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EP3170203A1 - Light emitting diodes and reflector - Google Patents

Light emitting diodes and reflector

Info

Publication number
EP3170203A1
EP3170203A1 EP15738688.9A EP15738688A EP3170203A1 EP 3170203 A1 EP3170203 A1 EP 3170203A1 EP 15738688 A EP15738688 A EP 15738688A EP 3170203 A1 EP3170203 A1 EP 3170203A1
Authority
EP
European Patent Office
Prior art keywords
light
output section
semiconductor diode
diode structures
light output
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP15738688.9A
Other languages
German (de)
French (fr)
Other versions
EP3170203B1 (en
Inventor
Floris Maria Hermansz Crompvoets
Norbertus Antonius Maria Sweegers
Hugo Johan Cornelissen
Marc Andre De Samber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lumileds Holding BV
Original Assignee
Koninklijke Philips NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips NV filed Critical Koninklijke Philips NV
Publication of EP3170203A1 publication Critical patent/EP3170203A1/en
Application granted granted Critical
Publication of EP3170203B1 publication Critical patent/EP3170203B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H10W90/00—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/034—Manufacture or treatment of coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses

Definitions

  • This invention relates to a light source, and more particularly to a light source comprising a plurality of semiconductor light sources.
  • LEDs light emitting diodes
  • OLEDs organic LEDs
  • laser diodes are known to be energy efficient and small light sources that can exhibit a small/low etendue (i.e. the product of emitting area with solid angle in which the light is emitted).
  • Such semiconductor light sources may therefore be beneficial for applications where a bright light source is needed.
  • Typical example applications include projection systems, automotive lighting, camera flashlights, and spot lights.
  • improved miniaturization is often desirable.
  • merely reducing the size of a semiconductor light source reduces the generated light flux.
  • FIGS 1A and IB illustrate a known LED-based light source 10 employing this concept, wherein light generated by an LED 12 (on a die substrate 14) is recycled/reflected in a mix box 16 having high reflectivity until it escapes via a small aperture 18.
  • the aperture 18 being "small” it is simply meant as being smaller than the LED 12 such that the aperture area A A (i.e. width W A X L A ) is less than the LED area A LED (i.e. width W LED X L LED ) of the LED 12.
  • a light source comprising: first and second semiconductor diode structures adapted to generate light, the first and second semiconductor diode structures being laterally adjacent to each other; a light output section at least partially overlapping both of the first and second semiconductor diode structures and adapted to output light from the first and second semiconductor diode structures; and a light reflecting structure at least partially enclosing side surfaces of the first and second semiconductor diode structures and the light output section and adapted to reflect light from the semiconductor diode structures towards the light output section, wherein the area of the light output section is less than the combined area of the first and second semiconductor diode structures.
  • Embodiments may achieve savings in materials and/or space by arranging light emitting semiconductor diode structures (such as LEDs) to be laterally adjacent and then sharing a single light output section between the adjacent diode structures.
  • light emitting semiconductor diode structures such as LEDs
  • the light output section can comprise a single component/structure (such as an aperture or an phosphorescent platelet, for example) that is shared across multiple light sources to provide savings/reductions in materials, size, device complexity, and/or manufacturing complexity.
  • embodiments may provide a high-luminance light source comprising laterally arranged sub-sources that are overlapped by a common light output section.
  • the position(s) and/or shape of the light output section can be changed or designed to enable tiling of the sub-sources such that edges of multiple light output sections can be closely aligned (when viewed from above, for example).
  • LED light sources may therefore be strategically arranged in the horizontal axis so that they are overlapped by a single or common light output section.
  • pairs of closely positioned LED light sources may be aligned with each other to form a column-like array of pairs such that, when viewed from directly above (i.e. plan view), a single elongate light output section can at least partially overlap each pair of LED light sources in the array.
  • the LED light sources of the present disclosure may be any type of LED, such as a Flip Chip type (Thin Film Flip Chip), Patterned Sapphire Substrate, top connected/top emission, top-bottom connected. Also, the light source could be used as naked die, or packaged.
  • a light output section (or light emission area) of an LED light source refers to an area towards or through which light from the LED is output (or emitted).
  • a cavity or cavities of a LED light source may thus extend towards the light output section.
  • the light output section may for example be an area (volume) of the growing template (growth substrate), such as a sapphire. Light from the semiconductor structures may be emitted in various directions, thus resulting in some emitted light being incident on the light reflecting structure and reflected back towards the semiconductor structure(s).
  • Light generated by the semiconductor structures may therefore be reflected by the light reflecting structure until it is directed through (and out of) the light output section.
  • the arrangement of the light reflecting structure and the light output section may therefore be considered as forming a 'mix-box' structure which reflects light rays until they are output through the light output section.
