8802245A1 (es) 1988-04-16

Family

ID=10577097

Family Applications (2)

Application Number Title Priority Date Filing Date
ES553544A Expired ES8802245A1 (es) 1985-04-02 1986-03-31 Procedimiento para adherir dos superficies metalicas de material sintetico reforzado de vidrio, de material de friccion o ceramico.
ES553543A Expired ES8706770A1 (es) 1985-04-02 1986-03-31 Procedimiento de curado de resinas epoxido

Family Applications After (1)

Application Number Title Priority Date Filing Date
ES553543A Expired ES8706770A1 (es) 1985-04-02 1986-03-31 Procedimiento de curado de resinas epoxido

Country Status (7)

Country Link
US (4) US4659779A (es)
EP (2) EP0197892B1 (es)
JP (1) JPH0660231B2 (es)
AT (2) ATE47407T1 (es)
CA (2) CA1240440A (es)
DE (2) DE3674052D1 (es)
ES (2) ES8802245A1 (es)

Families Citing this family (116)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8622998D0 (en) * 1986-09-24 1986-10-29 Ciba Geigy Ag Curable compositions
EP0289632A1 (en) * 1987-05-04 1988-11-09 American Cyanamid Company High green strength induction curable adhesives
JPH0811791B2 (ja) * 1987-07-27 1996-02-07 神鋼鋼線工業株式会社 プレストレストコンクリート緊張材用塗布材料
US4777084A (en) * 1987-10-08 1988-10-11 Minnesota Mining And Manufacturing Company Phenolic-modified epoxy adhesive including the reaction product of bisphenol A and the monoglycidyl ether of bisphenol A
US5888654A (en) * 1988-02-08 1999-03-30 Courtaulds Performance Films High performance epoxy based laminating adhesive
US5194307A (en) * 1988-02-08 1993-03-16 Martin Processing, Inc. High performance epoxy based coverlay and bond fly adhesive with heat activated cure mechanism
EP0351365B1 (en) * 1988-07-09 1995-06-07 Ciba-Geigy Ag Curable epoxide resin compositions
US4874833A (en) * 1988-08-22 1989-10-17 Shell Oil Company Composition containing epoxy resin and alkyl hindered polyaromatic diamine and monoaromatic amine curing agents
GB8824391D0 (en) * 1988-10-18 1988-11-23 Ciba Geigy Ag Compositions
US5618606A (en) * 1989-09-18 1997-04-08 Rockwell International Corporation Process for bonding staged composites with a cobonded staged adhesive and article
US5593770A (en) * 1989-10-25 1997-01-14 Thiokol Corporation Chemorheologically tailored matrix resin formulations containing anhydride curing agents
US5545278A (en) * 1989-10-25 1996-08-13 Thiokol Corporation Method for increasing fiber strength translation in composition pressure vessels using matrix resin formulations containing anhydride curing agents and surface-active agents
EP0436745B1 (en) * 1989-11-30 1994-06-15 Courtaulds Performance Films A high performance epoxy based coverlay and bond ply adhesive with heat activated cure mechanism
US5248331A (en) * 1990-01-11 1993-09-28 Lilly Industries, Inc. Mirror back coating
US5252402A (en) * 1990-01-11 1993-10-12 Lilly Industries, Inc. Mirrorback coating
US5212263A (en) * 1991-01-10 1993-05-18 Morton International, Inc. Textured epoxy powder coating
