[go: up one dir, main page]

ES508234A0 - "metodo para producir un dispositivo semiconductor pin de silicio amorfo". - Google Patents

"metodo para producir un dispositivo semiconductor pin de silicio amorfo".

Info

Publication number
ES508234A0
ES508234A0 ES508234A ES508234A ES508234A0 ES 508234 A0 ES508234 A0 ES 508234A0 ES 508234 A ES508234 A ES 508234A ES 508234 A ES508234 A ES 508234A ES 508234 A0 ES508234 A0 ES 508234A0
Authority
ES
Spain
Prior art keywords
producing
semiconductor device
amorphous silicon
silicon pin
pin semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES508234A
Other languages
English (en)
Other versions
ES8305157A1 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ExxonMobil Technology and Engineering Co
Original Assignee
Exxon Research and Engineering Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Exxon Research and Engineering Co filed Critical Exxon Research and Engineering Co
Publication of ES8305157A1 publication Critical patent/ES8305157A1/es
Publication of ES508234A0 publication Critical patent/ES508234A0/es
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • H10F71/10Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material
    • H10F71/103Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material including only Group IV materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F10/00Individual photovoltaic cells, e.g. solar cells
    • H10F10/10Individual photovoltaic cells, e.g. solar cells having potential barriers
    • H10F10/17Photovoltaic cells having only PIN junction potential barriers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/10Semiconductor bodies
    • H10F77/16Material structures, e.g. crystalline structures, film structures or crystal plane orientations
    • H10F77/169Thin semiconductor films on metallic or insulating substrates
    • H10F77/1692Thin semiconductor films on metallic or insulating substrates the films including only Group IV materials
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/548Amorphous silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product
ES508234A 1981-03-16 1981-12-22 "metodo para producir un dispositivo semiconductor pin de silicio amorfo". Granted ES508234A0 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/243,754 US4417092A (en) 1981-03-16 1981-03-16 Sputtered pin amorphous silicon semi-conductor device and method therefor

Publications (2)

Publication Number Publication Date
ES8305157A1 ES8305157A1 (es) 1983-03-16
ES508234A0 true ES508234A0 (es) 1983-03-16

Family

ID=22919989

Family Applications (2)

Application Number Title Priority Date Filing Date
ES508234A Granted ES508234A0 (es) 1981-03-16 1981-12-22 "metodo para producir un dispositivo semiconductor pin de silicio amorfo".
ES517864A Granted ES517864A0 (es) 1981-03-16 1982-12-01 Dispositivo fotovoltaico pindesilicio amorfo.

Family Applications After (1)

Application Number Title Priority Date Filing Date
ES517864A Granted ES517864A0 (es) 1981-03-16 1982-12-01 Dispositivo fotovoltaico pindesilicio amorfo.

Country Status (7)

Country Link
US (1) US4417092A (es)
EP (1) EP0060363B1 (es)
JP (1) JPS57162375A (es)
AU (1) AU548001B2 (es)
CA (1) CA1170786A (es)
DE (1) DE3174747D1 (es)
ES (2) ES508234A0 (es)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4533450A (en) * 1979-12-31 1985-08-06 Exxon Research And Engineering Co. Control of the hydrogen bonding in reactively sputtered amorphous silicon
US4407710A (en) * 1981-10-15 1983-10-04 Exxon Research And Engineering Co. Hybrid method of making an amorphous silicon P-I-N semiconductor device
JPS58169980A (ja) * 1982-03-19 1983-10-06 Matsushita Electric Ind Co Ltd 光起電力素子の製造方法
DE3242835A1 (de) * 1982-11-19 1984-05-24 Siemens AG, 1000 Berlin und 8000 München Solarzelle aus amorphem silizium
DE3242831A1 (de) * 1982-11-19 1984-05-24 Siemens AG, 1000 Berlin und 8000 München Solarzelle aus amorphem silizium und verfahren zu ihrer herstellung
DE3242791A1 (de) * 1982-11-19 1984-05-24 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen von elektrische kontakte bildende fingerelektrodenstrukturen an amorphen silizium-solarzellen
US4605565A (en) * 1982-12-09 1986-08-12 Energy Conversion Devices, Inc. Method of depositing a highly conductive, highly transmissive film
CA1219547A (en) * 1983-04-04 1987-03-24 Prem Nath Apparatus for and method of continuously depositing a highly conductive, highly transmissive film
US4508609A (en) * 1983-09-26 1985-04-02 Exxon Research & Engineering Co. Method for sputtering a PIN microcrystalline/amorphous silicon semiconductor device with the P and N-layers sputtered from boron and phosphorous heavily doped targets
US4528082A (en) * 1983-09-26 1985-07-09 Exxon Research And Engineering Co. Method for sputtering a PIN amorphous silicon semi-conductor device having partially crystallized P and N-layers
EP0153043A3 (en) * 1984-02-15 1986-09-24 Energy Conversion Devices, Inc. Ohmic contact layer
DE3535764A1 (de) * 1985-08-14 1987-02-26 Linde Ag Verfahren zum gewinnen von c(pfeil abwaerts)2(pfeil abwaerts)(pfeil abwaerts)+(pfeil abwaerts)-kohlenwasserstoffen
EP0236938A3 (de) * 1986-03-11 1989-11-15 Siemens Aktiengesellschaft Verfahren zur Vermeidung von Kurzschlüssen bei der Herstellung von Dünnschichtsolarzellen aus amorphem Silizium
US4818357A (en) * 1987-05-06 1989-04-04 Brown University Research Foundation Method and apparatus for sputter deposition of a semiconductor homojunction and semiconductor homojunction products created by same
US5180690A (en) * 1988-12-14 1993-01-19 Energy Conversion Devices, Inc. Method of forming a layer of doped crystalline semiconductor alloy material
US5213670A (en) * 1989-06-30 1993-05-25 Siemens Aktiengesellschaft Method for manufacturing a polycrystalline layer on a substrate
US5330855A (en) * 1991-09-23 1994-07-19 The United States Of America, As Represented By The Secretary Of Commerce Planar epitaxial films of SnO2
US6379994B1 (en) * 1995-09-25 2002-04-30 Canon Kabushiki Kaisha Method for manufacturing photovoltaic element
US20060130891A1 (en) * 2004-10-29 2006-06-22 Carlson David E Back-contact photovoltaic cells
US7528458B2 (en) * 2006-03-02 2009-05-05 Icemos Technology Ltd. Photodiode having increased proportion of light-sensitive area to light-insensitive area
US7893348B2 (en) * 2006-08-25 2011-02-22 General Electric Company Nanowires in thin-film silicon solar cells
US9099578B2 (en) 2012-06-04 2015-08-04 Nusola, Inc. Structure for creating ohmic contact in semiconductor devices and methods for manufacture
US9112103B1 (en) 2013-03-11 2015-08-18 Rayvio Corporation Backside transparent substrate roughening for UV light emitting diode
WO2014145300A2 (en) * 2013-03-15 2014-09-18 Nusola Inc. Pin photovoltaic cell and process of manufacture