  • the light output direction (from the light output section) may be generalized to be in a vertical direction (e.g. upwardly in the Figures) along which light is output from the light output section.
  • the light output direction should be understood to refer to the general upwardly extending direction that light may be output from a light output section, extending away from the surface of the light output section for example.
  • the semiconductor diode structures may be arranged such that there is substantially zero separation between adjacent edges of the semiconductor diode structures. In practice, however, it may be difficult to perfectly align adjacent edges to have zero lateral separation. Thus, in embodiments, the semiconductor diode structures may be laterally separated by a negligible or small amount. For example, there may be a lateral separation between the adjacent edges of the two semiconductor diode structures, and this lateral separation or overlap may be less than 10% of the lateral width of the semiconductor diode structures. In embodiments, it may be preferable to reduce such separation to a minimum value (e.g. less than 5% of the lateral width of the semiconductor diode structures, and even more preferably less than 1% of the lateral width of the semiconductor diode structures).
  • a minimum value e.g. less than 5% of the lateral width of the semiconductor diode structures, and even more preferably less than 1% of the lateral width of the semiconductor diode structures.
  • the light output section may comprise an aperture formed in the light reflecting structure.
  • an embodiment may further comprise a layer of optical enhancement material below the light output section and at least partially overlapping both of the first and second semiconductor diode structures, wherein the light reflecting structure at least partially encloses side surfaces of the layer of optical enhancement material.
  • an embodiment may further comprise a layer of optical enhancement material sandwiched between the top of the semiconductor light sources and the bottom of the light output section.
  • the light output section may comprise an optical enhancement material.
  • Optical enhancement material may be a 'color conversion fill', such as a phosphorescent material.
  • a phosphorescent material examples may include a ceramic phosphor, a phosphor platelet, or a known phosphorescent material referred to as a "lumiramic" material. This may further help to maintain the etendue of the lateral emission area and/or change the color of the emitted light.
  • an embodiment comprises a plurality of light output sections
  • some or all of the light output sections may comprise (e.g. be filled) with different materials.
  • certain light output sections may be filled with a first type of phosphor (e.g.
  • Embodiments may be employed in the field of automotive lighting and other fields/applications where high-luminance lighting is desirable.
  • an automotive light comprising a light source according to an embodiment.
  • a projector light comprising a light source according to an embodiment.
  • a method of manufacturing a light source comprising: arranging first and second semiconductor diode structures adapted to generate light to be laterally adjacent to each other; providing a light output section at least partially overlapping both of the first and second semiconductor diode structures, the light output section being adapted to output light from the first and second semiconductor diode structures; and at least partially enclosing sides surfaces of the first and second semiconductor diode structures and the light output section with a light reflecting structure, the light reflecting structure being adapted to reflect light from the semiconductor diode structures towards the light output section, wherein the area of the light output section is less than the combined area of the first and second semiconductor diode structures.
  • the step of arranging may comprise arranging the first and second semiconductor diode structures such that there is a lateral separation between the adjacent edges of the first and second semiconductor diode structures, the lateral separation being less than 10% of the lateral width of the first and second semiconductor diode structures.
  • the light output section may comprise an aperture formed in the light reflecting structure.
  • Embodiments may further comprise forming a layer of optical enhancement material below the light output section and at least partially overlapping both of the first and second semiconductor diode structures, wherein the step of at least partially enclosing sides surfaces of the first and second semiconductor diode structures and the light output section with a light reflecting structure light reflecting structure further comprise at least partially enclosing side surfaces of the layer of optical enhancement material with the light reflecting structure light reflecting structure.
  • the light output section may comprise an optical enhancement material.
  • Fig. 1A is a cross-sectional view of a known LED light source
  • Fig. IB is a plan view of the known LED light source of Figure 1A;
  • Fig. 2A is a plan view of a light source according to an embodiment
  • Fig. 2B is a cross- sectional view of the embodiment of Fig. 2A (taken along the line X-X of Fig. 2A);
  • Fig. 3 A is a plan view of a light source according to another embodiment
  • Fig. 3B is a cross- sectional view of the embodiment of Fig. 3A (taken along the line X-X of Fig. 3A);
  • Fig. 4A is a plan view of a light source according to another embodiment
  • Fig. 4B is a cross- sectional view of the embodiment of Fig. 4A (taken along the line X-X of Fig. 4A);
  • Fig. 5 illustrates a modification to the embodiment of Figs. 4A and 4B.
  • Fig. 6 illustrates a modification to the embodiment of Figs. 2A and 2B.
  • the invention provides a light source comprising a plurality of LED light sources and a method for manufacturing the same.