IT1261171B (it) * 1992-03-03 1996-05-09 Ruetgerswerke Ag Miscuglio resinoso a basso contenuto di prodotti di scissione.
GB9310031D0 (en) * 1993-05-15 1993-06-30 G B Tools Components Export Manufacture of bonded articles
US6255367B1 (en) 1995-03-07 2001-07-03 Landec Corporation Polymeric modifying agents
US6831116B2 (en) * 1995-03-07 2004-12-14 Landec Corporation Polymeric modifying agents
EP0754742B1 (en) * 1995-07-19 2001-10-24 Raytheon Company Room-temperature stable, one-component, flexible epoxy adhesives
US6295599B1 (en) * 1995-08-16 2001-09-25 Microunity Systems Engineering System and method for providing a wide operand architecture
DE69705826T2 (de) * 1996-03-22 2002-04-11 Vantico Ag, Basel Einkomponentenepoxidharz verarbeitungsmaterial
US5688878A (en) * 1996-05-17 1997-11-18 Morton International, Inc. Epoxy powder coating with wrinkle finish
US5795927A (en) * 1996-05-17 1998-08-18 Morton International, Inc. Color stable wrinkle finish epoxy powder coating
US6056846A (en) * 1996-07-25 2000-05-02 Mcdonnell Douglas Helicopter Co. Bonded composite structure and its fabrication
US5932288A (en) * 1997-12-18 1999-08-03 Morton International, Inc. Wrinkle epoxy powder coating with acid and its homolog methylenedisalicylic
US6492462B2 (en) 1998-01-16 2002-12-10 Landec Corporation Side chain crystalline polymer as rheology modifier for crosslinked polymer
EP0930343A3 (en) 1998-01-16 2000-05-31 Landec Corporation Low profile additives for crosslink resins
US6060540A (en) * 1998-02-13 2000-05-09 Landec Corporation Modeling pastes
JPH11279376A (ja) * 1998-03-27 1999-10-12 Hitachi Chem Co Ltd 印刷配線板用エポキシ樹脂組成物およびこれを用いた印刷配線板
US20060204777A1 (en) * 2001-05-04 2006-09-14 Alto Products Corp. Process for making adhesive bonded sintered plates
US20020162618A1 (en) * 2001-05-04 2002-11-07 David Landa Process for making adhesive bonded sintered plates
ES2278949T3 (es) 2001-07-31 2007-08-16 Huntsman Advanced Materials (Switzerland) Gmbh Resina epoxidica.
JP2003082318A (ja) * 2001-09-13 2003-03-19 Three M Innovative Properties Co カチオン重合性接着剤組成物及び異方導電性接着剤組成物
WO2004092244A2 (en) * 2003-04-16 2004-10-28 Huntsman Advanced Materials (Switzerland) Gmbh Accelerator systems for low-temperature curing of epoxy resin compositions
EP2843022B1 (en) 2003-07-07 2020-12-16 Dow Global Technologies LLC Adhesive epoxy composition and process for applying it
US7557168B2 (en) * 2003-07-07 2009-07-07 Dow Global Technologies, Inc. Applying adhesive stream of epoxy resin, rubber modified epoxy resin and capped isocyanate prepolymer
US7192991B2 (en) * 2003-11-26 2007-03-20 3M Innovative Properties Company Cationically curable composition
ATE352576T1 (de) * 2004-03-12 2007-02-15 Dow Global Technologies Inc Epoxidharz klebstoffzusammensetzung
EP1602702B2 (en) * 2004-06-01 2020-09-16 Dow Global Technologies LLC Epoxy adhesive composition
