[go: up one dir, main page]

EP3171451B1 - Räumlicher leistungskombinator - Google Patents

Räumlicher leistungskombinator Download PDF

Info

Publication number
EP3171451B1
EP3171451B1 EP16200051.7A EP16200051A EP3171451B1 EP 3171451 B1 EP3171451 B1 EP 3171451B1 EP 16200051 A EP16200051 A EP 16200051A EP 3171451 B1 EP3171451 B1 EP 3171451B1
Authority
EP
European Patent Office
Prior art keywords
power combiner
spatial power
transmission lines
spatial
conductive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP16200051.7A
Other languages
English (en)
French (fr)
Other versions
EP3171451A1 (de
Inventor
Hadrien THEVENEAU
Matthieu Werquin
Christophe GAQUIÈRE
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Universite Lille 1 Sciences et Technologies
Microwave Characterization Center
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Universite Lille 1 Sciences et Technologies
Commissariat a lEnergie Atomique CEA
Microwave Characterization Center
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Universite Lille 1 Sciences et Technologies, Commissariat a lEnergie Atomique CEA, Microwave Characterization Center, Commissariat a lEnergie Atomique et aux Energies Alternatives CEA filed Critical Universite Lille 1 Sciences et Technologies
Publication of EP3171451A1 publication Critical patent/EP3171451A1/de
Application granted granted Critical
Publication of EP3171451B1 publication Critical patent/EP3171451B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/12—Coupling devices having more than two ports
    • H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
    • H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/30—Auxiliary devices for compensation of, or protection against, temperature or moisture effects ; for improving power handling capability
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/081—Microstriplines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/12—Coupling devices having more than two ports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/22—Attenuating devices
    • H01P1/23—Attenuating devices using ferromagnetic material