  • Embodiments may be of particular relevance to applications that require light of high or increased luminance from a relatively small and/or efficient light source.
  • Embodiments employ the concept of arranging light emitting semiconductor diode structures (such as LEDs) to be laterally adjacent and then providing a single light output section (of reduced size compared to the aligned diode structures) overlapping the adjacent diode structures. In this way, a common light output section may be employed or shared across multiple LED light sources to provide savings or reductions in materials and/or manufacturing complexity.
  • vertical means substantially orthogonal to the surface of a substrate.
  • lateral or horizontal means substantially parallel to the surface of a substrate.
  • terms describing positioning or locations are to be construed in conjunction with the orientation of the structures illustrated in the diagrams.
  • first layer drawn as being thicker than a second layer may, in practice, be thinner than the second layer.
  • Figure 2A is a plan view of the light source
  • Figure 2B is a cross-sectional view of the light source (taken along the line X-X of Figure 2A).
  • the light source comprises a plurality of LEDs 12 positioned on the upper surface of a substrate 20.
  • the plurality of LEDs 12 are arranged in a 2x4 array comprising two columns of LEDs 12, each column having four rows of LEDs 12.
  • the depicted arrangement of LEDs 12 may be described as comprising four pairs 12i,12 2 ,12 3 ,12 4 of closely-positioned LED light sources 12 which are aligned in a column to form a column-like array of pairs.
  • the LEDs 12 can be described as being laterally adjacent to each other since they all lie in the same horizontal plane.
  • a light output section 18 is provided on top of the LEDs 12 such that it partially overlaps the top/upper surface of each LED 12.
  • the light output section 18 is adapted to output light from the LEDs 12.
  • the light output section 18 comprises an optical enhancement material such as phosphorescent material or a lumiramic.
  • a single elongate light output section 18 partially overlaps each pair of LEDs 12 in the 2x4 array.
  • a single, common light output section 18 partially overlaps all of the LEDs.
  • a light reflecting structure 16 encloses the side surfaces of the LEDs 12 and the light output section 18, and also encloses the LED top/upper surfaces that are not covered by the light output section 18.
  • the light reflecting structure 16 covers the LEDs 12 and light output section 18 such that only the top/upper surface of the light output section 18 is exposed (i.e. is not covered by the light reflecting structure 16).
  • the light reflecting structure 16 comprises a highly reflective material that reflects light from LEDs 12 towards the light output section 18. The light reflecting structure 16 may therefore be considered as forming a light mix box from which light can only escape via the light output section 18.
  • the embodiment employs the concept of having a light output section 18 which is smaller than the LEDs 12 it is adapted to output light from. This enables increased luminance from the LEDs 12 to be obtained. Furthermore, the use of a single light output section 18 partially overlapping multiple light generating structures (e.g. LEDs 12) enables a single component or structure to be employed and shared across multiple light sources. A reduction in device complexity and required materials can therefore be obtained.
  • Figure 3 there is depicted a light source according to another embodiment of the invention. More specifically, Figure 3A is a plan view of the light source, and Figure 3B is a cross-sectional view of the light source (taken along the line X-X of Figure 3A).
  • each light output section 18 is arranged to partially overlap a respective pair of LEDs.
  • a first light output section I8 1 partially overlaps a first pair 12i of LEDs
  • a second light output section 18 2 partially overlaps a second pair 12 2 of LEDs
  • a third light output section I8 3 partially overlaps a third pair 12 3 of LEDs
  • a fourth light output section I8 4 partially overlaps a fourth pair 12 4 of LEDs. It will therefore be appreciated that each light output section 18 is arranged to partially overlap two LEDs.
  • the area of a light output section 18 is less than the total area of the LEDs it partially covers, thus employing the concept of having a light output section 18 which is smaller than the LEDs 12 it is adapted to output light from. This enables increased luminance from the LEDs 12 to be obtained. Furthermore, the use of a single light output section 18 partially overlapping two light generating structures (e.g. LEDs 12) enables a reduction in materials and complexity whist providing for light of increased luminance from the light source. It may also enable a similar layout of light outputting areas as current devices, which can assist implementation in existing products.
  • Figure 4A is a plan view of the light source
  • Figure 4B is a cross-sectional view of the light source (taken along the line X-X of Figure 4A).
  • the embodiment of Figure 4 differs from that of Figure 2 in that the single light output section 18 now comprises an aperture 18 (formed in the light reflecting structure 16).
  • the light output section 18 i.e. aperture 18
  • the shape and size of the light output section 18 of Figure 4 is very similar to that of Figure 2.
  • the area of the light output section 18 is less than the total area of the LEDs it overlaps, thereby employing the concept of having a light output section 18 which is smaller than the LEDs 12 it is adapted to output light from.
