ES295813Y - MULTILAYER ELECTRIC CIRCUIT PROVISION. - Google Patents

MULTILAYER ELECTRIC CIRCUIT PROVISION.

Info

Publication number: ES295813Y
Authority: ES; Spain
Prior art keywords: electric circuit; multilayer electric; circuit provision; provision; multilayer
Prior art date: 1984-04-03
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

ES1985295813U

Other languages

Spanish (es)

Other versions

ES295813U (en

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

MEKTRON-FRANCE

Original Assignee

MEKTRON-FRANCE

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1984-04-03

Filing date

1985-04-01

Publication date

1987-12-16

1985-04-01 Application filed by MEKTRON-FRANCE filed Critical MEKTRON-FRANCE

1987-06-16 Publication of ES295813U publication Critical patent/ES295813U/en

1987-12-16 Application granted granted Critical

1987-12-16 Publication of ES295813Y publication Critical patent/ES295813Y/en

Status Expired legal-status Critical Current

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/0939—Curved pads, e.g. semi-circular or elliptical pads or lands
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Production Of Multi-Layered Print Wiring Board (AREA)
Combinations Of Printed Boards (AREA)
Coupling Device And Connection With Printed Circuit (AREA)

ES1985295813U 1984-04-03 1985-04-01 MULTILAYER ELECTRIC CIRCUIT PROVISION. Expired ES295813Y (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
FR8405220A FR2562335B1 (en)	1984-04-03	1984-04-03	FLEXIBLE MULTILAYER CIRCUIT WITH CONNECTIONS BETWEEN ULTRASONIC WELDED LAYERS

Publications (2)

Publication Number	Publication Date
ES295813U ES295813U (en)	1987-06-16
ES295813Y true ES295813Y (en)	1987-12-16

Family

ID=9302775

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
ES1985295813U Expired ES295813Y (en)	1984-04-03	1985-04-01	MULTILAYER ELECTRIC CIRCUIT PROVISION.

Country Status (7)

Country	Link
JP (1)	JPS60227497A (en)
DE (1)	DE3512237A1 (en)
ES (1)	ES295813Y (en)
FR (1)	FR2562335B1 (en)
GB (1)	GB2157085B (en)
IT (1)	IT1183552B (en)
SE (1)	SE459832B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE3535008C2 (en) *	1985-10-01	1994-09-29	Telefunken Microelectron	Foil circuit with two overlapping cable carriers
DE3704498A1 (en) *	1987-02-13	1988-08-25	Aristo Graphic Systeme	METHOD FOR PRODUCING A DIGITALIZED TABLET
DE3704497A1 (en) *	1987-02-13	1988-08-25	Aristo Graphic Systeme	METHOD FOR PRODUCING A DIGITALIZED TABLET
GB2227887A (en) *	1988-12-24	1990-08-08	Technology Applic Company Limi	Making printed circuits
GB2233157B (en) *	1989-06-13	1992-10-21	British Aerospace	Printed circuit board
JPH03196691A (en) *	1989-12-26	1991-08-28	Cmk Corp	Method of forming an insulating layer on a printed wiring board
US5347710A (en) *	1993-07-27	1994-09-20	International Business Machines Corporation	Parallel processor and method of fabrication
EP0995235B1 (en) *	1997-07-16	2002-04-03	Fraunhofer-Gesellschaft Zur Förderung Der Angewandten Forschung E.V.	Contact for very small liaison contacts and method for producing a contact
JP3587748B2 (en) *	1999-10-18	2004-11-10	ソニーケミカル株式会社	Multilayer flexible wiring board and method for manufacturing multilayer flexible wiring board
DE10035175C1 (en)	2000-07-19	2002-01-03	Fraunhofer Ges Forschung	Method for producing an electrical and / or mechanical connection of flexible thin film substrates
DE102005033218A1 (en) *	2005-07-15	2007-01-18	Printed Systems Gmbh	Three-dimensional circuit
DE102011109992A1 (en)	2011-08-11	2013-02-14	Eppendorf Ag	Circuit board cable device for a laboratory sample device and laboratory sample device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
GB1456994A (en) *	1973-06-28	1976-12-01	Marconi Co Ltd	Methods for forming electrical internconnection between metal layers for printed circuit assembly
FR2380686A1 (en) *	1977-02-15	1978-09-08	Lomerson Robert	PROCESS FOR ESTABLISHING AN ELECTRICAL CONNECTION THROUGH A PLATE OF INSULATING MATERIAL