US7649060B2 (en) 2005-12-02 2010-01-19 Henkel Corporation Curable compositions
US8029889B1 (en) 2004-12-03 2011-10-04 Henkel Corporation Prepregs, towpregs and preforms
EP1695990A1 (en) 2005-02-28 2006-08-30 Dow Global Technologies Inc. Two-component epoxy adhesive composition
DE602005020260D1 (de) 2005-06-02 2010-05-12 Dow Global Technologies Inc Schlagzähmodifizierter Strukturklebstoff auf Epoxid Basis
JP4890872B2 (ja) * 2006-01-30 2012-03-07 ルネサスエレクトロニクス株式会社 光半導体封止用透明エポキシ樹脂組成物及びそれを用いた光半導体集積回路装置
US7537827B1 (en) 2006-12-13 2009-05-26 Henkel Corporation Prepreg laminates
BRPI0717664A2 (pt) * 2006-12-21 2013-02-26 Dow Global Technologies Inc composiÇço adesiva e mÉtodo para ligar dois ou mais substratos entre si
JP5662145B2 (ja) 2007-06-20 2015-01-28 ダウ グローバル テクノロジーズ エルエルシー 温度変化に対する非常に低い感受性を有する衝突耐久性エポキシ接着剤
CN101778877B (zh) * 2007-07-23 2013-01-02 陶氏环球技术公司 在使用温度范围内g-模量基本一致的两部分聚氨酯可固化组合物
US20100009086A1 (en) * 2008-07-08 2010-01-14 Berry Plastics Coprporation Rapid cure coating system
US20100028651A1 (en) * 2008-07-29 2010-02-04 Golden Michael R Toughened expandable epoxy resins for stiffening and energy dissipation in automotive cavities
EP2318448B1 (en) * 2008-08-22 2018-08-22 Dow Global Technologies LLC Adhesive composition adapted for bonding large mass parts to structures
US20110297317A1 (en) 2009-02-26 2011-12-08 Andreas Lutz One-part structural epoxy resin adhesives containing dimerized fatty acid/epoxy resin adduct and a polyol
JP5715638B2 (ja) 2009-11-05 2015-05-13 ダウ グローバル テクノロジーズ エルエルシー ケトオキシムでキャップされたエラストマー強化剤を含む構造用エポキシ樹脂系接着剤
JP5755737B2 (ja) 2010-06-29 2015-07-29 ダウ グローバル テクノロジーズ エルエルシー エポキシ樹脂用貯蔵安定性熱活性化第三級アミン触媒
WO2012000171A1 (en) 2010-06-29 2012-01-05 Dow Global Technologies Llc Storage-stable heat-activated tertiary amine catalysts for epoxy resins
CN103180400B (zh) 2010-12-26 2016-08-17 陶氏环球技术有限责任公司 含有用酚、多酚或氨基酚化合物封端的扩链弹性体增韧剂的结构环氧树脂粘合剂
JP5969217B2 (ja) * 2011-03-09 2016-08-17 日東電工株式会社 両面接着テープ
US20140147677A1 (en) 2011-05-19 2014-05-29 Andreas Lutz Novel Structural Adhesive and Use Thereof
WO2013028281A1 (en) 2011-08-22 2013-02-28 Dow Global Technologies Llc Toughener and toughened epoxy adhesive
DE102012200854A1 (de) * 2012-01-20 2013-07-25 Tesa Se Vernetzer-Beschleuniger-System für Polyacrylate
US9346984B2 (en) 2012-03-21 2016-05-24 Dow Global Technologies Llc Wash-off resistant epoxy adhesive composition and pre-gelled adhesive
WO2013142750A2 (en) 2012-03-23 2013-09-26 Dow Global Technologies Llc Crash-durable adhesive with enhanced stress durability
CN104136516B (zh) 2012-03-23 2016-06-01 陶氏环球技术有限责任公司 阻燃结构环氧树脂粘合剂以及粘合金属构件的方法
KR20140140061A (ko) 2012-04-02 2014-12-08 다우 글로벌 테크놀로지스 엘엘씨 에폭시 접착제, 그의 제조 및 용도
MY185759A (en) * 2012-06-13 2021-06-04 Valspar Sourcing Inc Low application temperature powder coating
EP2888331B1 (en) 2012-08-27 2019-03-20 Dow Global Technologies LLC Accelerated and toughened two-part epoxy adhesives