  • the light output optical enhancement material comprises a lumiramic or phosphorescent material which is adapted to convert the color of light emitted by the LEDs.
  • the light reflecting structure 16 covers the side surfaces of the layer 22 of optical enhancement material as well as a portion of the upper surface of the layer 22 of optical enhancement material. In other words, the light reflecting structure 16 covers the LEDs 12 and layer 22 of optical enhancement material such that only the top/upper surface of layer 22 of optical enhancement material is exposed (i.e. uncovered) by the light output section 18.
  • the Figure 4 illustrates an embodiment wherein the light output section 18 comprises an aperture or cavity.
  • the layer 22 of optical enhancement material is provided in this embodiment to alter the color of light emitted by the LEDs 12.
  • the embodiment of Figure 4 may be modified to not include the layer 22 of optical enhancement material (if alteration of the color of light from the LEDs is not required, for example).
  • Figure 4 may be modified by replacing the aperture 18 of Figure 4 with optical enhancement material (such as lumiramic or
  • phosphorescent material may provide for the alteration of output light to different colors, for example.
  • the light reflecting structure 16 may not be entirely reflecting. In other words, the light reflecting structure may not have substantially 100% reflectivity, and so some light may leak through it. This increases the size of the light outputting area and hence reduces luminance. This may introduce color over position effects (e.g. a blue halo around white light in the center).
  • embodiments may be made "light leak tight" by blocking the light with an opaque/reflective coating.
  • a reflective coating 30 is provided on the upper surface of the light reflecting structure 16. This helps to lower the overall light transmittance of the light reflecting structure 16 by reflecting light that is incident on the lower surface of the reflective coating 30 from below (e.g. light leaking through the light reflecting structure 16).
  • a computer program may be stored/distributed on a suitable medium, such as an optical storage medium or a solid-state medium supplied together with or as part of other hardware, but may also be distributed in other forms, such as via the Internet or other wired or wireless telecommunication systems. Any reference signs in the claims should not be construed as limiting the scope.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)

Abstract

Proposed is a light source comprising: first and second semiconductor diode structures adapted to generate light, the first and second semiconductor diode structures being laterally adjacent to each other; a light output section at least partially overlapping both of the first and second semiconductor diode structures and adapted to output light from the first and second semiconductor diode structures; and a light reflecting structure at least partially enclosing side surfaces of the first and second semiconductor diode structures and the light output section and adapted to reflect light from the semiconductor diode structures towards the light output section. The area of the light output section is less than the combined area of the first and second semiconductor diode structures.

Description

LIGHT EMITTING DIODES AND REFLECTOR
FIELD OF THE INVENTION
This invention relates to a light source, and more particularly to a light source comprising a plurality of semiconductor light sources. BACKGROUND OF THE INVENTION
Semiconductor light sources, such as light emitting diodes (LEDs), high power LEDs, organic LEDs (OLEDs) and laser diodes are known to be energy efficient and small light sources that can exhibit a small/low etendue (i.e. the product of emitting area with solid angle in which the light is emitted).
Such semiconductor light sources may therefore be beneficial for applications where a bright light source is needed. Typical example applications include projection systems, automotive lighting, camera flashlights, and spot lights. For these examples, improved miniaturization is often desirable. However, merely reducing the size of a semiconductor light source reduces the generated light flux.
It is known to obtain increased luminance from a semiconductor light source by means of a mix box with a small aperture (i.e. light output section) from which the light can escape. Figures 1A and IB illustrate a known LED-based light source 10 employing this concept, wherein light generated by an LED 12 (on a die substrate 14) is recycled/reflected in a mix box 16 having high reflectivity until it escapes via a small aperture 18. By the aperture 18 being "small" it is simply meant as being smaller than the LED 12 such that the aperture area AA (i.e. width WA X LA) is less than the LED area ALED (i.e. width WLED X LLED) of the LED 12.
SUMMARY OF THE INVENTION
The invention is defined by the claims.
According to an aspect of the invention there is provided a light source comprising: first and second semiconductor diode structures adapted to generate light, the first and second semiconductor diode structures being laterally adjacent to each other; a light output section at least partially overlapping both of the first and second semiconductor diode structures and adapted to output light from the first and second semiconductor diode structures; and a light reflecting structure at least partially enclosing side surfaces of the first and second semiconductor diode structures and the light output section and adapted to reflect light from the semiconductor diode structures towards the light output section, wherein the area of the light output section is less than the combined area of the first and second semiconductor diode structures.