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4064521A (en) * 1975-07-28 1977-12-20 Rca Corporation Semiconductor device having a body of amorphous silicon
JPS5582474A (en) * 1978-12-18 1980-06-21 Fuji Photo Film Co Ltd Preparation of photoelectric transducer
US4217148A (en) * 1979-06-18 1980-08-12 Rca Corporation Compensated amorphous silicon solar cell
US4251289A (en) * 1979-12-28 1981-02-17 Exxon Research & Engineering Co. Gradient doping in amorphous silicon
US4412900A (en) * 1981-03-13 1983-11-01 Hitachi, Ltd. Method of manufacturing photosensors

Also Published As

Publication number Publication date
ES8400636A1 (es) 1983-10-16
US4417092A (en) 1983-11-22
ES8305157A1 (es) 1983-03-16
EP0060363A1 (en) 1982-09-22
AU548001B2 (en) 1985-11-14
EP0060363B1 (en) 1986-05-28
ES517864A0 (es) 1983-10-16
CA1170786A (en) 1984-07-10
DE3174747D1 (en) 1986-07-03
AU7875481A (en) 1982-09-23
JPS57162375A (en) 1982-10-06

Similar Documents

Publication Publication Date Title
ES508234A0 (es) "metodo para producir un dispositivo semiconductor pin de silicio amorfo".
DE3265339D1 (en) Method for manufacturing semiconductor device
IT8224641A0 (it) Procedimento per la formazione di caratteristiche d'ordine sub-micron in dispositivi a semiconduttori.
EP0147435A4 (en) MICROPLATE TRANSFER DEVICE.
FR2483127B1 (fr) Procede de fabrication d'un dispositif semi-conducteur
DE3366564D1 (en) Method for manufacturing semiconductor device
DE3382676D1 (de) Wafertransferapparat.
BE848345A (fr) Procede de fabrication d'un dispositif a semi-conducteurs,
DE3773832D1 (de) Vorrichtung fuer die belichtungssteuerung.
FR2462023B1 (fr) Procede de fabrication d'un dispositif semi-conducteur
IT8322981A0 (it) Procedimento per la fabbricazione di un dispositivo a semiconduttori.
FI872629L (fi) Menetelmä vaginansisäisen välineen valmistamiseksi
IT8322373A0 (it) Dispositivo semiconduttore.
OA07249A (fr) Procédé de préparation d'un sémi-conducteur amorphe.
EP0057919A3 (en) Semiconductor laser device
ES525658A0 (es) Un metodo para producir un dispositivo semiconductor de pelicula delgada
IT8323707A0 (it) Substrato di cablaggio, procedimento per la sua fabbricazione, e dispositivo a semiconduttore utilizzante il substrato stesso.
IT8420726A0 (it) Procedimento per produrre dispositivi semiconduttori.
FR2560436B1 (fr) Procede de fabrication d'un dispositif a semi-conducteur comportant un film monocristallin sur un isolant
JPS57173945A (en) Device for etching by downstream semiconductor device
DE3278181D1 (en) Method for manufacturing semiconductor device
FR2486716B1 (fr) Procede de realisation d'un dispositif semi-conducteur
EP0144444A4 (en) MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE.
DE3886286D1 (de) Verbindungsverfahren für Halbleiteranordnung.
KR900015282A (ko) 반도체 소자의 제조방법