Definitions

  • the present invention relates to a spatial power combiner comprising several inputs and an output.
  • a power combiner is a device for combining in a single output the power of several inputs.
  • the generation of high powers is necessary in certain applications, for example in radar systems in order to transmit a high power signal or in communication systems in order to deliver a high power signal to a communication channel.
  • a power combiner is necessary to add or combine powers output from several power amplifiers.
  • power combiners are frequently used with a set of power amplifiers, each power amplifier amplifying an input signal and providing an output signal.
  • the power combiner combines the power of the output signals of the power amplifiers and generates a total output power.
  • a spatial power combiner is a type of power combiner consisting of a cavity supplied with signals originating respectively from a set of input transmission lines. Power from each line is combined and recovered in a central output transmission line.
  • each input of the combiner has an influence on the other inputs, a failure at the level of one input or of the components connected to this input being able to be propagated at the level of the other inputs.
  • the failure of a single power amplifier can cause a significant degradation in the performance of the power combiner, which can lead to a failure in the operation of a device in which the power combiner is used.
  • the documents US 5,142,253 and US 4,424,496 disclose a spatial power combiner comprising absorbent in the cavity.
  • the document US 4,371,845 discloses transmission lines at the input of a spatial power combiner which extend in a radial direction with respect to the longitudinal axis of the combiner.
  • the object of the present invention is to resolve at least one of the aforementioned drawbacks and to propose an improved spatial power combiner.
  • the present invention proposes, according to a first aspect, a spatial power combiner according to claim 1.
  • the absorbing element makes it possible to isolate the transmission lines from one another, the signals carried by the transmission lines thus not having any influence between them.
  • this transmission line has no effect on the other transmission lines of the assembly and the power combiner always delivers an adequate output signal, in the worst case. In some cases, the power at the output may be reduced.
  • the length of the absorbent element is equivalent to the length of the transmission lines in the space power combiner.
  • the absorbent element extends longitudinally over the entire length of the transmission lines, which improves the insulation of the inputs between them and can facilitate the assembly of the power combiner during its manufacture.
  • the length of the absorbent element is less than the length of the transmission lines in the space power combiner.
  • the absorbent element extends starting from the input of said space power combiner.
  • the absorbent element extends starting from the output of said spatial power combiner.
  • the spatial power combiner further comprises heat dissipation means extending longitudinally in the cavity, the absorbing element surrounding the dissipation means.
  • the heat dissipation means comprise a metal rod.
  • the absorbent element extends from the inlet and the length of the absorbent element is less than the length of the transmission lines, the distance traveled by the heat along the rod metal is reduced.
  • the transmission lines are microstrip transmission lines.
  • the inputs of the spatial power combiner have a low impedance.
  • connection of the inputs of the combiner to circuits or electronic components having low impedance outputs is thus facilitated. Indeed, when the impedance values are close, the implementation of the impedance matching is simplified.
  • the spatial power combiner comprises a thermal evacuator module.
  • This thermal evacuator module helps in the thermal dissipation of the space power combiner.
  • the spatial power combiner comprises an impedance pre-matching module arranged at the input of the spatial power combiner, the impedance pre-matching module comprising first parts of the transmission lines of the set of transmission lines. .
  • these first parts of the transmission lines extend in a radial direction relative to the longitudinal axis of the cavity.
  • the value of the impedance of the transmission line varies along the transmission line.
  • the impedance increases along the transmission line.
  • the value of the impedance of a transmission line at the input of the spatial power combiner is less than the value of the impedance of the transmission line at the output of the combiner.
  • the set of layers comprises a third conductive layer serving as a potential reference.
  • the impedance pre-adaptation module comprises a support on which the first parts of the transmission lines are arranged, the support comprising a set of hollows, each first part of the transmission lines of the set of transmission lines being respectively disposed on a hollow of the set of hollows.
  • the second conductive layer of each set of layers of each transmission line is in contact with each hollow of the support.
  • the present invention relates, according to a second aspect, to a power amplification assembly formed by a spatial power combiner according to the invention and to an amplification structure arranged at the input of said spatial power combiner, the structure of amplification comprising a set of inputs and a set of outputs, the outputs being respectively connected to the inputs of the spatial power combiner.
  • the transmission lines of the spatial power combiner are connected to the outputs of the amplification structure.
  • the spatial power combiner combines the powers present respectively at the outputs of the amplification structure.
  • the transmission lines at the input of the spatial power combiner correspond respectively to transmission lines at the output of said amplification structure.
  • the amplification structure comprises a set of power amplifiers, each power amplifier being connected to each output of the amplification structure.