Embodiments may achieve savings in materials and/or space by arranging light emitting semiconductor diode structures (such as LEDs) to be laterally adjacent and then sharing a single light output section between the adjacent diode structures. Thus, there is proposed a concept for forming a high luminance LED-based light source that has a light output section which is of lesser area than the light generating portions (e.g. semiconductor diode structures). By arranging such a light output section to at least partially overlap a plurality of light generating structures, the light output section can comprise a single component/structure (such as an aperture or an phosphorescent platelet, for example) that is shared across multiple light sources to provide savings/reductions in materials, size, device complexity, and/or manufacturing complexity.
In other words, embodiments may provide a high-luminance light source comprising laterally arranged sub-sources that are overlapped by a common light output section. The position(s) and/or shape of the light output section can be changed or designed to enable tiling of the sub-sources such that edges of multiple light output sections can be closely aligned (when viewed from above, for example).
Multiple LED light sources may therefore be strategically arranged in the horizontal axis so that they are overlapped by a single or common light output section. For example, pairs of closely positioned LED light sources may be aligned with each other to form a column-like array of pairs such that, when viewed from directly above (i.e. plan view), a single elongate light output section can at least partially overlap each pair of LED light sources in the array. By arranging multiple LED light sources to be overlapped by a common light output section, savings in material and/or space (e.g. a reduction in foot print size) may be achieved.
The LED light sources of the present disclosure may be any type of LED, such as a Flip Chip type (Thin Film Flip Chip), Patterned Sapphire Substrate, top connected/top emission, top-bottom connected. Also, the light source could be used as naked die, or packaged. A light output section (or light emission area) of an LED light source refers to an area towards or through which light from the LED is output (or emitted). A cavity or cavities of a LED light source may thus extend towards the light output section. The light output section may for example be an area (volume) of the growing template (growth substrate), such as a sapphire. Light from the semiconductor structures may be emitted in various directions, thus resulting in some emitted light being incident on the light reflecting structure and reflected back towards the semiconductor structure(s). Light generated by the semiconductor structures may therefore be reflected by the light reflecting structure until it is directed through (and out of) the light output section. The arrangement of the light reflecting structure and the light output section may therefore be considered as forming a 'mix-box' structure which reflects light rays until they are output through the light output section. Accordingly the light output direction (from the light output section) may be generalized to be in a vertical direction (e.g. upwardly in the Figures) along which light is output from the light output section. However, it will be understood that not all light output from a light output section may be output exactly vertically. Thus, the light output direction should be understood to refer to the general upwardly extending direction that light may be output from a light output section, extending away from the surface of the light output section for example.
The semiconductor diode structures may be arranged such that there is substantially zero separation between adjacent edges of the semiconductor diode structures. In practice, however, it may be difficult to perfectly align adjacent edges to have zero lateral separation. Thus, in embodiments, the semiconductor diode structures may be laterally separated by a negligible or small amount. For example, there may be a lateral separation between the adjacent edges of the two semiconductor diode structures, and this lateral separation or overlap may be less than 10% of the lateral width of the semiconductor diode structures. In embodiments, it may be preferable to reduce such separation to a minimum value (e.g. less than 5% of the lateral width of the semiconductor diode structures, and even more preferably less than 1% of the lateral width of the semiconductor diode structures).
In an embodiment, the light output section may comprise an aperture formed in the light reflecting structure.
Also, an embodiment may further comprise a layer of optical enhancement material below the light output section and at least partially overlapping both of the first and second semiconductor diode structures, wherein the light reflecting structure at least partially encloses side surfaces of the layer of optical enhancement material. In other words, an embodiment may further comprise a layer of optical enhancement material sandwiched between the top of the semiconductor light sources and the bottom of the light output section.
Further, in embodiments, the light output section may comprise an optical enhancement material.
Optical enhancement material may be a 'color conversion fill', such as a phosphorescent material. Examples may include a ceramic phosphor, a phosphor platelet, or a known phosphorescent material referred to as a "lumiramic" material. This may further help to maintain the etendue of the lateral emission area and/or change the color of the emitted light.
Further, if an embodiment comprises a plurality of light output sections, some or all of the light output sections may comprise (e.g. be filled) with different materials. As an example, certain light output sections may be filled with a first type of phosphor (e.g.
converting blue to white) and others may be filled with another type of phosphor (e.g.
converting blue to red).
Embodiments may be employed in the field of automotive lighting and other fields/applications where high-luminance lighting is desirable.
Thus, according to an aspect of the invention, there may be provided an automotive light comprising a light source according to an embodiment.
According to another aspect of the invention, there may be provided a projector light comprising a light source according to an embodiment.
