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ES2007979A6 - Material basico semiconductor. - Google Patents

Material basico semiconductor.

Info

Publication number
ES2007979A6
ES2007979A6 ES8802425A ES8802425A ES2007979A6 ES 2007979 A6 ES2007979 A6 ES 2007979A6 ES 8802425 A ES8802425 A ES 8802425A ES 8802425 A ES8802425 A ES 8802425A ES 2007979 A6 ES2007979 A6 ES 2007979A6
Authority
ES
Spain
Prior art keywords
semiconductor material
charge carrier
basic semiconductor
thin
omega
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES8802425A
Other languages
English (en)
Inventor
Johann Kammermaier
Rolf Schulte
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of ES2007979A6 publication Critical patent/ES2007979A6/es
Expired legal-status Critical Current

Links

Classifications

    • H10P14/3406—
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/26—Deposition of carbon only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/40—Crystalline structures
    • H10D62/402—Amorphous materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10P14/24—
    • H10P14/3454—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)

Abstract

NUEVO MATERIAL BASICO SEMICONDUCTOR. EL NUEVO MATERIAL BASICO SEMICONDUCTOR SE DEBERA PODER OBTENER SEGUN LA TECNOLOGIA DE CAPA DELGADA EMPLEANDO PROCESOS DE BANDA Y PRESENTAR UNA MOTILIDAD DE LOS PORTADORES DE CARGA DE COMO MINIMO 1 C
ES8802425A 1987-08-03 1988-08-03 Material basico semiconductor. Expired ES2007979A6 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3725700A DE3725700A1 (de) 1987-08-03 1987-08-03 Neues halbleitergrundmaterial

Publications (1)

Publication Number Publication Date
ES2007979A6 true ES2007979A6 (es) 1989-07-01

Family

ID=6332956

Family Applications (1)

Application Number Title Priority Date Filing Date
ES8802425A Expired ES2007979A6 (es) 1987-08-03 1988-08-03 Material basico semiconductor.

Country Status (13)

Country Link
US (1) US5055421A (es)
EP (1) EP0362275B1 (es)
JP (1) JPH02504446A (es)
KR (1) KR970004837B1 (es)
CN (1) CN1012775B (es)
BR (1) BR8807641A (es)
DE (2) DE3725700A1 (es)
ES (1) ES2007979A6 (es)
GR (1) GR880100402A (es)
IN (1) IN169551B (es)
MY (1) MY103333A (es)
RU (1) RU1839713C (es)
WO (1) WO1989001237A1 (es)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0381110B1 (de) * 1989-02-01 1994-06-29 Siemens Aktiengesellschaft Schutzschicht für elektroaktive Passivierschichten
US5266409A (en) * 1989-04-28 1993-11-30 Digital Equipment Corporation Hydrogenated carbon compositions
US5099296A (en) * 1990-04-06 1992-03-24 Xerox Corporation Thin film transistor
EP0472054A1 (de) * 1990-08-20 1992-02-26 Siemens Aktiengesellschaft Photozelle mit amorphem, wasserstoffhaltigem Kohlenstoff
DE4027388A1 (de) * 1990-08-30 1992-03-05 Thomson Brandt Gmbh Videorecorder fuer ein fernsehsignal mit einem zusatzsignal
US5582880A (en) * 1992-03-27 1996-12-10 Canon Kabushiki Kaisha Method of manufacturing non-single crystal film and non-single crystal semiconductor device
US5281851A (en) * 1992-10-02 1994-01-25 Hewlett-Packard Company Integrated circuit packaging with reinforced leads
DE59408155D1 (de) * 1993-03-09 1999-06-02 Siemens Ag Amorpher wasserstoffhaltiger Kohlenstoff
EP0644266A1 (de) * 1993-09-22 1995-03-22 Siemens Aktiengesellschaft Arbeitselektrode für ekektrodechemisch-enzymatische Sensorsysteme
US5562781A (en) * 1995-01-19 1996-10-08 Ohio University Amorphous, hydrogenated carbon (a-C:H) photovoltaic cell
DE19502862B4 (de) * 1995-01-30 2004-12-09 Infineon Technologies Ag Sensor auf FET-Basis
US5970907A (en) * 1997-01-27 1999-10-26 Canon Kabushiki Kaisha Plasma processing apparatus
US9305735B2 (en) 2007-09-28 2016-04-05 Brigham Young University Reinforced polymer x-ray window
EP2175695A1 (en) 2008-10-13 2010-04-14 Michel Tramontana Electroluminescent layer configuration and method for production thereof
US9174412B2 (en) 2011-05-16 2015-11-03 Brigham Young University High strength carbon fiber composite wafers for microfabrication
US20140140487A1 (en) * 2012-06-05 2014-05-22 Moxtek, Inc. Amorphous carbon and aluminum x-ray window
US9502206B2 (en) 2012-06-05 2016-11-22 Brigham Young University Corrosion-resistant, strong x-ray window
US20140127446A1 (en) * 2012-06-05 2014-05-08 Moxtek, Inc. Amorphous carbon and aluminum membrane

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3814983A (en) * 1972-02-07 1974-06-04 C Weissfloch Apparatus and method for plasma generation and material treatment with electromagnetic radiation
JPS5848428A (ja) * 1981-09-17 1983-03-22 Semiconductor Energy Lab Co Ltd 炭素被膜を有する複合体およびその作製方法
JPS5926906A (ja) * 1982-08-05 1984-02-13 Yukio Ichinose アモルフアス炭素材料
US4737379A (en) * 1982-09-24 1988-04-12 Energy Conversion Devices, Inc. Plasma deposited coatings, and low temperature plasma method of making same
US4630566A (en) * 1984-08-16 1986-12-23 Board Of Trustees Operating Michigan State University Microwave or UHF plasma improved apparatus
US4675265A (en) * 1985-03-26 1987-06-23 Fuji Electric Co., Ltd. Electrophotographic light-sensitive element with amorphous C overlayer
US4929322A (en) * 1985-09-30 1990-05-29 Union Carbide Corporation Apparatus and process for arc vapor depositing a coating in an evacuated chamber
DE3830430A1 (de) * 1987-09-11 1989-03-23 Japan Synthetic Rubber Co Ltd Verfahren zur herstellung von ueberzuegen
US4883686A (en) * 1988-05-26 1989-11-28 Energy Conversion Devices, Inc. Method for the high rate plasma deposition of high quality material

Also Published As

Publication number Publication date
KR970004837B1 (ko) 1997-04-04
MY103333A (en) 1993-05-29
IN169551B (es) 1991-11-09
EP0362275A1 (de) 1990-04-11
BR8807641A (pt) 1990-06-26
DE3725700A1 (de) 1989-02-16
CN1012775B (zh) 1991-06-05
DE3886537D1 (de) 1994-02-03
RU1839713C (ru) 1993-12-30
EP0362275B1 (de) 1993-12-22
GR880100402A (el) 1989-05-25
WO1989001237A1 (fr) 1989-02-09
US5055421A (en) 1991-10-08
CN1031298A (zh) 1989-02-22
KR890702252A (ko) 1989-12-23
JPH02504446A (ja) 1990-12-13

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Legal Events

Date Code Title Description
FD1A Patent lapsed

Effective date: 20001204