  • the input signals of the power combining assembly are first amplified and then their power is combined, by the spatial power combiner, into a single output.
  • the outputs of the power amplifiers have a low impedance.
  • the impedance matching between the amplification structure and the power combiner is easily implemented.
  • the outputs of the power amplifiers have a low impedance.
  • the impedance matching between the amplification structure and the power combiner is easily implemented.
  • the power amplification assembly has characteristics and advantages similar to those described above in relation to the spatial power combiner.
  • a power amplification assembly in accordance with the invention will be described with reference to figures 1a and 1b .
  • the figure 1a represents a power amplification assembly 100 comprising a spatial power combiner 10 and an amplification structure 20.
  • FIG. 1b An exploded view of the power amplifier assembly is shown at figure 1b .
  • the spatial power combiner 10 is placed at the output of the amplification structure 20.
  • the amplification structure 20 comprises a set of inputs 21a, 21b, 21c, ... and a set of outputs 22a, 22b, 22c, ..., the number of inputs and outputs of the sets being identical.
  • the amplification structure 20 further comprises a set of power amplifiers 23, each power amplifier 23 being connected to an input 21 of the amplification structure 20 and to an output 22 of the amplification structure 20.
  • Input transmission lines a 1 , b 1 , c 1 respectively connect the inputs 21 of the amplification structure 20 and the power amplifiers 23.
  • Output transmission lines a 2 , b 2 , c 2 respectively connect the power amplifiers 23 and the outputs 22 of the amplification structure 20.
  • the power amplifiers 23 respectively amplify the signals at the inputs 21 of the amplification structure 20 and generate amplified signals at the outputs 22.
  • the amplification structure 20 comprises a body 24 enclosing the power amplifiers 23 and the transmission lines at the input a 1 , b 1 , c 1 ... and at the output a 2 , b 2 , c 2 ...
  • the body 24 has an octagonal shape
  • the amplification structures comprise eight inputs 21, eight outputs 22, as well as eight power amplifiers 23.
  • the body of the amplification structure can have different geometric shapes, and the number of power amplification inputs, outputs and transmission lines can be different.
  • the power amplifiers 23 being known to those skilled in the art, will not be described in more detail in this document.
  • the amplification structure 20 comprises cooling means 25 arranged around the periphery of the body 24 in order to dissipate the heat produced by the power components, in particular by the power amplifiers 23.
  • the spatial power combiner 10 is placed at the output of the amplification structure 20.
  • the outputs 22 of the amplification structure 20 are connected to inputs 11a, 11b, 11c, ... (named 11 in the remainder of the document) of the spatial power combiner 10.
  • the powers of the signals at the output of the structure d are thus combined by the spatial power combiner 10 into a single power output from the spatial power combiner 10.
  • transmission lines a, b, c, ... are respectively connected to the inputs 11a, 11b, 11c, ... of the spatial power combiner 10.
  • the transmission lines a, b, c, ... of the spatial power combiner 10 are a continuity of the output transmission lines a 2 , b 2 , c 2 ... of the amplification structure 20.
  • the spatial power combiner 10 further comprises an output 12 on which a combined power is generated.
  • a combined output signal is thus generated having a power corresponding to the combined powers of the signals at the input 11 of the spatial power combiner 10. Consequently, on the output 12, a combined output signal is generated having a power corresponding to the combined powers of the signals at the output of the amplification structure 20.
  • Electronic equipment can be connected to the output 12 of the spatial power combiner 10 in order to use this combined power.
  • the output 12 is at high impedance, having by way of non-limiting example 50 Ohms.
  • the signal at the output 12 of the spatial power combiner 10 can thus be used, for example in an antenna or as an input in a device serving as a transition from a waveguide to a coaxial line, without the need for an impedance transformation. , or with an easy to perform impedance transformation.
  • the spatial power combiner 10 comprises a cylindrical body 13 forming a cavity 14.
  • the transmission lines a, b, c, ... comprise a first part corresponding to the line portion between the input 11 and the cavity 14 of the spatial power combiner 10.
  • the part of the spatial power combiner at the level of the cavity 14 will be called the heart of the combiner 101.
  • the first part of a transmission line a, b, c, ... is also called the power line. access aa, ba, ca, ...
  • Each input line a, b, c, ... also includes a second part ab, bb, cb, ... corresponding to the line portion between the access line aa, ba, ca ... and the output 12 of the combiner.
  • the second parts of the transmission lines ab, bb, cb, ... pass longitudinally through the cavity 14 starting from the input 11 of the space power combiner 10 and up to the output 12 of the space power combiner 10.
  • the input transmission lines a, b, c ... are microstrip transmission lines.
  • the connection between the amplification structure 20 and the spatial power combiner 10 can be made directly and without requiring the necessary conversions between different types of. lines.
  • the spatial power combiner 10 comprises an absorbing element 15 extending longitudinally in the cavity 14.
  • the absorbent element 15 is placed between the input transmission lines a, b, c, ... in particular between the second parts of the transmission lines ab, bb, cb, ... in the heart of the combiner 101.
  • the second parts of input transmission lines ab, bb, cb, ... are arranged around the absorbent element 15.