According to yet another aspect of the invention, there is provided a method of manufacturing a light source comprising: arranging first and second semiconductor diode structures adapted to generate light to be laterally adjacent to each other; providing a light output section at least partially overlapping both of the first and second semiconductor diode structures, the light output section being adapted to output light from the first and second semiconductor diode structures; and at least partially enclosing sides surfaces of the first and second semiconductor diode structures and the light output section with a light reflecting structure, the light reflecting structure being adapted to reflect light from the semiconductor diode structures towards the light output section, wherein the area of the light output section is less than the combined area of the first and second semiconductor diode structures.
The step of arranging may comprise arranging the first and second semiconductor diode structures such that there is a lateral separation between the adjacent edges of the first and second semiconductor diode structures, the lateral separation being less than 10% of the lateral width of the first and second semiconductor diode structures. The light output section may comprise an aperture formed in the light reflecting structure.
Embodiments may further comprise forming a layer of optical enhancement material below the light output section and at least partially overlapping both of the first and second semiconductor diode structures, wherein the step of at least partially enclosing sides surfaces of the first and second semiconductor diode structures and the light output section with a light reflecting structure light reflecting structure further comprise at least partially enclosing side surfaces of the layer of optical enhancement material with the light reflecting structure light reflecting structure.
In an embodiment, the light output section may comprise an optical enhancement material.
BRIEF DESCRIPTION OF THE DRAWINGS
Examples of the invention will now be described in detail with reference to the accompanying drawings, in which:
Fig. 1A is a cross-sectional view of a known LED light source;
Fig. IB is a plan view of the known LED light source of Figure 1A;
Fig. 2A is a plan view of a light source according to an embodiment;
Fig. 2B is a cross- sectional view of the embodiment of Fig. 2A (taken along the line X-X of Fig. 2A);
Fig. 3 A is a plan view of a light source according to another embodiment;
Fig. 3B is a cross- sectional view of the embodiment of Fig. 3A (taken along the line X-X of Fig. 3A);
Fig. 4A is a plan view of a light source according to another embodiment; Fig. 4B is a cross- sectional view of the embodiment of Fig. 4A (taken along the line X-X of Fig. 4A);
Fig. 5 illustrates a modification to the embodiment of Figs. 4A and 4B; and
Fig. 6 illustrates a modification to the embodiment of Figs. 2A and 2B. DETAILED DESCRIPTION OF THE EMBODIMENTS
The invention provides a light source comprising a plurality of LED light sources and a method for manufacturing the same. Embodiments may be of particular relevance to applications that require light of high or increased luminance from a relatively small and/or efficient light source. Embodiments employ the concept of arranging light emitting semiconductor diode structures (such as LEDs) to be laterally adjacent and then providing a single light output section (of reduced size compared to the aligned diode structures) overlapping the adjacent diode structures. In this way, a common light output section may be employed or shared across multiple LED light sources to provide savings or reductions in materials and/or manufacturing complexity.
The term vertical, as used herein, means substantially orthogonal to the surface of a substrate. The terms lateral or horizontal, as used herein, means substantially parallel to the surface of a substrate. Also, terms describing positioning or locations (such as above, below, top, bottom, etc.) are to be construed in conjunction with the orientation of the structures illustrated in the diagrams.
The diagrams are purely schematic and it should therefore be understood that the dimensions of features are not drawn to scale. Accordingly, the illustrated thickness and/or separation of any of the layers should not be taken as limiting. For example, a first layer drawn as being thicker than a second layer may, in practice, be thinner than the second layer.
Referring to Figure 2, there is depicted a light source according to an embodiment of the invention. More specifically, Figure 2A is a plan view of the light source, and Figure 2B is a cross-sectional view of the light source (taken along the line X-X of Figure 2A).
The light source comprises a plurality of LEDs 12 positioned on the upper surface of a substrate 20. Here, the plurality of LEDs 12 are arranged in a 2x4 array comprising two columns of LEDs 12, each column having four rows of LEDs 12. Thus, it will be appreciated that the depicted arrangement of LEDs 12 may be described as comprising four pairs 12i,122,123,124of closely-positioned LED light sources 12 which are aligned in a column to form a column-like array of pairs. Being positioned on the flat upper surface of the substrate, the LEDs 12 can be described as being laterally adjacent to each other since they all lie in the same horizontal plane.
A light output section 18 is provided on top of the LEDs 12 such that it partially overlaps the top/upper surface of each LED 12. The light output section 18 is adapted to output light from the LEDs 12. Here, the light output section 18 comprises an optical enhancement material such as phosphorescent material or a lumiramic.
Accordingly, when viewed from directly above (i.e. in plan view as depicted in Figure 2A), a single elongate light output section 18 partially overlaps each pair of LEDs 12 in the 2x4 array. A single, common light output section 18 partially overlaps all of the LEDs.
