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ES543609A0 - Perfeccionamientos en los sistemas de enfriaiento de dispositivos electronicos de potencia. - Google Patents

Perfeccionamientos en los sistemas de enfriaiento de dispositivos electronicos de potencia.

Info

Publication number
ES543609A0
ES543609A0 ES543609A ES543609A ES543609A0 ES 543609 A0 ES543609 A0 ES 543609A0 ES 543609 A ES543609 A ES 543609A ES 543609 A ES543609 A ES 543609A ES 543609 A0 ES543609 A0 ES 543609A0
Authority
ES
Spain
Prior art keywords
electronic devices
power electronic
cooling systems
cooling
systems
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES543609A
Other languages
English (en)
Other versions
ES8702082A1 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CONTARDO SpA
Original Assignee
CONTARDO SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CONTARDO SpA filed Critical CONTARDO SpA
Publication of ES8702082A1 publication Critical patent/ES8702082A1/es
Publication of ES543609A0 publication Critical patent/ES543609A0/es
Expired legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H10W40/73—

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
ES543609A 1985-03-19 1985-05-29 Perfeccionamientos en los sistemas de enfriaiento de dispositivos electronicos de potencia. Expired ES8702082A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8504027A FR2579371B1 (fr) 1985-03-19 1985-03-19 Procede et dispositif de refroidissement pour diodes et thyristors de puissance, mettant en oeuvre le principe du thermosiphon biphase

Publications (2)

Publication Number Publication Date
ES8702082A1 ES8702082A1 (es) 1987-01-01
ES543609A0 true ES543609A0 (es) 1987-01-01

Family

ID=9317330

Family Applications (1)

Application Number Title Priority Date Filing Date
ES543609A Expired ES8702082A1 (es) 1985-03-19 1985-05-29 Perfeccionamientos en los sistemas de enfriaiento de dispositivos electronicos de potencia.

Country Status (2)

Country Link
ES (1) ES8702082A1 (es)
FR (1) FR2579371B1 (es)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6302192B1 (en) 1999-05-12 2001-10-16 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US6896039B2 (en) 1999-05-12 2005-05-24 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
WO2010050129A1 (ja) * 2008-10-29 2010-05-06 日本電気株式会社 冷却構造及び電子機器並びに冷却方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2102254B2 (de) * 1971-01-19 1973-05-30 Robert Bosch Gmbh, 7000 Stuttgart Kuehlvorrichtung fuer leistungshalbleiterbauelemente

Also Published As

Publication number Publication date
ES8702082A1 (es) 1987-01-01
FR2579371A1 (fr) 1986-09-26
FR2579371B1 (fr) 1987-09-11

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Legal Events

Date Code Title Description
FD1A Patent lapsed

Effective date: 19960603