EP1982002A1 - Process for producing partially metallized substrates - Google Patents
Process for producing partially metallized substratesInfo
- Publication number
- EP1982002A1 EP1982002A1 EP07722786A EP07722786A EP1982002A1 EP 1982002 A1 EP1982002 A1 EP 1982002A1 EP 07722786 A EP07722786 A EP 07722786A EP 07722786 A EP07722786 A EP 07722786A EP 1982002 A1 EP1982002 A1 EP 1982002A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- carrier substrate
- substrate
- metallic layer
- lacquer
- antennas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 60
- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000000576 coating method Methods 0.000 claims abstract description 18
- 239000011248 coating agent Substances 0.000 claims abstract description 17
- 239000000853 adhesive Substances 0.000 claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims abstract description 10
- 239000002184 metal Substances 0.000 claims abstract description 10
- 238000007639 printing Methods 0.000 claims abstract description 8
- 230000001070 adhesive effect Effects 0.000 claims abstract description 7
- 239000004922 lacquer Substances 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000004698 Polyethylene Substances 0.000 claims description 6
- 239000004743 Polypropylene Substances 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 4
- 229920002313 fluoropolymer Polymers 0.000 claims description 4
- 239000004811 fluoropolymer Substances 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- -1 polyethylene Polymers 0.000 claims description 4
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 3
- 239000000969 carrier Substances 0.000 claims description 3
- 229920002457 flexible plastic Polymers 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 2
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 2
- 239000004952 Polyamide Substances 0.000 claims description 2
- 229920002472 Starch Polymers 0.000 claims description 2
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 2
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- 150000002739 metals Chemical class 0.000 claims description 2
- 239000003921 oil Substances 0.000 claims description 2
- 239000005026 oriented polypropylene Substances 0.000 claims description 2
- 239000002985 plastic film Substances 0.000 claims description 2
- 229920001643 poly(ether ketone) Polymers 0.000 claims description 2
- 229920002647 polyamide Polymers 0.000 claims description 2
- 229920006260 polyaryletherketone Polymers 0.000 claims description 2
- 229920002530 polyetherether ketone Polymers 0.000 claims description 2
- 229920000573 polyethylene Polymers 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical class [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 2
- 235000019698 starch Nutrition 0.000 claims description 2
- 239000008107 starch Substances 0.000 claims description 2
- 150000003568 thioethers Chemical class 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 2
- REEBJQTUIJTGAL-UHFFFAOYSA-N 3-pyridin-1-ium-1-ylpropane-1-sulfonate Chemical compound [O-]S(=O)(=O)CCC[N+]1=CC=CC=C1 REEBJQTUIJTGAL-UHFFFAOYSA-N 0.000 claims 1
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 claims 1
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 claims 1
- 239000004810 polytetrafluoroethylene Substances 0.000 claims 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims 1
- JCBJVAJGLKENNC-UHFFFAOYSA-M potassium ethyl xanthate Chemical compound [K+].CCOC([S-])=S JCBJVAJGLKENNC-UHFFFAOYSA-M 0.000 claims 1
- 238000003475 lamination Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 18
- 239000010408 film Substances 0.000 description 10
- 239000000835 fiber Substances 0.000 description 8
- 239000004745 nonwoven fabric Substances 0.000 description 8
- 239000011888 foil Substances 0.000 description 7
- 239000003973 paint Substances 0.000 description 6
- 239000004033 plastic Substances 0.000 description 6
- 229920003023 plastic Polymers 0.000 description 6
- 239000002131 composite material Substances 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000005406 washing Methods 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229920000297 Rayon Polymers 0.000 description 2
- 238000003490 calendering Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000002736 metal compounds Chemical class 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 229910017518 Cu Zn Inorganic materials 0.000 description 1
- 229910017752 Cu-Zn Inorganic materials 0.000 description 1
- 229910017767 Cu—Al Inorganic materials 0.000 description 1
- 229910017943 Cu—Zn Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000011104 metalized film Substances 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44D—PAINTING OR ARTISTIC DRAWING, NOT OTHERWISE PROVIDED FOR; PRESERVING PAINTINGS; SURFACE TREATMENT TO OBTAIN SPECIAL ARTISTIC SURFACE EFFECTS OR FINISHES
- B44D3/00—Accessories or implements for use in connection with painting or artistic drawing, not otherwise provided for; Methods or devices for colour determination, selection, or synthesis, e.g. use of colour tables
- B44D3/18—Boards or sheets with surfaces prepared for painting or drawing pictures; Stretching frames for canvases
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H21/00—Non-fibrous material added to the pulp, characterised by its function, form or properties; Paper-impregnating or coating material, characterised by its function, form or properties
- D21H21/14—Non-fibrous material added to the pulp, characterised by its function, form or properties; Paper-impregnating or coating material, characterised by its function, form or properties characterised by function or properties in or on the paper
- D21H21/40—Agents facilitating proof of genuineness or preventing fraudulent alteration, e.g. for security paper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
- H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
Definitions
- the invention relates to a process for the preparation of partially metallized
- Partially metallized carrier substrates are used, for example, in US Pat
- Security elements in different formats stripes, threads, patches etc.
