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EP3874075B1 - Procédé de dépôt autocatalytique d'aluminium - Google Patents

Procédé de dépôt autocatalytique d'aluminium

Info

Publication number
EP3874075B1
EP3874075B1 EP19880829.7A EP19880829A EP3874075B1 EP 3874075 B1 EP3874075 B1 EP 3874075B1 EP 19880829 A EP19880829 A EP 19880829A EP 3874075 B1 EP3874075 B1 EP 3874075B1
Authority
EP
European Patent Office
Prior art keywords
aluminum
substrate
solution
group
electroless deposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP19880829.7A
Other languages
German (de)
English (en)
Other versions
EP3874075A2 (fr
EP3874075A4 (fr
Inventor
Mohammed Taha ELSHARKAWI
Amal ESAWI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
American University in Cairo
Original Assignee
American University in Cairo
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Filing date
Publication date
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Publication of EP3874075A2 publication Critical patent/EP3874075A2/fr
Publication of EP3874075A4 publication Critical patent/EP3874075A4/fr
Application granted granted Critical
Publication of EP3874075B1 publication Critical patent/EP3874075B1/fr
Active legal-status Critical Current
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1637—Composition of the substrate metallic substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1687—Process conditions with ionic liquid
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1689—After-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1886—Multistep pretreatment
    • C23C18/1889—Multistep pretreatment with use of metal first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/06—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/06—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used
    • C25D11/08—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used containing inorganic acids
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/06—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used
    • C25D11/10—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used containing organic acids
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/18—After-treatment, e.g. pore-sealing
    • C25D11/24—Chemical after-treatment
    • C25D11/243—Chemical after-treatment using organic dyestuffs
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/18—After-treatment, e.g. pore-sealing
    • C25D11/24—Chemical after-treatment
    • C25D11/246—Chemical after-treatment for sealing layers

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Catalysts (AREA)

Claims (14)

