ES533300A0 - Un metodo de formar una estructura de contacto electrico - Google Patents
Un metodo de formar una estructura de contacto electricoInfo
- Publication number
- ES533300A0 ES533300A0 ES533300A ES533300A ES533300A0 ES 533300 A0 ES533300 A0 ES 533300A0 ES 533300 A ES533300 A ES 533300A ES 533300 A ES533300 A ES 533300A ES 533300 A0 ES533300 A0 ES 533300A0
- Authority
- ES
- Spain
- Prior art keywords
- electrical contact
- gold
- forming
- transition metal
- metal alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title abstract 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 4
- 239000010931 gold Substances 0.000 abstract 4
- 229910052737 gold Inorganic materials 0.000 abstract 4
- 229910045601 alloy Inorganic materials 0.000 abstract 2
- 239000000956 alloy Substances 0.000 abstract 2
- 239000011248 coating agent Substances 0.000 abstract 2
- 238000000576 coating method Methods 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 229910052723 transition metal Inorganic materials 0.000 abstract 2
- 150000003624 transition metals Chemical class 0.000 abstract 2
- 229910001096 P alloy Inorganic materials 0.000 abstract 1
- IGOJDKCIHXGPTI-UHFFFAOYSA-N [P].[Co].[Ni] Chemical compound [P].[Co].[Ni] IGOJDKCIHXGPTI-UHFFFAOYSA-N 0.000 abstract 1
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/615—Microstructure of the layers, e.g. mixed structure
- C25D5/619—Amorphous layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
Landscapes
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Crystallography & Structural Chemistry (AREA)
- Composite Materials (AREA)
- Contacts (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacture Of Switches (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US60913784A | 1984-05-11 | 1984-05-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| ES8601557A1 ES8601557A1 (es) | 1985-10-16 |
| ES533300A0 true ES533300A0 (es) | 1985-10-16 |
Family
ID=24439500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES533300A Granted ES533300A0 (es) | 1984-05-11 | 1984-06-11 | Un metodo de formar una estructura de contacto electrico |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0160761B1 (es) |
| JP (1) | JPS6129021A (es) |
| AT (1) | ATE40721T1 (es) |
| DE (1) | DE3476684D1 (es) |
| ES (1) | ES533300A0 (es) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1986001636A1 (en) * | 1984-08-31 | 1986-03-13 | American Telephone & Telegraph Company | Nickel-based electrical contact |
| JPH01132072A (ja) * | 1987-11-18 | 1989-05-24 | Yazaki Corp | 端子、接点等の金メッキ部品 |
| US5637925A (en) * | 1988-02-05 | 1997-06-10 | Raychem Ltd | Uses of uniaxially electrically conductive articles |
| US4891480A (en) * | 1989-02-01 | 1990-01-02 | American Telephone And Telegraph Company, At&T Bell Laboratories | Apparatus including electrical contacts |
| JPH0359972A (ja) | 1989-07-27 | 1991-03-14 | Yazaki Corp | 電気接点 |
| US5408574A (en) * | 1989-12-01 | 1995-04-18 | Philip Morris Incorporated | Flat ceramic heater having discrete heating zones |
| US5468936A (en) * | 1993-03-23 | 1995-11-21 | Philip Morris Incorporated | Heater having a multiple-layer ceramic substrate and method of fabrication |
| US6335107B1 (en) * | 1999-09-23 | 2002-01-01 | Lucent Technologies Inc. | Metal article coated with multilayer surface finish for porosity reduction |
| FI113912B (fi) * | 2001-12-13 | 2004-06-30 | Outokumpu Oy | Lisäaineellisella pinnoitteella varustettu yhdysterminaali |
| US20070052105A1 (en) | 2005-09-07 | 2007-03-08 | Rohm And Haas Electronic Materials Llc | Metal duplex method |
| DE102005047799A1 (de) * | 2005-10-05 | 2007-05-24 | W.C. Heraeus Gmbh | Schleifringkörper zur kontinuierlichen Stromübertragung |
