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ES430054A1 - Electrolytic burnished gold bath with higher rate of deposition - Google Patents

Electrolytic burnished gold bath with higher rate of deposition

Info

Publication number
ES430054A1
ES430054A1 ES430054A ES430054A ES430054A1 ES 430054 A1 ES430054 A1 ES 430054A1 ES 430054 A ES430054 A ES 430054A ES 430054 A ES430054 A ES 430054A ES 430054 A1 ES430054 A1 ES 430054A1
Authority
ES
Spain
Prior art keywords
deposition
electrolytic
higher rate
gold bath
bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES430054A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Evonik Operations GmbH
Original Assignee
Degussa GmbH
Deutsche Gold und Silber Scheideanstalt
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Degussa GmbH, Deutsche Gold und Silber Scheideanstalt filed Critical Degussa GmbH
Publication of ES430054A1 publication Critical patent/ES430054A1/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

There is provided an electrolytic gold bath for the deposition of thicker, bright gold coatings at high rates of deposition. The bath contains a heterocyclic azohydrocarbon sulfonic acid or salt thereof, e.g. pyridine sulfonic acid.
ES430054A 1973-11-07 1974-09-14 Electrolytic burnished gold bath with higher rate of deposition Expired ES430054A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2355581A DE2355581C3 (en) 1973-11-07 1973-11-07 Galvanic bright gold bath with high deposition rate

Publications (1)

Publication Number Publication Date
ES430054A1 true ES430054A1 (en) 1976-10-16

Family

ID=5897412

Family Applications (1)

Application Number Title Priority Date Filing Date
ES430054A Expired ES430054A1 (en) 1973-11-07 1974-09-14 Electrolytic burnished gold bath with higher rate of deposition

Country Status (12)

Country Link
US (1) US3929595A (en)
JP (1) JPS5615472B2 (en)
BE (1) BE821923A (en)
BR (1) BR7409243A (en)
CH (1) CH603825A5 (en)
DE (1) DE2355581C3 (en)
ES (1) ES430054A1 (en)
FR (1) FR2249979B1 (en)
GB (1) GB1426849A (en)
IT (1) IT1020940B (en)
NL (1) NL186825C (en)
SE (1) SE7413961L (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8334226D0 (en) * 1983-12-22 1984-02-01 Learonal Uk Ltd Electrodeposition of gold alloys
GB8501245D0 (en) * 1985-01-18 1985-02-20 Engelhard Corp Gold electroplating bath
JPS61276992A (en) * 1985-05-30 1986-12-06 Shinko Electric Ind Co Ltd electrolytic gold plating solution
JPS61276990A (en) * 1985-05-30 1986-12-06 Shinko Electric Ind Co Ltd Gold electroplating solution
US4670107A (en) * 1986-03-05 1987-06-02 Vanguard Research Associates, Inc. Electrolyte solution and process for high speed gold plating
GB8612361D0 (en) * 1986-05-21 1986-06-25 Engelhard Corp Gold electroplating bath
JPS637390A (en) * 1986-06-26 1988-01-13 Nippon Engeruharudo Kk Gold-cobalt alloy plating liquid
US4744871A (en) * 1986-09-25 1988-05-17 Vanguard Research Associates, Inc. Electrolyte solution and process for gold electroplating
US4755264A (en) * 1987-05-29 1988-07-05 Vanguard Research Associates, Inc. Electrolyte solution and process for gold electroplating
CH680370A5 (en) * 1989-12-19 1992-08-14 H E Finishing Sa
GB2242200B (en) * 1990-02-20 1993-11-17 Omi International Plating compositions and processes
ES2179952T3 (en) 1995-11-03 2003-02-01 Enthone Omi Inc COMPOSITIONS AND DEPOSITS OF ELECTRODEPOSITION PROCEDURES.
GB9522591D0 (en) * 1995-11-03 1996-01-03 Enthone Omi Suisse S A Electroplating processes compositions and deposits
DE19629658C2 (en) * 1996-07-23 1999-01-14 Degussa Cyanide-free galvanic bath for the deposition of gold and gold alloys
DE19745602C1 (en) * 1997-10-08 1999-07-15 Atotech Deutschland Gmbh Method and solution for the production of gold layers
HK1047773B (en) 1999-06-17 2006-01-27 德古萨电解技术有限公司 An acid bath for the electrodeposition of glossy gold and gold alloy layers and a gloss additive for same
US20050205425A1 (en) * 2002-06-25 2005-09-22 Integran Technologies Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents
US6805786B2 (en) * 2002-09-24 2004-10-19 Northrop Grumman Corporation Precious alloyed metal solder plating process
JP2011122192A (en) * 2009-12-09 2011-06-23 Ne Chemcat Corp Electrolytic hard gold plating liquid and plating method using the same
DE102011114931B4 (en) 2011-10-06 2013-09-05 Umicore Galvanotechnik Gmbh Process for more selective electrolytic deposition of gold or a gold alloy
DE102012004348B4 (en) 2012-03-07 2014-01-09 Umicore Galvanotechnik Gmbh Use of organic thiourea compounds to increase the galvanic deposition rate of gold and gold alloys
CN103397356B (en) * 2013-07-15 2017-04-19 苏州苏凯路化学科技有限公司 Non-toxic gold salt for gold plating and synthetic method thereof
US10570525B2 (en) 2015-01-16 2020-02-25 Hutchinson Technology Incorporated Gold electroplating solution and method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE563647A (en) * 1954-03-13
DE1075398B (en) * 1954-03-22 1960-02-11 DEHYDAG Deutsche Hydrierwerke G.m.b.H., Düsseldorf Bath for the galvanic production of metal coatings
BE570261A (en) * 1957-08-13
NL273924A (en) * 1961-01-24
US3149058A (en) * 1959-12-31 1964-09-15 Technic Bright gold plating process
US2967135A (en) * 1960-06-08 1961-01-03 Barnet D Ostrow Electroplating baths for hard bright gold deposits
USB373094I5 (en) * 1964-08-26

Also Published As

Publication number Publication date
DE2355581A1 (en) 1975-05-28
IT1020940B (en) 1977-12-30
JPS5615472B2 (en) 1981-04-10
DE2355581B2 (en) 1978-11-16
NL186825C (en) 1991-03-01
NL7413010A (en) 1975-05-12
BE821923A (en) 1975-05-06
US3929595A (en) 1975-12-30
JPS5075531A (en) 1975-06-20
FR2249979A1 (en) 1975-05-30
BR7409243A (en) 1976-05-18
SE7413961L (en) 1975-05-09
CH603825A5 (en) 1978-08-31
DE2355581C3 (en) 1979-07-12
FR2249979B1 (en) 1976-10-22
GB1426849A (en) 1976-03-03

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