A light reflecting structure 16 encloses the side surfaces of the LEDs 12 and the light output section 18, and also encloses the LED top/upper surfaces that are not covered by the light output section 18. Thus, the light reflecting structure 16 covers the LEDs 12 and light output section 18 such that only the top/upper surface of the light output section 18 is exposed (i.e. is not covered by the light reflecting structure 16). The light reflecting structure 16 comprises a highly reflective material that reflects light from LEDs 12 towards the light output section 18. The light reflecting structure 16 may therefore be considered as forming a light mix box from which light can only escape via the light output section 18.
Because the area of the light output section 18 is less than the total area of the LEDs, the embodiment employs the concept of having a light output section 18 which is smaller than the LEDs 12 it is adapted to output light from. This enables increased luminance from the LEDs 12 to be obtained. Furthermore, the use of a single light output section 18 partially overlapping multiple light generating structures (e.g. LEDs 12) enables a single component or structure to be employed and shared across multiple light sources. A reduction in device complexity and required materials can therefore be obtained.
Referring to Figure 3, there is depicted a light source according to another embodiment of the invention. More specifically, Figure 3A is a plan view of the light source, and Figure 3B is a cross-sectional view of the light source (taken along the line X-X of Figure 3A).
The embodiment of Figure 3 is very similar to the embodiment of Figure 2. Detailed description of all of the same or similar technical features will be omitted so as to avoid unnecessary repetition. Instead, it is noted that the embodiment of Figure 3 only differ from that of Figure 2 in that four light output sections 18i, 182, I83, I84 are employed. Each light output section 18 is arranged to partially overlap a respective pair of LEDs. Thus, a first light output section I81 partially overlaps a first pair 12i of LEDs, a second light output section 182 partially overlaps a second pair 122 of LEDs, a third light output section I83 partially overlaps a third pair 123 of LEDs, and a fourth light output section I84 partially overlaps a fourth pair 124 of LEDs. It will therefore be appreciated that each light output section 18 is arranged to partially overlap two LEDs.
As with the embodiment of Figure 2, the area of a light output section 18 is less than the total area of the LEDs it partially covers, thus employing the concept of having a light output section 18 which is smaller than the LEDs 12 it is adapted to output light from. This enables increased luminance from the LEDs 12 to be obtained. Furthermore, the use of a single light output section 18 partially overlapping two light generating structures (e.g. LEDs 12) enables a reduction in materials and complexity whist providing for light of increased luminance from the light source. It may also enable a similar layout of light outputting areas as current devices, which can assist implementation in existing products.
Referring to Figure 4, there is depicted a light source according to another embodiment of the invention. More specifically, Figure 4A is a plan view of the light source, and Figure 4B is a cross-sectional view of the light source (taken along the line X-X of Figure 4A).
The embodiment of Figure 4 is similar to the embodiment of Figure 2.
Detailed description of all of the same or similar technical features will be omitted so as to avoid unnecessary repetition. Instead, it is noted that the embodiment of Figure 4 differs from that of Figure 2 in that the single light output section 18 now comprises an aperture 18 (formed in the light reflecting structure 16). As with the embodiment of Figure 2, the light output section 18 (i.e. aperture 18) of the embodiment of Figure 4 is situated above the LEDs 12 such that it partially overlaps each LED 12. Further, the shape and size of the light output section 18 of Figure 4 is very similar to that of Figure 2. Thus, the area of the light output section 18 is less than the total area of the LEDs it overlaps, thereby employing the concept of having a light output section 18 which is smaller than the LEDs 12 it is adapted to output light from.
Also, there is provided a layer 22 of optical enhancement material below the light output section 18 and overlapping all of the LEDs 12. Here, the light output optical enhancement material comprises a lumiramic or phosphorescent material which is adapted to convert the color of light emitted by the LEDs.
The light reflecting structure 16 covers the side surfaces of the layer 22 of optical enhancement material as well as a portion of the upper surface of the layer 22 of optical enhancement material. In other words, the light reflecting structure 16 covers the LEDs 12 and layer 22 of optical enhancement material such that only the top/upper surface of layer 22 of optical enhancement material is exposed (i.e. uncovered) by the light output section 18.
Hence, it will be appreciated the Figure 4 illustrates an embodiment wherein the light output section 18 comprises an aperture or cavity. The layer 22 of optical enhancement material is provided in this embodiment to alter the color of light emitted by the LEDs 12. However, it will be appreciated that the embodiment of Figure 4 may be modified to not include the layer 22 of optical enhancement material (if alteration of the color of light from the LEDs is not required, for example).
Alternatively, the embodiment of Figure 4 may be modified by replacing the aperture 18 of Figure 4 with optical enhancement material (such as lumiramic or
phosphorescent material, for example). Such a modification to the embodiment of Figure 4 is depicted in Figure 5, wherein the light output section comprises first 24A and second 24B portions of phosphorescent material. The first 24A and second 24B portions of
phosphorescent material may provide for the alteration of output light to different colors, for example.
