[go: up one dir, main page]

ES2032410T3 - Procedimiento para la mejora de la adherencia de capas metalicas precipitadas sin corriente sobre superficies de materiales sinteticas. - Google Patents

Procedimiento para la mejora de la adherencia de capas metalicas precipitadas sin corriente sobre superficies de materiales sinteticas.

Info

Publication number
ES2032410T3
ES2032410T3 ES198787111093T ES87111093T ES2032410T3 ES 2032410 T3 ES2032410 T3 ES 2032410T3 ES 198787111093 T ES198787111093 T ES 198787111093T ES 87111093 T ES87111093 T ES 87111093T ES 2032410 T3 ES2032410 T3 ES 2032410T3
Authority
ES
Spain
Prior art keywords
adherence
improvement
procedure
current
metal layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES198787111093T
Other languages
English (en)
Inventor
Henning Dr. Giesecke
Gerhard Dieter Dr. Wolf
Hanns Peter Dr. Muller
Ulrich Dr. Von Gizycki
Martin Dr. Wienkenhover
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer AG
Original Assignee
Bayer AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bayer AG filed Critical Bayer AG
Application granted granted Critical
Publication of ES2032410T3 publication Critical patent/ES2032410T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

SE DAN FORMULACIONES DE ACTIVADORES QUE CONTIENEN COMO LIGANTE UN POLIURETANO AROMATICO PARA TRATAMIENTO PREVIO EN LA METALIZACION SIN CORRIENTE DE SUPERFICIES NO METALICAS. LOS DEPOSITOS METALICOS OBTENIDOS MUESTRAN MUY BUENA ADHERENCIA.
ES198787111093T 1986-08-12 1987-07-31 Procedimiento para la mejora de la adherencia de capas metalicas precipitadas sin corriente sobre superficies de materiales sinteticas. Expired - Lifetime ES2032410T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19863627256 DE3627256A1 (de) 1986-08-12 1986-08-12 Verfahren zur verbesserung der haftfestigkeit von stromlos abgeschiedenen metallschichten auf kunststoffoberflaechen

Publications (1)

Publication Number Publication Date
ES2032410T3 true ES2032410T3 (es) 1993-02-16

Family

ID=6307186

Family Applications (1)

Application Number Title Priority Date Filing Date
ES198787111093T Expired - Lifetime ES2032410T3 (es) 1986-08-12 1987-07-31 Procedimiento para la mejora de la adherencia de capas metalicas precipitadas sin corriente sobre superficies de materiales sinteticas.

Country Status (6)

Country Link
EP (1) EP0256395B1 (es)
JP (1) JPS6347369A (es)
AT (1) ATE77850T1 (es)
CA (1) CA1271374A (es)
DE (2) DE3627256A1 (es)
ES (1) ES2032410T3 (es)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5200272A (en) * 1988-04-29 1993-04-06 Miles Inc. Process for metallizing substrate surfaces
US5238702A (en) * 1988-10-27 1993-08-24 Henning Giesecke Electrically conductive patterns
US5227223A (en) * 1989-12-21 1993-07-13 Monsanto Company Fabricating metal articles from printed images
DE4015717A1 (de) * 1990-05-16 1991-11-21 Bayer Ag Formulierung zum aktivieren von substratoberflaechen fuer deren stromlose metallisierung
US5156672A (en) * 1990-07-13 1992-10-20 Mcgean-Rohco, Inc. Mechanical plating paste
DE4036591A1 (de) * 1990-11-16 1992-05-21 Bayer Ag Primer zum metallisieren von substratoberflaechen
DE4036592A1 (de) * 1990-11-16 1992-05-21 Bayer Ag Spritzgegossene leiterplatten durch hinterspritzen von flexiblen schaltungen mit thermoplastischen materialien
DE4107644A1 (de) * 1991-03-09 1992-09-10 Bayer Ag Hydroprimer zum metallisieren von substratoberflaechen
DE4111817A1 (de) * 1991-04-11 1992-10-15 Bayer Ag Formulierung zum aktivieren von substratoberflaechen fuer deren stromlose metallisierung
DE4235019C1 (de) * 1992-10-16 1994-04-21 Ame Gmbh Leiterplattenherstellung sowie Montage- und Kontaktierungsverfahren für Bauelemente durch stromlose Metallabscheidung
DE4209708A1 (de) * 1992-03-25 1993-09-30 Bayer Ag Verfahren zur Verbesserung der Haftfestigkeit von stromlos abgeschiedenen Metallschichten
DE4319759A1 (de) * 1993-06-15 1994-12-22 Bayer Ag Pulvermischungen zum Metallisieren von Substratoberflächen
EP0795802A1 (en) * 1996-03-15 1997-09-17 Agfa-Gevaert N.V. A printhead structure made from an electroless plated plastic substrate
DE19624071A1 (de) * 1996-06-17 1997-12-18 Bayer Ag Verfahren zur Herstellung von bahnförmigen metallbeschichteten Folien
JPH1197840A (ja) * 1997-09-16 1999-04-09 Electro Kemi:Kk プリント配線板の製造法
WO2005009092A1 (de) * 2003-07-23 2005-01-27 Funktionswerkstoffe Forschungs- Und Entwicklungs Gmbh Flexible leiterbahn-struktur sowie verfahren zur herstellung und verwendung derselben
WO2005045095A2 (en) * 2003-10-29 2005-05-19 Conductive Inkjet Technology Limited The formation of layers on substrates
US8435603B2 (en) 2003-12-05 2013-05-07 Conductive Inkjet Technology Limited Formation of solid layers on substrates
WO2005056875A2 (en) * 2003-12-05 2005-06-23 Conductive Inkjet Technology Limited Formation of solid layers on substrates
US20050241951A1 (en) * 2004-04-30 2005-11-03 Kenneth Crouse Selective catalytic activation of non-conductive substrates