  • the absorbent element 15 extends over the entire length of the second parts of the transmission lines ab, bb, cb, ... that is to say it extends over the entire cavity 14 between the input 11 and the output 12 of the spatial power combiner 10, more particularly on the entire core of the spatial power combiner 101.
  • the length of the absorbent element 15 is equivalent to the length of the second parts of the transmission lines ab, bb, cb, ... in the space power combiner 10.
  • the length of the absorbent element 15 is less than the length of the second parts of the transmission lines ab, bb, cb, ... in the space power combiner 10.
  • the figure 2 represents a spatial power combiner 10 'according to a second embodiment of the invention. Note that the cavity is not shown in this figure.
  • the transmission lines a ', b', c ', ... and in particular the second parts of the transmission lines ab', bb ', cb', ... are arranged around the absorbent element 15 ', the absorbent element 15' extending longitudinally in a part of the cavity (not shown in the figure).
  • the absorbent element 15 extends from the outlet 12' of the space power combiner 10 'over a predetermined length.
  • the predetermined length may be 50 mm.
  • this predetermined length may be different, this value varying, for example, depending on the nature of the absorbent element 15 ′ used.
  • the absorbent member 15 comprises an absorbent material, such as an epoxy resin loaded with particles of a magnetic absorbent, for example ferrite particles.
  • the spatial power combiner 10 'further comprises a plastic element 16' extending longitudinally in the cavity, in extension of the absorbent element 15 '.
  • the plastic element 16 ' has a mechanical function, making it possible to hold the transmission lines a', b ', c', etc. in place.
  • the absorbent element 15 'and the plastic element 16' are fixed together by means of a threaded rod disposed in a recess 18 'made in the absorbent element 15' and the plastic element 16 '.
  • a first recess part 18a ' corresponding to the recess made in the plastic element 16', is a threaded longitudinal recess, the walls of the recess 18 'thus forming a screw thread.
  • a second recess part 18b ' corresponding to the recess made in the absorbent element 15', is a recess whose walls are smooth.
  • the fixing of the absorbent element 15 'and of the plastic element 16' can be carried out by different means.
  • the figure 3 represents a third embodiment of the spatial power combiner 10 ".
  • the absorbent element 15 "extends longitudinally into the cavity (not shown in this figure) starting from of the input 11 "of the spatial power combiner 10", over a predetermined length.
  • the spatial power combiner may have a length of 300 mm, and the absorbent element of 50 mm.
  • the length of the absorbent element may be 20 mm.
  • the values of the lengths of the spatial power combiner and of the absorbent element can be different.
  • the spatial power combiner 10 "comprises heat dissipation means 17" extending longitudinally in the cavity.
  • the heat dissipation means 17 “comprise in one embodiment a metal rod.
  • This embodiment is particularly advantageous since the metal rod allows efficient dissipation of the thermal energy in the form of heat produced in the space power combiner 10 ".
  • the absorbent element 15 is arranged so that it surrounds the dissipation means 17" over the predetermined length.
  • the heat dissipation means 17 extendend longitudinally throughout the entire cavity.
  • the absorbent element 15 extends over a predetermined length starting from the inlet 11 "of the space power combiner 10".
  • the heat dissipation means 17 are thus surrounded by the absorbent element 15" over the predetermined length.
  • the spatial power combiner 10 (see figure 1 ) further comprises a thermal evacuation module 18.
  • This thermal evacuation module 18 can be used with different structures of space power combiners 10, 10 ', 10 ", in particular with the structures shown on the diagrams. figures 2 and 3 .
  • This thermal evacuation module 18 makes it possible to further dissipate the heat produced in the space power combiner 10.
  • the thermal evacuation module 18 is a conventional module known to those skilled in the art and does not need to be described in detail here.
  • the outputs of the power amplifiers 23 (or outputs 21 of the amplification structure 20) have a low impedance.
  • the inputs 11 of the spatial power combiner 10 also have a low impedance.
  • the inputs of the spatial power combiner have low impedance, the output of the combiner has high impedance.
  • the spatial power combiner 10 further comprises an impedance pre-matching module 102.
  • This impedance pre-matching module 102 modifies the value of the impedance present at the input 11 of the spatial power combiner 10.
  • the impedance pre-adaptation module comprises the first parts of the transmission lines aa, ba, ca ... or access lines, which first parts or access lines aa, ba, ca ... extend radially through relative to the longitudinal axis of the cavity 14 of the space power combiner.
  • Each access line aa, ba, ca ... comprises a printed circuit comprising at least two conductive layers, a conductive layer carrying a signal and a conductive layer serving as a potential reference.
  • the figure 4a is a simplified illustration of an exploded view of a printed circuit forming the first part of a transmission line or access line aa of the spatial power combiner 10 according to one embodiment.
  • Each access line aa, ba, ca, ... comprises a set of layers superimposed between them.
  • the set of layers comprises a first conductive layer 200, a second conductive layer 400, as well as a third conductive layer 700.
  • the first conductive layer 200 carries a signal
  • the second 400 and third 700 conductive layers serve as a potential reference.
  • the set of layers further comprises a first layer of insulation 300, a second layer of insulation 600 and a layer of adhesive 500.
  • one of the conductive layers here being the third conductive layer 700, comprises pads 800 arranged on the edges along the layer.