US9546243B2 (en) * 2013-07-17 2017-01-17 Air Products And Chemicals, Inc. Amines and polymeric phenols and usage thereof as curing agents in one component epoxy resin compositions
CA2931390A1 (en) 2013-11-26 2015-06-04 Basf Se Polyurethane elastomeric composition and method of preparing the same
WO2015160468A1 (en) 2014-04-14 2015-10-22 Dow Global Technologies Llc Epoxy resin compositions for pre-gel ovens
US20170204235A1 (en) 2014-05-01 2017-07-20 Dow Global Technologies Llc Prepreg manufacturing and drying process
EP3152251B1 (en) 2014-06-09 2018-05-02 Dow Global Technologies LLC Process for making curable, multi-layer fiber-reinforced prepreg
CN106715577A (zh) 2014-07-08 2017-05-24 陶氏环球技术有限责任公司 延迟固化的高Tg碰撞耐用粘合剂
WO2016014284A1 (en) 2014-07-23 2016-01-28 Dow Global Technologies Llc Structural adhesives having improved wash-off resistance and method for dispensing same
WO2016108958A1 (en) 2014-12-31 2016-07-07 Dow Global Technologies Llc Crash durable epoxy adhesive compositions having improved low-temperature impact resistance and wash off resistance
JP2016153475A (ja) * 2015-02-13 2016-08-25 積水化学工業株式会社 エポキシ樹脂硬化用マイクロカプセル及びエポキシ樹脂組成物
WO2016191403A1 (en) * 2015-05-28 2016-12-01 Dow Global Technologies Llc A two part (2k) epoxy adhesive composition for bonding oily metals
JP6753868B2 (ja) 2015-06-02 2020-09-09 ダウ グローバル テクノロジーズ エルエルシー エポキシ接着剤用のブロック化ポリウレタン強化剤
EP3317329B1 (en) 2015-06-30 2021-12-15 Henkel AG & Co. KGaA Process for cold bonding rubber on metal substrates
KR102625909B1 (ko) 2015-09-10 2024-01-18 다우 글로벌 테크놀로지스 엘엘씨 유성 표면에 대한 개선된 접착력 및 높은 워시-오프 저항성을 갖는 일액형 강인화된 에폭시 접착제
BR112018003466B1 (pt) 2015-09-10 2022-01-18 Dow Global Technologies Llc Adesivos estruturais de epóxi de um componente endurecido de alto módulo com cargas de alta razão de aspecto
US20180251633A1 (en) 2015-09-10 2018-09-06 Dow Global Technologies Llc Blocked polyurethane tougheners for epoxy adhesives
US11242427B2 (en) * 2015-10-20 2022-02-08 Ppg Industries Ohio, Inc. Structural adhesive compositions
MY198450A (en) 2016-01-15 2023-08-29 Basf Se Composite article
US10815405B2 (en) 2016-01-19 2020-10-27 Dow Global Technologies Llc One-component epoxy-modified polyurethane and/or polyurea adhesives having high elongation and excellent thermal stability, and assembly processes using same
EP3281982A1 (de) 2016-08-11 2018-02-14 Sika Technology AG Blockierte polyurethan-schlagzähigkeitsmodifikatoren zur verbesserung der schlagzähigkeit einkomponentiger tieftemperaturhärtender epoxidklebstoffe
JP2020500234A (ja) 2016-10-24 2020-01-09 ダウ グローバル テクノロジーズ エルエルシー 開ビード湿度曝露に耐性のエポキシ接着剤
WO2018081032A1 (en) 2016-10-25 2018-05-03 Dow Global Technologies Llc Epoxy adhesive having improved low-temperature impact resistance
CN110072915A (zh) 2016-10-28 2019-07-30 陶氏环球技术有限责任公司 具有改善的低温耐冲击性的耐碰撞环氧粘合剂
BR112019012482B1 (pt) * 2016-12-21 2022-11-08 Huntsman Advanced Materials Licensing (Switzerland) Gmbh Composição curável, processo para a preparação de um artigo curado, e, uso da composição