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3546009A (en) * 1967-01-03 1970-12-08 Kollmorgen Corp Metallization of insulating substrates
US4604303A (en) * 1983-05-11 1986-08-05 Nissan Chemical Industries, Ltd. Polymer composition containing an organic metal complex and method for producing a metallized polymer from the polymer composition
DE3324767A1 (de) * 1983-07-08 1985-01-17 Bayer Ag, 5090 Leverkusen Verfahren zur aktivierung von substraten fuer die stromlose metallisierung
US4469714A (en) * 1983-09-02 1984-09-04 Okuno Chemical Industry Co., Ltd. Composition for bonding electroconductive metal coating to electrically nonconductive material

Also Published As

Publication number Publication date
EP0256395A3 (en) 1989-08-09
EP0256395B1 (de) 1992-07-01
JPH021913B2 (es) 1990-01-16
EP0256395A2 (de) 1988-02-24
CA1271374A (en) 1990-07-10
ATE77850T1 (de) 1992-07-15
DE3780101D1 (de) 1992-08-06
DE3627256A1 (de) 1988-02-18
JPS6347369A (ja) 1988-02-29

Similar Documents

Publication Publication Date Title
ES2032410T3 (es) Procedimiento para la mejora de la adherencia de capas metalicas precipitadas sin corriente sobre superficies de materiales sinteticas.
ES550306A0 (es) Un procedimiento para la deposicion no electrolitica de cobre sobre un substrato.
FI863174A7 (fi) Kiinteäfaasi-immuunimääritys, jossa käytetään inerttien synteettisten hartsien pinnoille immobilisoituja immuunireagensseja.
DE68919509D1 (de) Oberflächenbeschichtetes, zementiertes Carbid.
CA1268476C (fr) Agents promoteurs d'adherence a teneur de groupes-s-so2r
DE3771534D1 (de) Hitzehaertbare harze sowie dieselbe enthaltende elektrotauchlack-zusammensetzungen.
DE3788991D1 (de) Verwendung einer pulverförmigen Harzzusammensetzung zur elektrostatischen Beschichtung.
DE3584076D1 (de) Phenolharz-polyisocyanat-bindesysteme.
AU2143988A (en) Corrosion resistant, low temperature cured cathodic electrodeposition coating
DE3872194D1 (de) Beschichtungszusammensetzung fuer antifouling.
ES552092A0 (es) Un procedimiento para revestir un sustrato con una composicion de revestimiento a base de una resina olquidica modificada con uretano.
IT8423081A0 (it) Composizione di rivestimento induribile per resine polipropileniche.
ES539279A0 (es) Un metodo para la preparacion de un promotor de la adhesion a base de sales de niquel o cobalto.
BR9403340A (pt) Composição para revestimento por eletrodeposição.
FI914806A7 (fi) Fenolihartsi, menetelmä hartsin valmistamiseksi ja tätä hartsia sisältävä mineraalikuitujen liimaseos
ES537969A0 (es) Procedimiento para la obtencion de piezas moldeadas, forradas superficialmente por medio de laminas decorativas, conformables termoplasticamente
ES530217A0 (es) Procedimiento para el pretratamiento de superficies metalicas.
AU590949B2 (en) Electrodeposition coating composition
DE3568588D1 (en) Rubber/metal composites
DE3577871D1 (de) Haertungsmittel fuer ueberzugsmittel, bestehend aus waermehaertbaren harzen.
ATE52522T1 (de) Modifizierte phenolharze, verfahren zu ihrer herstellung und ihre verwendung.
ES516316A0 (es) Procedimiento para la preparacion de ligantes en base de resinas de apoxido modificadas, portadoras de grupos de oxazolidina.
NO903753D0 (no) Monoisocyanat-dekkede epoksyharpikser.
DE3684169D1 (de) Beschichtungszusammensetzung zur enteisung.
ES2031837T3 (es) Procedimiento para preparar un 1,2-diaminociclohexahidroxilado y complejos de platino derivados del mismo.

Legal Events

Date Code Title Description
FG2A Definitive protection

Ref document number: 256395

Country of ref document: ES