It is noted that, in practice, the light reflecting structure 16 may not be entirely reflecting. In other words, the light reflecting structure may not have substantially 100% reflectivity, and so some light may leak through it. This increases the size of the light outputting area and hence reduces luminance. This may introduce color over position effects (e.g. a blue halo around white light in the center). To address this, embodiments may be made "light leak tight" by blocking the light with an opaque/reflective coating. Such a modification to the embodiment of Figure 2 is depicted in Figure 6, wherein a reflective coating 30 is provided on the upper surface of the light reflecting structure 16. This helps to lower the overall light transmittance of the light reflecting structure 16 by reflecting light that is incident on the lower surface of the reflective coating 30 from below (e.g. light leaking through the light reflecting structure 16).
Other variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing the claimed invention, from a study of the drawings, the disclosure, and the appended claims. In the claims, the word "comprising" does not exclude other elements or steps, and the indefinite article "a" or "an" does not exclude a plurality. A single processor or other unit may fulfill the functions of several items recited in the claims. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measured cannot be used to advantage. A computer program may be stored/distributed on a suitable medium, such as an optical storage medium or a solid-state medium supplied together with or as part of other hardware, but may also be distributed in other forms, such as via the Internet or other wired or wireless telecommunication systems. Any reference signs in the claims should not be construed as limiting the scope.

Claims

1. A light source comprising:
first and second semiconductor diode structures adapted to generate light, the first and second semiconductor diode structures being laterally adjacent to each other;
a light output section at least partially overlapping both of the first and second semiconductor diode structures and adapted to output light from the first and second semiconductor diode structures; and
a light reflecting structure at least partially enclosing side surfaces of the first and second semiconductor diode structures and the light output section and adapted to reflect light from the semiconductor diode structures towards the light output section,
wherein the area of the light output section is less than the combined area of the first and second semiconductor diode structures,
and wherein there is a lateral separation between the adjacent edges of the first and second semiconductor diode structures, the lateral separation being less than 10% of the lateral width of the first and second semiconductor diode structures.
2. The light source of claim 1, wherein the light output section comprises an aperture formed in the light reflecting structure.
3. The light source of claim 2, further comprising a layer of optical enhancement material below the light output section and at least partially overlapping both of the first and second semiconductor diode structures, and wherein the light reflecting structure at least partially encloses side surfaces of the layer of optical enhancement material.
4. The light source of any preceding claim, wherein the light output section comprises an optical enhancement material.
5. The light source of any preceding claim, wherein at least one of the first and second semiconductor diode structures comprises a pre- structured sapphire LED.
6. The light source of any preceding claim, further comprising a reflective coating at least partially overlapping the light reflecting structure.
7. An automotive light comprising a light source according to any preceding claim.
8. A projector light comprising a light source according to any of claims 1 to 6.
A method of manufacturing a light source comprising:
arranging first and second semiconductor diode structures adapted to generate light to be laterally adjacent to each other;
providing a light output section at least partially overlapping both of the first and second semiconductor diode structures, the light output section being adapted to output light from the first and second semiconductor diode structures; and
at least partially enclosing sides surfaces of the first and second semiconductor diode structures and the light output section with a light reflecting structure, the light reflecting structure being adapted to reflect light from the semiconductor diode structures towards the light output section,
wherein the area of the light output section is less than the combined area of the first and second semiconductor diode structures,
and wherein the step of arranging comprises arranging the first and second semiconductor diode structures such that there is a lateral separation between the adjacent edges of the first and second semiconductor diode structures, the lateral separation being less than 10% of the lateral width of the first and second semiconductor diode structures.
10. The method of claim 9, wherein the light output section comprises an aperture formed in the light reflecting structure.
11. The method of claim 10, further comprising forming a layer of optical enhancement material below the light output section and at least partially overlapping both of the first and second semiconductor diode structures,
and wherein the step of at least partially enclosing sides surfaces of the first and second semiconductor diode structures and the light output section with a light reflecting structure light reflecting structure further comprise at least partially enclosing side surfaces of the layer of optical enhancement material with the light reflecting structure light reflecting structure.
12. The method of any of claims 9 to 11, wherein the light output section comprises an optical enhancement material.
EP15738688.9A 2014-07-18 2015-07-18 Light emitting diodes and reflector Active EP3170203B1 (en)

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PCT/EP2015/066503 WO2016009088A1 (en) 2014-07-18 2015-07-18 Light emitting diodes and reflector

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WO2016009088A1 (en) 2016-01-21

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