| US8652649B2 (en) * | 2009-07-10 | 2014-02-18 | Xtalic Corporation | Coated articles and methods |
| DE102010033715A1 (de) | 2010-08-07 | 2012-02-09 | Audi Ag | Ausgleichsbehälter für einen Kühlmittelkreislauf |
| US20130065069A1 (en) * | 2011-09-09 | 2013-03-14 | Yun Li Liu | Electrodeposition of Hard Magnetic Coatings |
| US20170100744A1 (en) | 2015-10-12 | 2017-04-13 | Tyco Electronics Corporation | Electronic Component and Process of Producing Electronic Component |
| US20170100916A1 (en) | 2015-10-12 | 2017-04-13 | Tyco Electronics Corporation | Electronic Component and Process of Producing Electronic Component |
| CN120584392A (zh) * | 2023-02-03 | 2025-09-02 | Abb瑞士股份有限公司 | 具有多层涂层的干式机构 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1059738B (de) * | 1957-12-06 | 1959-06-18 | Duerrwaechter E Dr Doduco | Verfahren zur Herstellung eines Mehrschichtenmetalls |
| GB1507782A (en) * | 1976-04-13 | 1978-04-19 | Lea Ronal Inc | Electrodeposition of gold |
| US4101389A (en) * | 1976-05-20 | 1978-07-18 | Sony Corporation | Method of manufacturing amorphous alloy |
-
1984
- 1984-05-30 DE DE8484303633T patent/DE3476684D1/de not_active Expired
- 1984-05-30 AT AT84303633T patent/ATE40721T1/de not_active IP Right Cessation
- 1984-05-30 EP EP84303633A patent/EP0160761B1/en not_active Expired
- 1984-05-31 JP JP11217484A patent/JPS6129021A/ja active Pending
- 1984-06-11 ES ES533300A patent/ES533300A0/es active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| EP0160761A1 (en) | 1985-11-13 |
| EP0160761B1 (en) | 1989-02-08 |
| ES8601557A1 (es) | 1985-10-16 |
| ATE40721T1 (de) | 1989-02-15 |
| DE3476684D1 (en) | 1989-03-16 |
| JPS6129021A (ja) | 1986-02-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ES533300A0 (es) | Un metodo de formar una estructura de contacto electrico | |
| EP0337064A3 (en) | Alloy layer and metallurgy structure for establishing electrical contact | |
| TW344888B (en) | Electroplated solder terminal | |
| EP0241729A3 (en) | Unframed via interconnection with dielectyric etch stop | |
| GR3024346T3 (en) | Electrically conductive polymer composition, method of making same and device incorporating same | |
| JPS6453151A (en) | Ion selecting electrode | |
| AU549886B2 (en) | Solderable palladium-nickel coatings | |
| EP0257737A3 (en) | Printed circuit precursor | |
| DE3460837D1 (en) | Process for producing an electrically conductive layer on a solid electrolyte surface, and electrically conductive layer | |
| ES547477A0 (es) | Un procedimiento para electrodepositar una aleacion de cinc en un substrato conductor. | |
| CZ199498A3 (cs) | Způsob výroby víka akumulátoru s alespoň elektricky vodivými oblastmi | |
| EP0188370A3 (en) | Electrical wire with refractory coating | |
| EP0370605A3 (en) | Superconductor layer and substrate supporting same | |
| ATE80501T1 (de) | Elektrische leistungsverbinder. | |
| EP0332337A3 (en) | Electrode and construction thereof | |
| TW343426B (en) | Process for producing a circuit board at least having a metal layer, circuit board thereof and its use | |
| ES263865U (es) | "elemento conductor de doble cara de contacto". | |
| JPS6486527A (en) | Ccb tape carrier | |
| TW343368B (en) | Inspection method for semiconductor device | |
| Gamblin | Amorphous Transition Metal Alloy, Thin Gold Coated, Electrical Contact | |
| Sterling | Electroplating Electrical Contacts | |
| EP0396276A3 (en) | Method of manufacturing semiconductor device | |
| CA1308151C (en) | Electrical contact | |
| EP0201801A3 (de) | Kontaktbacke einer Elektrodenfassung | |
| CA2020089A1 (en) | Method and construction of electrical connection to oxide superconductor |