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ES532076A0 - Un aparato para chapar superficies interiores de terminales electricos. - Google Patents

Un aparato para chapar superficies interiores de terminales electricos.

Info

Publication number
ES532076A0
ES532076A0 ES532076A ES532076A ES532076A0 ES 532076 A0 ES532076 A0 ES 532076A0 ES 532076 A ES532076 A ES 532076A ES 532076 A ES532076 A ES 532076A ES 532076 A0 ES532076 A0 ES 532076A0
Authority
ES
Spain
Prior art keywords
internal surfaces
electrical terminals
plating internal
plating
terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES532076A
Other languages
English (en)
Other versions
ES8503037A1 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
AMP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US06/361,956 external-priority patent/US4384926A/en
Application filed by AMP Inc filed Critical AMP Inc
Publication of ES532076A0 publication Critical patent/ES532076A0/es
Publication of ES8503037A1 publication Critical patent/ES8503037A1/es
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02Electroplating of selected surface areas
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08Electroplating with moving electrolyte e.g. jet electroplating
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60Electroplating characterised by the structure or texture of the layers
    • C25D5/615Microstructure of the layers, e.g. mixed structure
    • C25D5/617Crystalline layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/03Contact members characterised by the material, e.g. plating, or coating materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
ES532076A 1982-03-25 1984-04-30 Un aparato para chapar superficies interiores de terminales electricos. Expired ES8503037A1 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/361,956 US4384926A (en) 1982-03-25 1982-03-25 Plating interior surfaces of electrical terminals
US06/458,005 US4427498A (en) 1982-03-25 1983-01-17 Selective plating interior surfaces of electrical terminals

Publications (2)

Publication Number Publication Date
ES532076A0 true ES532076A0 (es) 1985-02-01
ES8503037A1 ES8503037A1 (es) 1985-02-01

Family

ID=27001499

Family Applications (2)

Application Number Title Priority Date Filing Date
ES520960A Expired ES8407524A1 (es) 1982-03-25 1983-03-24 Un aparato y un metodo para chapar superficies interiores de terminales electricos.
ES532076A Expired ES8503037A1 (es) 1982-03-25 1984-04-30 Un aparato para chapar superficies interiores de terminales electricos.

Family Applications Before (1)

Application Number Title Priority Date Filing Date
ES520960A Expired ES8407524A1 (es) 1982-03-25 1983-03-24 Un aparato y un metodo para chapar superficies interiores de terminales electricos.

Country Status (11)