  • each of the other layers has openings 900 arranged on the edge of the length of the layer, an opening having a shape complementary to a pad 800 of the third conductive layer 700 and being located so that a pad 800 can be inserted into an opening 900 of each layer of all the layers forming the access line aa.
  • the assembly formed by the pads 800 and by the openings 900 forms means for maintaining or fixing the layers of all the layers together.
  • the number of layers may be different.
  • the first conductive layer 200 has a central part 201 and two side parts 202.
  • the central part 201 of the first conductive layer 200 transports the signal transported by a transmission line a, the power of which will be combined with that of the other signals transported by the other transmission lines b, c, ....
  • the side portions 202 of the first conductive layer 200, the second conductive layer 400 and the third conductive layer 700 serve as a reference potential.
  • the lateral parts 202 of the first conductive layer 200, the second 400 and third 700 conductive layers are interconnected by the pads 800, these pads being for example metallic.
  • a first insulating layer 300 is placed between the first 200 and the second 400 conductive layer in order to insulate the latter two between them.
  • the second layer of insulation 600 is disposed between the second layer 400 and the third 700 conductive layers.
  • a layer of adhesive 500 is disposed between the second conductive layer 400 and the second layer of insulation 600.
  • first conductive layer 200, the second conductive layer 400 and the first insulating layer 300 form a first assembly
  • third conductive layer 700 and the second insulating layer 600 form a second together, the first and the second set being held together by means of the adhesive layer 500.
  • the variation in impedance is implemented by the first conductive layer 200 and the second conductive layer 400.
  • the width of the first conductive layer 200 decreases along the first part of the transmission line aa.
  • the width of the first conductive layer 200 thus has a lower value at the level of the output of the impedance pre-matching module 102, 102 '(or at the input of the core of the combiner 101, 101') than at the level of the 'input of this module 102, 102' (or at the input of the spatial power combiner 10).
  • the second conductive layer 400 has an opening 401.
  • This opening 401 or the width of the opening 401, increases along the first part of the transmission line aa.
  • the opening 401 of the second conductive layer 400 is thus larger at the output of the impedance pre-matching module 102, 102 '(or at the input of the core of the combiner 101, 101') than at the level of the input of this module 102, 102 '(or at the input of the spatial power combiner 10).
  • the figure 4b is a simplified illustration of an exploded view of a printed circuit forming the first part of a transmission line or access line aa 'of the spatial power combiner 10 according to a second embodiment.
  • the set of layers forming the access line aa ' comprises a first conductive layer 200', a second conductive layer 400 'and an insulating layer 300'.
  • This access line aa is arranged on a support or sole 1000', the second conductive layer 200 'being in contact with the hollow 1001'.
  • the support 1000 ′ comprises a set of hollows 1001 ′, each hollow 1001 ′ having a shape suitable for receiving the printed circuit forming the access line aa ′.
  • the number of hollows is equal to the number of access lines aa ', ba', ca ', ...
  • the support 1000 ' can be in one piece or be formed by a set of supports, each support being associated with an access line aa', ba ', ca', ...
  • the support 1000 'further comprises a second hollow 1002' made in the first hollow 1001 ', the second hollow 1002' receiving a second layer of insulation 600 '.
  • the second insulating layer 600 ′ and the second hollow 1002 ′ thus have complementary shapes.
  • the second insulating layer 600 ′ disposed in the second hollow 1002 ′ of the support 1000 ′ helps to hold the printed circuit forming the access line aa ′ arranged in the first hollow 1001 ′ of the support 1000 ′.
  • the support 1000 ′ is made of metal.
  • the first conductive layer 200 ' carries the signal transported by a transmission line a', the power of which will be combined with that of the other signals transported by the other transmission lines b ', c' ...
  • the second conductive layer 400 ', as well as the metal support 1000' serve as reference potential.
  • the second conductive layer 400 ′ is in contact with the support 1000 ′.
  • the insulating layer 300 ' is disposed between the first conductive layer 200' and the second conductive layer 400 'in order to insulate them from each other.
  • the width of the first conductive layer 200 thus has a lower value at the level of the output of the impedance pre-matching module 102, 102 '(or at the input of the core of the combiner 101, 101') than at the level of the 'input of this module 102, 102' (or at the input of the spatial power combiner 10 ').
  • the second conductive layer 400 ' has an opening 401'.
  • This opening 401 ', or the width of the opening 400', increases along the first part of the transmission line aa '.
  • the opening 401 ′ of the second conductive layer 400 ′ is thus larger at the output of the impedance pre-matching module 102, 102 ′ (or at the input of the core of the combiner 101, 101 ′) than at the level of the level of the input of this module 102, 102 ′ (or at the input of the spatial power combiner 10 ′).
  • the spatial power combiner does not include an impedance pre-matching module 101, 101 '
  • the variation in impedance between the input and the output of the spatial power combiner is implemented only by the coaxial structure of the heart of the combiner 101, 101 '.
  • the common mode impedance of the transmission lines of the coaxial structure of the power combiner increases along the coaxial structure of the core of the combiner 101, 101 '. This increase is implemented by a decrease in the ratio between the diameter formed by all the transmission lines located inside the cylindrical body 13 and the inside diameter of the cylindrical body 13 of the heart of the space power combiner 10.