1984
- 1984-04-03 FR FR8405220A patent/FR2562335B1/en not_active Expired
1985
- 1985-04-01 ES ES1985295813U patent/ES295813Y/en not_active Expired
- 1985-04-02 SE SE8501635A patent/SE459832B/en not_active IP Right Cessation
- 1985-04-02 GB GB08508567A patent/GB2157085B/en not_active Expired
- 1985-04-02 IT IT20190/85A patent/IT1183552B/en active
- 1985-04-03 DE DE19853512237 patent/DE3512237A1/en not_active Ceased
- 1985-04-03 JP JP60070730A patent/JPS60227497A/en active Granted

Also Published As

Publication number	Publication date
IT8520190A0 (en)	1985-04-02
SE459832B (en)	1989-08-07
DE3512237A1 (en)	1985-12-12
GB2157085A (en)	1985-10-16
SE8501635D0 (en)	1985-04-02
JPS60227497A (en)	1985-11-12
IT1183552B (en)	1987-10-22
SE8501635L (en)	1985-10-04
ES295813U (en)	1987-06-16
FR2562335B1 (en)	1988-11-25
JPH0564880B2 (en)	1993-09-16
GB8508567D0 (en)	1985-05-09
FR2562335A1 (en)	1985-10-04
GB2157085B (en)	1987-06-24

Publication	Publication Date	Title
IT8520145A0 (en)	1985-03-29	ELECTRIC. IMPROVED CIRCUIT INDICATOR
IT8519013A0 (en)	1985-01-04	CONTROL CIRCUIT.
FI853410L (en)	1986-03-07	Circuit arrangement.
ES546363A0 (en)	1986-11-16	CIRCUIT UNIT
FR2564260B1 (en)	1992-08-07	PRE-ACCENTUATION CIRCUIT
ES546323A0 (en)	1987-07-01	CONTROL CIRCUIT
ES295813Y (en)	1987-12-16	MULTILAYER ELECTRIC CIRCUIT PROVISION.
FI852164A0 (en)	1985-05-30	Circuit arrangement.
FI862890A0 (en)	1986-07-09	ELECTRICAL RISK.
BR8504840A (en)	1986-07-22	PRE-ACCENTUATION CIRCUIT
IT1206117B (en)	1989-04-14	DEMULTIPLATOR CIRCUIT.
IT8620618A0 (en)	1986-05-30	CONNECTING CIRCUIT.
AT383903B (en)	1987-09-10	CIRCUIT ARRANGEMENT
FI823709A0 (en)	1982-10-29	Circuit arrangement
DE3668522D1 (en)	1990-03-01	ELECTRONIC SWITCH.
ES545713A0 (en)	1986-06-16	POWER CONTROL CIRCUIT
IT8522808A0 (en)	1985-11-13	ELECTRICAL CONTROL CIRCUIT.
DE3584720D1 (en)	1992-01-02	MAJORITY CIRCUIT.
BR8107032A (en)	1982-09-08	ELECTRICAL CONNECTION MECHANISMS
IT8619722A0 (en)	1986-03-12	CIRCUIT ARRANGEMENT.
FI853102L (en)	1986-04-28	Circuit arrangement.
ES547346A0 (en)	1986-10-16	INTEGRATED CIRCUIT
FI833017A7 (en)	1984-02-26	Electric hotplate.
FI861060L (en)	1986-09-17	CIRCUIT ARRANGEMENT.
FI861062L (en)	1986-09-17	CIRCUIT ARRANGEMENT.

Legal Events

Date	Code	Title	Description
1997-04-16	FD1K	Utility model lapsed	Effective date: 19970303