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EP2969911A4 - Mems acoustic transducer with silicon nitride backplate and silicon sacrificial layer - Google Patents

Mems acoustic transducer with silicon nitride backplate and silicon sacrificial layer

Info

Publication number
EP2969911A4
EP2969911A4 EP14775941.9A EP14775941A EP2969911A4 EP 2969911 A4 EP2969911 A4 EP 2969911A4 EP 14775941 A EP14775941 A EP 14775941A EP 2969911 A4 EP2969911 A4 EP 2969911A4
Authority
EP
European Patent Office
Prior art keywords
silicon
backplate
sacrificial layer
acoustic transducer
mems acoustic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP14775941.9A
Other languages
German (de)
French (fr)
Other versions
EP2969911A1 (en
Inventor
Ando Feyh
Andrew Graham
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP2969911A1 publication Critical patent/EP2969911A1/en
Publication of EP2969911A4 publication Critical patent/EP2969911A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/00246—Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on the same substrate
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0128—Processes for removing material
    • B81C2201/013—Etching
    • B81C2201/0135—Controlling etch progression
    • B81C2201/014—Controlling etch progression by depositing an etch stop layer, e.g. silicon nitride, silicon oxide, metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/07—Integrating an electronic processing unit with a micromechanical structure
    • B81C2203/0707—Monolithic integration, i.e. the electronic processing unit is formed on or in the same substrate as the micromechanical structure
    • B81C2203/0714—Forming the micromechanical structure with a CMOS process

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Pressure Sensors (AREA)
EP14775941.9A 2013-03-14 2014-03-12 Mems acoustic transducer with silicon nitride backplate and silicon sacrificial layer Withdrawn EP2969911A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361781940P 2013-03-14 2013-03-14
PCT/US2014/024147 WO2014159552A1 (en) 2013-03-14 2014-03-12 Mems acoustic transducer with silicon nitride backplate and silicon sacrificial layer

Publications (2)

Publication Number Publication Date
EP2969911A1 EP2969911A1 (en) 2016-01-20
EP2969911A4 true EP2969911A4 (en) 2016-11-02

Family

ID=51625196

Family Applications (1)

Application Number Title Priority Date Filing Date
EP14775941.9A Withdrawn EP2969911A4 (en) 2013-03-14 2014-03-12 Mems acoustic transducer with silicon nitride backplate and silicon sacrificial layer

Country Status (3)

Country Link
EP (1) EP2969911A4 (en)
CN (1) CN105531220A (en)
WO (1) WO2014159552A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10104478B2 (en) * 2015-11-13 2018-10-16 Infineon Technologies Ag System and method for a perpendicular electrode transducer
CN105392093B (en) * 2015-12-03 2018-09-11 瑞声声学科技(深圳)有限公司 The manufacturing method of microphone chip
CN108100990B (en) * 2017-12-21 2019-07-12 中国电子科技集团公司第五十四研究所 A kind of preparation method of sandwich-type photoresist sacrificial layer
CN109956447A (en) * 2017-12-25 2019-07-02 中芯国际集成电路制造(上海)有限公司 A kind of MEMS device and preparation method, electronic device
CN108650605B (en) * 2018-05-22 2024-03-19 上饶市经纬自动化科技有限公司 Acoustic sensor with energy collection function and manufacturing method thereof
CN110316692B (en) * 2019-05-23 2022-05-31 王传蔚 CMOS micro-electromechanical microphone and manufacturing method thereof
US10981780B2 (en) 2019-08-19 2021-04-20 Infineon Technologies Ag Membrane support for dual backplate transducers
US12269734B2 (en) 2020-05-05 2025-04-08 Tdk Corporation Microelectromechanical microphone with membrane trench reinforcements and method of fabrication
US11746001B2 (en) 2020-05-05 2023-09-05 Tdk Electronics Ag Microelectromechanical microphone with membrane trench reinforcements and method of fabrication
CN114257949B (en) * 2020-09-25 2023-11-03 地球山(苏州)微电子科技有限公司 Loudspeaker manufacturing method and loudspeaker
CN112601168B (en) * 2020-12-22 2022-08-26 杭州士兰集昕微电子有限公司 Preparation method of MEMS microphone and release method of sacrificial layer of MEMS device
US12170869B2 (en) 2022-09-13 2024-12-17 Invensense, Inc. Fixed-fixed membrane for microelectromechanical system microphone
CN115656548B (en) * 2022-11-09 2023-07-21 湖南大学 MEMS airflow sensor
US20240171917A1 (en) * 2022-11-23 2024-05-23 Invensense, Inc. Electrodes for microelectromechanical system microphones
CN116425110B (en) * 2023-06-12 2023-09-19 之江实验室 Wafer-level manufacturing method of high-temperature photoelectric pressure sensing chip with differential structure

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4558184A (en) * 1983-02-24 1985-12-10 At&T Bell Laboratories Integrated capacitive transducer
US5573679A (en) * 1995-06-19 1996-11-12 Alberta Microelectronic Centre Fabrication of a surface micromachined capacitive microphone using a dry-etch process

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1787694A (en) * 2004-12-10 2006-06-14 美律实业股份有限公司 Manufacturing method of silicon crystal micro-microphone
DE102005016243B3 (en) * 2005-04-08 2006-09-28 Austriamicrosystems Ag Micromechanical component e.g. micro electro mechanical system structure, for use as e.g. micro sensor, has one metal layer of multi-layer structure extending at side over pile and electrically conductive membrane integrated in structure
CN1859815B (en) * 2005-04-30 2011-11-09 中国科学院声学研究所 Polycrystal silicon vibration film silicon micro capacitor microphone chip and its preparing method
GB2443756B (en) * 2006-02-24 2010-03-17 Wolfson Microelectronics Plc MEMS device
GB0605576D0 (en) * 2006-03-20 2006-04-26 Oligon Ltd MEMS device
EP2244490A1 (en) * 2009-04-20 2010-10-27 Nxp B.V. Silicon condenser microphone with corrugated backplate and membrane
US8093119B2 (en) * 2009-06-24 2012-01-10 Solid State System Co., Ltd. CMOS microelectromechanical system (MEMS) device and fabrication method thereof
US8847289B2 (en) * 2010-07-28 2014-09-30 Goertek Inc. CMOS compatible MEMS microphone and method for manufacturing the same
US9148712B2 (en) * 2010-12-10 2015-09-29 Infineon Technologies Ag Micromechanical digital loudspeaker
CN102225739A (en) * 2011-04-15 2011-10-26 中国科学院上海微系统与信息技术研究所 A fabrication method of tunable FP optical filter based on MEMS technology

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4558184A (en) * 1983-02-24 1985-12-10 At&T Bell Laboratories Integrated capacitive transducer
US5573679A (en) * 1995-06-19 1996-11-12 Alberta Microelectronic Centre Fabrication of a surface micromachined capacitive microphone using a dry-etch process

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2014159552A1 *

Also Published As

Publication number Publication date
CN105531220A (en) 2016-04-27
WO2014159552A1 (en) 2014-10-02
EP2969911A1 (en) 2016-01-20

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