Landscapes

  • Amplifiers (AREA)
  • Aerials With Secondary Devices (AREA)
  • Microwave Amplifiers (AREA)

Claims (15)

  1. Räumlicher Leistungskombinator (10; 10'; 10") umfassend:
    - mehrere Eingänge (11a, 11b, 11c, ...; 11a', 11b', 11c', ...; 11a", 11b", 11c", ...), an die jeweils ein Satz von Übertragungsleitungen (a, b, c, ...; a', b',c', ... a", b", c", ...) angeschlossen sind,
    - einen Ausgang (12; 12'; 12"),
    - einen Körper (13; 13'; 13"), der einen Hohlraum (14) mit einer Längsachse bildet, wobei der Satz von Übertragungsleitungen (a, b, c, ...; a', b', c', ... a", b", c", ...) in Längsrichtung durch den Hohlraum (14) verläuft und um ein absorbierendes Element (15; 15'; 15") angeordnet ist, das sich in Längsrichtung in dem Hohlraum (14) erstreckt, und
    - ein Impedanzvoranpassungsmodul (102; 102'), das am Eingang des räumlichen Leistungskombinators (10; 10'; 10") angeordnet ist, wobei das Impedanzvoranpassungsmodul (102; 102') erste Abschnitte der Übertragungsleitungen (aa, ba, ca ...; aa', ba', ca' ...) des Satzes von Übertragungsleitungen umfasst,
    wobei der räumliche Leistungskombinator (10, 10', 10") dadurch gekennzeichnet ist, dass:
    - die ersten Abschnitte der Übertragungsleitungen (aa, ba, ca ...; aa', ba', ca' ...) in radialer Richtung in Bezug auf die Längsachse des Hohlraums (14) verlaufen,
    - das Impedanzvoranpassungsmodul einen Träger (1000') aufweist, auf dem die ersten Abschnitte der Übertragungsleitungen (aa, ba, ca ...; aa', ba', ca', ...) angeordnet sind,
    wobei der Träger (1000') einen Satz von Ausnehmungen (1001') umfasst, wobei jeder erste Abschnitt der Übertragungsleitungen des Satzes von Übertragungsleitungen jeweils auf einer Ausnehmung (1001') des Satzes von Ausnehmungen angeordnet ist.
  2. Räumlicher Leistungskombinator nach Anspruch 1, dadurch gekennzeichnet, dass die Länge des absorbierenden Elements (15) der Länge der Übertragungsleitungen (a, b, c, ...) im räumlichen Leistungskombinator (10) entspricht.
  3. Räumlicher Leistungskombinator nach Anspruch 1, dadurch gekennzeichnet, dass die Länge des absorbierenden Elements (15', 15") kleiner ist als die Länge der Übertragungsleitungen (a', b', c', ... a", b", c", ...) in dem räumlichen Leistungskombinator (10'; 10").
  4. Räumlicher Leistungskombinator nach Anspruch 3, dadurch gekennzeichnet, dass sich das absorbierende Element (15") ausgehend von dem Eingang des räumlichen Leistungskombinators (10") erstreckt.
  5. Räumlicher Leistungskombinator nach Anspruch 3, dadurch gekennzeichnet, dass sich das absorbierende Element (15') ausgehend von dem Ausgang des räumlichen Leistungskombinators (10') erstreckt.
  6. Räumlicher Leistungskombinator nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass er ferner Wärmeableitungsmittel (17") umfasst, die sich in Längsrichtung in dem Hohlraum erstrecken, wobei das absorbierende Element (15") die Ableitungsmittel (17") umgibt.
  7. Räumlicher Leistungskombinator nach Anspruch 6, dadurch gekennzeichnet, dass das Wärmeabführungsmittel (17") aus einem Metallstab besteht.
  8. Räumlicher Leistungskombinator nach einem der Ansprüche 1 bis 7, dadurch gekennzeichnet, dass die Übertragungsleitungen (a, b, c ...; a', b', c', ...; a", b", c", ...) Mikrostreifenübertragungsleitungen sind.
  9. Räumlicher Leistungskombinator nach einem der Ansprüche 1 bis 8, dadurch gekennzeichnet, dass die Eingänge (11a, 11b, 11c, ...; 11a', 11b', 11c', ... 11a", 11b", 11c", ...) des räumlichen Leistungskombinators (10; 10'; 10") eine niedrige Impedanz aufweisen.
  10. Räumlicher Leistungskombinator nach einem der Ansprüche 1 bis 9, dadurch gekennzeichnet, dass er ferner ein Wärmeevakuierungsmodul (18) umfasst.
  11. Räumlicher Leistungskombinator nach einem der Ansprüche 1 bis 10, dadurch gekennzeichnet, dass jeder erste Abschnitt der Übertragungsleitungen (aa, ba, ca, ... aa', ba', ca', ...) eine Schichtanordnung umfasst, wobei die Schichtanordnung Folgendes umfasst
    - mindestens eine erste leitfähige Schicht (200; 200'), die ein Signal führt und eine entlang des ersten Abschnitts der Übertragungsleitung (aa, ba, ca, ...; aa', ba', ca', ...) abnehmende Breite aufweist, und
    - mindestens eine zweite leitfähige Schicht (400; 400'), die als Potenzialreferenz dient und eine Öffnung (401; 401') mit einer entlang des ersten Abschnitts der Übertragungsleitung (aa, ba, ca, ...; aa', ba', ca', ...) zunehmenden Breite aufweist.
  12. Räumlicher Leistungskombinator nach Anspruch 11, dadurch gekennzeichnet, dass die Schichtanordnung eine dritte leitfähige Schicht (700) umfasst, die als Referenzpotenzial dient.
  13. Leistungsverstärkeranordnung, dadurch gekennzeichnet, dass sie aus einem räumlichen Leistungskombinator (10; 10'; 10") nach einem der vorstehenden Ansprüche und einer am Eingang (11; 11'; 11") des räumlichen Leistungskombinators (10; 10'; 10") angeordneten Verstärkerstruktur (20) gebildet ist, wobei die Verstärkerstruktur eine Gruppe von Eingängen (21a, 21b, 21c, ...) und eine Gruppe von Ausgängen (22a, 22b, 22c, ...) umfasst, wobei die Ausgänge (22a, 22b, 22c, ...) jeweils mit den Eingängen (11a, 11b, 11c, ...; 11a', 11b', 11c', ...; 11a", 11b", 11c", ...) des räumlichen Leistungskombinators (10; 10'; 10") verbunden sind.
  14. Leistungsverstärkeranordnung nach Anspruch 13, dadurch gekennzeichnet, dass die Verstärkerstruktur (20) einen Satz von Leistungsverstärkern (23) umfasst, wobei jeder Leistungsverstärker (23) mit jedem Ausgang (22a, 22b, 22c, ...) der Verstärkerstruktur (20) verbunden ist.
  15. Leistungsverstärkeranordnung nach Anspruch 14, dadurch gekennzeichnet, dass die Ausgänge (22a, 22b, 22c, ...) der Leistungsverstärker (23) eine niedrige Impedanz aufweisen.
EP16200051.7A 2015-11-23 2016-11-22 Räumlicher leistungskombinator Active EP3171451B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1561267A FR3044171B1 (fr) 2015-11-23 2015-11-23 Combineur spatial de puissance