JP2020508381A (ja) 2017-02-26 2020-03-19 ダウ グローバル テクノロジーズ エルエルシー 潜在性硬化剤の混合物を含有する一液型強化エポキシ接着剤
JP7098662B2 (ja) 2017-06-07 2022-07-11 ダウ グローバル テクノロジーズ エルエルシー ランダムに配向したフィラメントを有する成形化合物、ならびにその作製および使用方法
WO2019036211A1 (en) 2017-08-15 2019-02-21 Dow Global Technologies Llc CURABLE EPOXY CURABLE ADHESIVES WITH TWO-COMPONENT AMBIENT TEMPERATURE
US10996338B2 (en) * 2017-09-12 2021-05-04 Toyota Research Institute, Inc. Systems and methods for detection by autonomous vehicles
WO2019055129A1 (en) 2017-09-12 2019-03-21 Dow Global Technologies Llc FORMULATION FOR ADHESIVE
KR102606942B1 (ko) 2017-09-12 2023-11-29 디디피 스페셜티 일렉트로닉 머티리얼즈 유에스, 엘엘씨 1액형 강화 에폭시 접착제
DE102017008925A1 (de) 2017-09-25 2019-03-28 Hexion GmbH Imprägnierharzmischung
KR102673415B1 (ko) 2017-10-18 2024-06-11 디디피 스페셜티 일렉트로닉 머티리얼즈 유에스, 엘엘씨 접착제 조성물
EP3737725B1 (en) 2018-01-08 2023-03-01 DDP Specialty Electronic Materials US, LLC Epoxy resin adhesive compositions
US11173672B2 (en) 2018-05-29 2021-11-16 Ddp Specialty Electronic Materials Us, Llc Method for bonding using one-component epoxy adhesive mixtures
WO2019236377A1 (en) 2018-06-05 2019-12-12 Dow Global Technologies Llc Method for recycling epoxy-fiber composites into polyolefins
JP7394833B2 (ja) 2018-08-31 2023-12-08 ダウ グローバル テクノロジーズ エルエルシー エポキシ複合配合物
US11732085B2 (en) 2019-02-15 2023-08-22 Dow Global Technologies Llc Epoxy composition
EP3715406A1 (en) 2019-03-29 2020-09-30 Henkel AG & Co. KGaA Process for modifying the surface polarity of rubber substrates
EP3973011B1 (en) 2019-05-21 2025-08-20 DDP Specialty Electronic Materials US, LLC Epoxy adhesive composition and method of use
CN114008162A (zh) 2019-06-18 2022-02-01 Ddp特种电子材料美国有限责任公司 具有改进的耐湿性的单组分增韧环氧胶粘剂
CN111662675B (zh) * 2020-06-19 2021-10-22 西北工业大学深圳研究院 具有自愈合功能的壁画、彩绘类文物加固剂及制备方法
WO2022031409A1 (en) 2020-08-03 2022-02-10 Ddp Specialty Electronic Material Us, Llc Bonding dissimilar materials using radio frequency wave curing
US20230365845A1 (en) 2020-10-26 2023-11-16 Ddp Specialty Electronic Materials Us, Llc One-component structural adhesive
WO2023033919A1 (en) 2021-08-30 2023-03-09 Ddp Specialty Electronic Materials Us, Llc Two-component structural adhesive
US20260002060A1 (en) 2022-03-22 2026-01-01 Ddp Specialty Electronic Materials Us, Llc Two-component thermally-conductive structural adhesive
WO2024076408A1 (en) 2022-10-06 2024-04-11 Ddp Specialty Electronic Materials Us, Llc Two-component adhesive composition
EP4598975A1 (en) 2022-10-06 2025-08-13 DDP Specialty Electronic Materials US, LLC Two-component adhesive composition
US20240327615A1 (en) * 2023-03-31 2024-10-03 Evonik Operations Gmbh Solutions of amines in polymeric phenols in combination with other resins
US20240327610A1 (en) 2023-03-31 2024-10-03 Evonik Operations Gmbh Solutions of amines in functional and non-functional resins