Country Link
US (1) US4427498A (es)
EP (1) EP0091209B1 (es)
AR (1) AR230536A1 (es)
AU (1) AU557500B2 (es)
BR (1) BR8301349A (es)
CA (1) CA1175520A (es)
DE (1) DE3372991D1 (es)
ES (2) ES8407524A1 (es)
IE (1) IE54767B1 (es)
MX (2) MX153363A (es)
SG (1) SG63490G (es)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4473445A (en) * 1983-12-22 1984-09-25 Amp Incorporated Selectively plating interior surfaces of loose piece electrical terminals
US4555321A (en) * 1984-06-08 1985-11-26 Amp Incorporated Selective plating apparatus
US4687555A (en) * 1986-11-10 1987-08-18 Amp Incorporated Apparatus for selectively plating electrical terminals
US4690747A (en) * 1986-12-23 1987-09-01 Amp Incorporated Selective plating apparatus
US4687562A (en) * 1986-12-23 1987-08-18 Amp Incorporated Anode assembly for selectively plating electrical terminals
US4859300A (en) * 1987-07-13 1989-08-22 Enthone, Incorporated Process for treating plastics with alkaline permanganate solutions
US4931150A (en) * 1988-03-28 1990-06-05 Sifco Industries, Inc. Selective electroplating apparatus and method of using same
US4853099A (en) * 1988-03-28 1989-08-01 Sifco Industries, Inc. Selective electroplating apparatus
US5002649A (en) * 1988-03-28 1991-03-26 Sifco Industries, Inc. Selective stripping apparatus
US4904364A (en) * 1988-11-23 1990-02-27 Amp Incorporated Anode assembly for selectively plating interior surfaces of electrical terminals
US4911813A (en) * 1988-11-23 1990-03-27 Amp Incorporated Apparatus for selectively plating interior surfaces of electrical terminals
US4900279A (en) * 1989-04-24 1990-02-13 Die Tech, Inc. Solder terminal
US5292559A (en) * 1992-01-10 1994-03-08 Amp Incorporated Laser transfer process
FR2688804A1 (fr) * 1992-03-20 1993-09-24 Souriau & Cie Procede de depot electrolytique selectif d'un metal notamment d'un metal noble tel que l'or sur la face interne de corps creux en forme de douille notamment d'elements de contact de connecteur machine pour la mise en óoeuvre du procede, produit obtenu.
US5725706A (en) * 1996-03-12 1998-03-10 The Whitaker Corporation Laser transfer deposition
US20070092591A1 (en) * 2005-10-24 2007-04-26 Cyberonics, Inc. Vacuum mandrel for use in fabricating an implantable electrode
US8551301B2 (en) * 2008-10-08 2013-10-08 Tyco Electronics Corporation Electroplating system with electroplating wheel
US7842170B1 (en) * 2009-03-09 2010-11-30 Von Detten Volker Device for selective plating of electrical contacts for connectors
CN109267141A (zh) * 2018-11-09 2019-01-25 江苏浩博塑业有限公司 一种局部电镀阳极水廊装置
USD1032549S1 (en) * 2020-11-06 2024-06-25 Hitachi Energy Ltd Reinforced straight turret for electrical equipment
USD1036400S1 (en) * 2020-11-06 2024-07-23 Hitachi Energy Ltd Reinforced external turret for electrical equipment

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2448117A (en) 1942-08-05 1948-08-31 Continental Can Co Electrolytic can treating machine
US2503863A (en) 1943-11-18 1950-04-11 Siegfried G Bart Apparatus for electroplating the inside of pipes
US2477808A (en) 1946-05-08 1949-08-02 Carl G Jones Electrolytic apparatus for treatment of moving strip
US3137645A (en) * 1961-10-04 1964-06-16 Philco Corp Jet electrolytic treating apparatus
US3340162A (en) * 1964-01-27 1967-09-05 Philco Ford Corp Pitch tolerance compensator for a jetelectrolytic treatment apparatus
US3410781A (en) 1964-11-27 1968-11-12 Ex Cell O Corp Electrochemical machining apparatus for internal surface deburring
US3951761A (en) 1975-01-31 1976-04-20 Bunker Ramo Corporation Method and apparatus for electro-plating strip contacts
DE2705158C2 (de) * 1977-02-04 1986-02-27 Schering AG, 1000 Berlin und 4709 Bergkamen Verfahren zum Teilgalvanisieren
US4340449A (en) 1977-10-11 1982-07-20 Texas Instruments Incorporated Method for selectively electroplating portions of articles
US4384926A (en) 1982-03-25 1983-05-24 Amp Incorporated Plating interior surfaces of electrical terminals

Also Published As

Publication number Publication date
AR230536A1 (es) 1984-04-30
SG63490G (en) 1990-12-21
IE54767B1 (en) 1990-01-31
MX153363A (es) 1986-10-02
MX156742A (es) 1988-09-28
IE830618L (en) 1983-09-25
US4427498A (en) 1984-01-24
BR8301349A (pt) 1983-11-29
ES520960A0 (es) 1984-09-16
ES8503037A1 (es) 1985-02-01
CA1175520A (en) 1984-10-02
AU1187783A (en) 1983-09-29
DE3372991D1 (en) 1987-09-17
EP0091209B1 (en) 1987-08-12
EP0091209A1 (en) 1983-10-12
AU557500B2 (en) 1986-12-24
ES8407524A1 (es) 1984-09-16

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Legal Events

Date Code Title Description
FD1A Patent lapsed

Effective date: 20010402