Publications (2)

Publication Number Publication Date
EP3171451A1 EP3171451A1 (de) 2017-05-24
EP3171451B1 true EP3171451B1 (de) 2021-11-10

Family

ID=55862858

Family Applications (1)

Application Number Title Priority Date Filing Date
EP16200051.7A Active EP3171451B1 (de) 2015-11-23 2016-11-22 Räumlicher leistungskombinator

Country Status (3)

Country Link
US (1) US10326191B2 (de)
EP (1) EP3171451B1 (de)
FR (1) FR3044171B1 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10003118B2 (en) 2015-12-22 2018-06-19 Qorvo Us, Inc. Spatial coupler and antenna for splitting and combining electromagnetic signals
US10454433B2 (en) 2017-06-29 2019-10-22 Qorvo Us, Inc. Amplifier assembly and spatial power combining device
US10651527B2 (en) 2017-08-22 2020-05-12 Qorvo Us, Inc. Spatial power-combining devices with segmented waveguides and antennas
US10812021B2 (en) 2017-08-22 2020-10-20 Qorvo Us, Inc. Antenna waveguide transitions for solid state power amplifiers
US10587027B2 (en) 2017-08-22 2020-03-10 Qorvo Us, Inc. Spatial combining devices for high-frequency operation
US10707819B2 (en) 2017-08-22 2020-07-07 Qorvo Us, Inc. Phase tuning for monolithic microwave integrated circuits
US10749276B2 (en) 2017-08-22 2020-08-18 Qorvo Us, Inc. Spatial power-combining devices and antenna assemblies
US10720711B2 (en) 2017-08-22 2020-07-21 Qorvo Us, Inc. Antenna structures for spatial power-combining devices
US10340574B2 (en) 2017-08-22 2019-07-02 Qorvo Us, Inc. Spatial combining device and antenna
US10164667B1 (en) * 2018-03-21 2018-12-25 Qorvo Us, Inc. Spatial power-combining devices with amplifier connectors
US10833386B2 (en) 2018-04-09 2020-11-10 Qorvo Us, Inc. Waveguide transitions for power-combining devices
US11255608B2 (en) 2018-08-06 2022-02-22 Qorvo Us, Inc. Heat exchanger assemblies for electronic devices
US11162734B2 (en) 2018-08-06 2021-11-02 Qorvo Us, Inc. Heat exchanger assemblies for electronic devices and related methods
US10855240B2 (en) 2018-11-15 2020-12-01 Qorvo Us, Inc. Structures for spatial power-combining devices
US10804588B2 (en) 2018-12-10 2020-10-13 Qorvo Us, Inc. Antenna structures for spatial power-combining devices
US11005437B2 (en) 2019-02-25 2021-05-11 Qorvo Us, Inc. Spatial power-combining devices with thin film resistors
US11387791B2 (en) 2020-03-17 2022-07-12 Qorvo Us, Inc. Spatial power-combining devices with reduced size
US11564337B2 (en) * 2020-03-17 2023-01-24 Qorvo Us, Inc. Thermal structures for heat transfer devices and spatial power-combining devices
US11621469B2 (en) 2021-02-01 2023-04-04 Qorvo Us, Inc. Power-combining devices with increased output power
US11955687B2 (en) 2022-01-10 2024-04-09 Qorvo Us, Inc. Structural arrangements for spatial power-combining devices
EP4287396A1 (de) * 2022-06-02 2023-12-06 Ion Beam Applications S.A. Hf-leistungskombinator/-teiler
CN116454575B (zh) * 2023-04-06 2025-10-03 大富科技(安徽)股份有限公司 滤波器及通信设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4129839A (en) * 1977-03-09 1978-12-12 Raytheon Company Radio frequency energy combiner or divider
US4371845A (en) * 1980-05-23 1983-02-01 Hughes Aircraft Company Modular microwave power divider-amplifier-combiner
US4424496A (en) * 1981-10-13 1984-01-03 Raytheon Company Divider/combiner amplifier
US5262739A (en) * 1989-05-16 1993-11-16 Cornell Research Foundation, Inc. Waveguide adaptors
US5142253A (en) * 1990-05-02 1992-08-25 Raytheon Company Spatial field power combiner having offset coaxial to planar transmission line transitions
US7215220B1 (en) * 2004-08-23 2007-05-08 Cap Wireless, Inc. Broadband power combining device using antipodal finline structure

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None *

Also Published As

Publication number Publication date
US20170149113A1 (en) 2017-05-25
FR3044171A1 (fr) 2017-05-26
US10326191B2 (en) 2019-06-18
EP3171451A1 (de) 2017-05-24
FR3044171B1 (fr) 2018-07-06