  1. Procédé de dépôt autocatalytique d'aluminium ou d'un alliage d'aluminium sur une surface de substrat, comportant de :
    activer la surface du substrat à revêtir en appliquant un revêtement d'un métal catalyseur,
    préparer un mélange d'urée (NH2CONH2) et de chlorure d'aluminium anhydre (AlCl3), dans lequel un rapport molaire AlCl3:NH2CONH2 est supérieur à 1:1 pour obtenir un liquide ionique d'acide de Lewis à température ambiante (RTIL),
    dissoudre un agent réducteur hydrure dans un solvant aprotique anhydre pour obtenir une solution d'hydrure,
    facultativement, lorsqu'un revêtement d'alliage d'aluminium doit être déposé, ajouter un sel métallique d'alliage anhydre sous forme de solution au RTIL,
    mélanger la solution d'hydrure et l'AlCl3:NH2CONH2 RTIL pour obtenir une solution d'Al autocatalytique,
    exposer la surface activée du substrat à la solution d'Al autocatalytique, et
    retirer la solution d'Al autocatalytique de la surface du substrat,
    dans lequel, lors de l'exposition de la surface du substrat activé à la solution d'Al autocatalytique, un revêtement d'Al ou d'alliage d'Al est obtenu sur la surface du substrat activé,
    dans lequel l'agent réducteur hydrure est choisi parmi le groupe constitué d'hydrure de lithium, d'hydrure de lithium aluminium, d'hydrure de diisobutylaluminium et de combinaisons de ceux-ci.
  2. Procédé de dépôt autocatalytique d'aluminium ou d'un alliage d'aluminium selon la revendication 1, dans lequel le rapport molaire AlCl3:NH2CONH2 est supérieur à 1,1 à 2:1, de préférence égal à 2:1.
  3. Procédé de dépôt autocatalytique d'aluminium ou d'un alliage d'aluminium selon la revendication 1, dans lequel l'agent réducteur hydrure est l'hydrure de lithium et d'aluminium (LiAlH4).
  4. Procédé de dépôt autocatalytique d'aluminium ou d'un alliage d'aluminium selon la revendication 1, dans lequel le solvant aprotique anhydre est choisi parmi le groupe constitué de tétrahydrofuranne (THF), d'éther diéthylique, d'éther dibutylique, de dioxanne, du toluène et de l'hexane.
  5. Procédé de dépôt autocatalytique d'aluminium ou d'un alliage d'aluminium selon la revendication 1, dans lequel un sel métallique d'alliage anhydre est ajouté au RTIL par un procédé comportant de dissoudre le sel métallique d'alliage dans un solvant aprotique, et
    ajouter la solution au RTIL,
    dans lequel le sel métallique est choisi parmi le groupe constitué d'un sel d'halogénure de zinc, chrome, fer, nickel, étain, plomb, cuivre, argent, or et de combinaisons de ceux-ci.
  6. Procédé de dépôt autocatalytique d'aluminium ou d'un alliage d'aluminium selon la revendication 1, dans lequel le métal catalyseur est choisi parmi le groupe constitué du fer, du palladium, de l'argent, de l'or, du platine et de combinaisons de ceux-ci, de préférence le palladium.
  7. Procédé de dépôt autocatalytique d'aluminium ou d'un alliage d'aluminium selon la revendication 1, dans lequel l'activation de la surface du substrat à revêtir comporte de :
    traiter la surface avec une solution colloïdale de nanoparticules de palladium-étain (Pd-Sn) en présence de HCl et d'eau pour recouvrir la surface du substrat d'une couche de nanoparticules catalytiques adsorbées de Pd-Sn comportant de l'hydroxyde stanneux recouverte sur leur surface,
    nettoyer la surface du substrat des résidus de la solution colloïdale, et
    placer le substrat dans une solution d'accélérateur acide dans laquelle la couche d'hydroxyde stanneux excédentaire est retirée de la surface du substrat pour une activité catalytique accrue.
  8. Procédé de dépôt autocatalytique d'aluminium ou d'un alliage d'aluminium selon la revendication 7, dans lequel la surface du substrat est non conductrice.
  9. Procédé de dépôt autocatalytique d'aluminium ou d'un alliage d'aluminium selon la revendication 7, dans lequel le substrat est choisi parmi le groupe constitué d'une nanofibre, d'une nanoparticule, d'un nanotube, d'une nanotige et d'un point quantique.
  10. Procédé de dépôt autocatalytique d'aluminium ou d'un alliage d'aluminium selon la revendication 9, dans lequel le substrat est un nanotube de carbone (CNT), de préférence un nanotube de carbone à parois multiples (MWCNT) ou un nanotube de carbone à paroi unique (SWCNT).
  11. Procédé de dépôt autocatalytique d'aluminium ou d'un alliage d'aluminium selon la revendication 1, dans lequel le substrat est composé d'un polymère choisi parmi le groupe constitué de l'acrylonitrile butadiène styrène (ABS), de l'acide polylactique (PLA), d'un nylon, du polytétrafluoroéthylène (Téflon) et du poly(méthacrylate de méthyle) (PMMA) et le rapport molaire 'AlCl3:NH2CONH2 est compris entre 1,3:1 et 1,5:1, ou
    dans lequel le substrat est un polymère revêtu de métal et le rapport molaire AlCl3:NH2CONH2 est de 2:1.
  12. Procédé de dépôt autocatalytique d'aluminium ou d'un alliage d'aluminium selon la revendication 1, dans lequel le substrat est choisi parmi le groupe de fibres constitué d'une fibre de verre, d'une fibre d'aramide et d'une fibre de carbone, ou
    dans lequel le substrat est choisi parmi le groupe de fils constitué d'un fil de fibre de verre, d'un fil de fibre de poly(azanediyl-1,4-phénylèneazanediyltéréphtalaloyl) (Kevlar) et d'un fil de fibre de carbone.
  13. Procédé de dépôt autocatalytique d'aluminium ou d'un alliage d'aluminium selon la revendication 1, dans lequel le substrat est choisi parmi le groupe constitué d'un fullerène, d'un papier Bucky et d'une feuille Bucky, ou
    dans lequel le substrat est choisi parmi le groupe de matériaux 2-D constitué du graphène, du disulfure de molybdène (MOS2), du disulfure de tungstène (WS2), du diséléniure de tungstène (WSE2) et d'oxyde de zinc ( ZnO), ou
    dans lequel le substrat est choisi parmi le groupe constitué de poudre de graphène et de nanoparticules de graphène, ou
    dans lequel le substrat est choisi parmi le groupe constitué d'un microtube de ZnO et d'un nanofil de ZnO, ou
    dans lequel le substrat est choisi parmi le groupe constitué d'un acier, d'un alliage d'acier, de verre et d'une céramique.
  14. Procédé pour revêtir un substrat avec une couche d'oxyde d'aluminium anodisé, comportant :
    le procédé de dépôt autocatalytique d'aluminium ou d'un alliage d'aluminium sur une surface de substrat selon la revendication 1, suivi de
    immerger le substrat plaqué d'aluminium autocatalytique dans une solution électrolytique,
    appliquer un courant anodique au revêtement d'aluminium pour former un revêtement d'oxyde d'aluminium comportant une couche barrière, et
    traiter la couche d'oxyde d'aluminium pour former des pores dans la structure d'oxyde d'aluminium.
EP19880829.7A 2018-10-30 2019-10-30 Procédé de dépôt autocatalytique d'aluminium Active EP3874075B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862752769P 2018-10-30 2018-10-30
PCT/IB2019/001180 WO2020089690A2 (fr) 2018-10-30 2019-10-30 Procédé de dépôt autocatalytique d'aluminium

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EP3874075A2 EP3874075A2 (fr) 2021-09-08
EP3874075A4 EP3874075A4 (fr) 2022-08-31
EP3874075B1 true EP3874075B1 (fr) 2026-02-25

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JP7472770B2 (ja) * 2020-12-15 2024-04-23 トヨタ自動車株式会社 金属めっき皮膜の成膜装置及び成膜方法
CN120400820B (zh) * 2025-07-01 2025-09-23 北京大学 一种化学镀铝溶液及化学镀铝方法

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US20240158919A1 (en) 2024-05-16

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