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL246535A (es) * 1958-12-18
US3420794A (en) * 1963-08-29 1969-01-07 Shell Oil Co Process for curing polyepoxides with a polyamine and resulting products
US3383433A (en) * 1964-09-22 1968-05-14 Union Carbide Corp Epoxide resins cured with phenolic novolacs and triazoles or tetrazoles
US3519576A (en) * 1966-11-23 1970-07-07 Minnesota Mining & Mfg Latent curing epoxy compositions containing a crystalline polyphenate salt of a polyamine and 2,4,4-trimethyl-2,4,7-trihydroxyflavan
US4066625A (en) * 1967-05-02 1978-01-03 Amicon Corporation Unitary curable resin compositions
US3520905A (en) * 1969-05-16 1970-07-21 Minnesota Mining & Mfg Flavan salt
US3839281A (en) * 1971-06-16 1974-10-01 Ciba Geigy Corp N-hydroxyalkylpiperidyl,n-hydroxyalkylpiperazyl compounds as accelerating agents in epoxy resin compositions
JPS5229800B2 (es) * 1972-11-01 1977-08-04
JPS5219875B2 (es) * 1974-02-07 1977-05-31
US4032513A (en) * 1976-03-30 1977-06-28 Maruzen Oil Co. Ltd. Process of producing alkenylphenol polymers
JPS6030334B2 (ja) * 1978-03-16 1985-07-16 田岡化学工業株式会社 硬化性混合物
JPS5536212A (en) * 1978-09-06 1980-03-13 Mitsui Toatsu Chem Inc Thermosetting resin composition
CH637150A5 (de) * 1978-10-30 1983-07-15 Ciba Geigy Ag Epoxidharzformmasse.
DE3117960A1 (de) * 1980-05-10 1982-03-25 Matsushita Electric Works Ltd., Kadoma, Osaka Epoxydharz-zusammensetzung
JPS5852319A (ja) * 1981-09-24 1983-03-28 Mitsui Toatsu Chem Inc 架橋剤
US4388451A (en) * 1981-09-28 1983-06-14 Ashland Oil, Inc. Polymers derived from allylphenol or substituted allylphenol and maleic anhydride
US4433015A (en) * 1982-04-07 1984-02-21 Parker Chemical Company Treatment of metal with derivative of poly-4-vinylphenol
JPS5949225A (ja) * 1982-09-16 1984-03-21 Hitachi Ltd 耐熱性難燃性樹脂組成物
DE3305549A1 (de) * 1983-02-18 1984-08-23 Schering AG, 1000 Berlin und 4709 Bergkamen Verfahren zum beschichten von kunst- oder natursteinplatten
US4593056A (en) * 1985-06-21 1986-06-03 Union Carbide Corporation Epoxy/aromatic amine resin systems containing aromatic trihydroxy compounds as cure accelerators
US4626474A (en) * 1985-06-21 1986-12-02 Stauffer Chemical Company Polyimide film/metal foil lamination

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US4701378A (en) 1987-10-20
CA1259897A (en) 1989-09-26
US4713432A (en) 1987-12-15
DE3666442D1 (en) 1989-11-23
JPH0660231B2 (ja) 1994-08-10
ES8706770A1 (es) 1987-06-16
ES8802245A1 (es) 1988-04-16
CA1240440A (en) 1988-08-09
EP0200678A2 (de) 1986-11-05
EP0197892A3 (en) 1987-09-23
EP0197892A2 (de) 1986-10-15
EP0197892B1 (de) 1989-10-18
US4734332A (en) 1988-03-29
JPS61231024A (ja) 1986-10-15
ATE56462T1 (de) 1990-09-15
EP0200678A3 (en) 1987-09-23
US4659779A (en) 1987-04-21
ES553543A0 (es) 1987-06-16
DE3674052D1 (de) 1990-10-18
ATE47407T1 (de) 1989-11-15
EP0200678B1 (de) 1990-09-12

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