Similar Documents

Publication Publication Date Title
EP3171451B1 (de) Räumlicher leistungskombinator
EP2869400B1 (de) Doppelpolarisierter kompakter Leistungsverteiler, Netz aus mehreren Verteilern, kompaktes Strahlungselement und Flachantenne, die einen solchen Verteiler umfasst
EP4012834B1 (de) Antennenquelle für eine direkt strahlende gruppenantenne, strahlplatte und antenne mit mehreren antennenquellen
EP3602689B1 (de) Elektromagnetische antenne
EP2223377B1 (de) Radiale Vorrichtung zur Leistungsverstärkung mit Phasensdispersionausgleich der Verstärkungswege
EP3136499B1 (de) Aufteilungs-/kombinationssystem für hyperfrequenzwelle
FR3045220A1 (fr) Ensemble d'excitation compact bipolarisation pour un element rayonnant d'antenne et reseau compact comportant au moins quatre ensembles d'excitation compacts
EP3154128B1 (de) Kompakter multifrequenz-speisehornstrahler, strahlungsquelle und antenne, die einen solchen speisehornstrahler umfasst
EP3235058B1 (de) Drahtplattenantenne mit einem kapazitiven dach mit einem schlitz zwischen der speisungssonde und dem kurzschlussdraht
EP2953203B1 (de) Vorrichtung zur energieübertragung von einem milieu in ein anderes
EP0015610B1 (de) Spiegelfrequenzreflektierendes Mikrowellenfilter und Mikrowellenempfänger mit einem solchen Filter
EP3721501B1 (de) Mikrowellen-bauelement und zugehöriges herstellungsverfahren
WO2019229515A1 (fr) Module radiofréquence
EP2325939B1 (de) Vorrichtung zum Multiplexen von thermisch optimierten Hyperfrequenzkanälen
EP3241411B1 (de) Hyperfrequentes gehäuse mit kleiner oberflächenbelegung und montage solch eines gehäuses auf einer schaltung
FR3060867A1 (fr) Architecture de bloc sources deployable, antenne compacte et satellite comportant une telle architecture
FR3081617A1 (fr) Dispositif coupleur/combineur micro-ondes et generateur micro-ondes associe
EP0430136A1 (de) Bandsperrfilter für Mikrowellenhohlleiter
EP1680799B1 (de) Mikrowellenröhre mit geringer störstrahlung
EP2946435B1 (de) Antenne mit einem miniaturisierten wellenleiter
EP1066741B1 (de) Elektronische schaltungsstruktur mit optimisierung des platzbedarfs in abhangigkeit vom vorhandenen volumen
WO2019081710A1 (fr) Ensemble guide d'onde et procédé d'assemblage associé
EP0013204A1 (de) Frequenzbandfilter
WO2010119207A1 (fr) Antenne radioélectrique, procédé de dimensionnement d'un corps plat de l'antenne, et procédé de fabrication d'une telle antenne
FR2887078A1 (fr) Antenne plane de television

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN PUBLISHED

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20171025

RBV Designated contracting states (corrected)

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

17Q First examination report despatched

Effective date: 20200305

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

RIC1 Information provided on ipc code assigned before grant

Ipc: H01P 5/02 20060101AFI20210512BHEP

Ipc: H01P 5/12 20060101ALI20210512BHEP

Ipc: H01P 1/23 20060101ALN20210512BHEP

RIC1 Information provided on ipc code assigned before grant

Ipc: H01P 5/02 20060101AFI20210514BHEP

Ipc: H01P 5/12 20060101ALI20210514BHEP

Ipc: H01P 1/23 20060101ALN20210514BHEP

INTG Intention to grant announced

Effective date: 20210609

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

Free format text: NOT ENGLISH

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 1446922

Country of ref document: AT

Kind code of ref document: T

Effective date: 20211115

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602016065949

Country of ref document: DE

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

Free format text: LANGUAGE OF EP DOCUMENT: FRENCH

REG Reference to a national code

Ref country code: NL

Ref legal event code: FP

REG Reference to a national code

Ref country code: SE

Ref legal event code: TRGR

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG9D

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK05

Ref document number: 1446922

Country of ref document: AT

Kind code of ref document: T

Effective date: 20211110

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211110

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211110

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211110

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220210

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211110

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220310

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220310

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211110

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220210

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211110

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211110

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220211

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211110

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211110

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211110

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211110

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20211122

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211110

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211110

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211110

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20211130

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20211130

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602016065949

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211110

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20220811

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20211122

Ref country code: AL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211110

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211110

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211110

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20161122

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211110

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20220630

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20220630

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211110

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211110

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211110

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: NL

Payment date: 20251119

Year of fee payment: 10

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20251118

Year of fee payment: 10

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20251125

Year of fee payment: 10

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20251125

Year of fee payment: 10

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: SE

Payment date: 20251119

Year of fee payment: 10