- value documents for example banknotes
- ID cards and the like to be used in or on packaging and the like.
- Security films for securities are known from WO 99/13157 A1, in which on a translucent film, a metallic coating is applied, which is not the entire surface in the finished film, but has recesses that should be clearly visible in transmitted light.
- the production of these films takes place in that a carrier film is printed with a highly pigmented printing ink, wherein the inking is not the entire surface, the ink is dried to form a porous paint, then a metallic cover layer is applied and in a further step, the highly pigmented ink by washing is removed with a solvent, optionally also under mechanical action.
- the metallic cover layer mitentfernt, whereby the recognizable in transmitted light recesses are formed.
- the metallic cover layer has a thickness of 0.01 to 1 ⁇ m.
- WO 02/31214 A1 discloses a partially metallized film and a method for the production thereof, wherein a structure is printed on a substrate or a carrier film either with a soluble color, and / or the Basic materials are cleaned directly in a vacuum by means of a plasma treatment and simultaneously germinated with target atoms, followed by vapor deposition of a metal and then the structured layer is produced by washing out of the soluble paint or by etching.
- the object of the invention was to provide a method for producing a partially metallized carrier substrate, the high
- the invention therefore provides a process for producing a partially metallized carrier substrate, characterized by the following process steps: a) providing a first carrier substrate b) partial printing or coating of the carrier substrate with a lacquer which adheres only weakly to the carrier substrate c) applying a full-surface metallic layer d Laminating against an adhesive-coated second carrier substrate and e) detaching this second adhesive-coated carrier substrate, whereby the weakly adhering lacquer with the overlying metallic layer is detached from the first carrier substrate, leaving a structured metallic layer on the first carrier substrate.
- Carrier foils are for example carrier foils, preferably flexible plastic foils, for example of PI, PP, OPP, PE, PPS, PEEK, PEK, PEI, PSU, PAEK, LCP, PEN, PBT, PET, PA, PC, COC, POM, ABS, PVC fluoropolymers such as Teflon and the like in question.
- the carrier films preferably have a thickness of 5 to 700 ⁇ m, preferably 5 to 200 ⁇ m, particularly preferably 36 to 75 ⁇ m.
- metal foils for example Al, Cu, Sn, Ni, Fe or stainless steel foils having a thickness of 5-200 ⁇ m, preferably 10 to 80 ⁇ m, particularly preferably 10 to 40 ⁇ m, may serve as the carrier substrate.
- the films can also be surface-treated, coated or laminated, for example, with plastics or painted.
- paper or composites with paper for example composites with plastics having a weight per unit area of 20 to 500 g / m 2 , preferably 40 to 200 g / m 2 , may also be used as the carrier substrates.
- nonwovens such as continuous fiber webs, staple fiber webs and the like, which may optionally be needled or calendered, can be used as carrier substrates.
- nonwovens consist of plastics, such as PP, PET, PA, PPS and the like, but it is also possible to use nonwovens of natural, optionally treated fibers, such as viscose fiber webs.
- the nonwovens used have a basis weight of about 20 g / m 2 to 500 g / m 2 .
- a weakly adhering lacquer or a weakly adhering coating is applied partially to this first carrier substrate.
- the paint can be applied in the form of lines, patterns, tracks, symbols, signs and the like.
- the paint is applied in those areas in which metal-free areas are to be present in the finished product.
- the structure present on the second carrier substrate after peeling may constitute the finished product.
- the application of the weakly adhering to the carrier substrate paint can be done by any method, for example by gravure, flexographic, screen printing, digital printing and the like.
- poorly adhering coating layers are paints or coatings based on methacrylate, based on polyamide, polyethylene, fluoropolymer wax, silicone, starch or thin oil layers.
- This layer consists of a metal, a metal compound, or an alloy.
- the metal layer layers of Al, Cu, Fe, Ag, Au, Cr, Ni, Zn and the like are suitable.
- suitable metal compounds are oxides or sulfides of metals, in particular TiO 2 , Cr oxides, ZnS, ITO, ATO, FTO, ZnO, Al 2 O 3 or silicon oxides.
- Suitable alloys are, for example, Cu-Al alloys, Cu-Zn alloys and the like.
- the metallic layer consists of copper, aluminum, silver or gold.
- This metallic layer can be applied by known methods such as sputtering, sputtering, printing (gravure, flexo, screen, digital printing and the like), spraying, electroplating and the like.
- the thickness of the functional layer is 0.001 to 50 ⁇ m, preferably 0.1 to 20 ⁇ m.
- the weakly adhering lacquer or the weakly adhering coating can be applied individually by means of a digital printing process.
- the weakly adhering lacquer or the weakly adhering coating is optionally applied in addition to the functional structures described above in such a way that it encloses the contour of the desired individualized code.
- the carrier substrate is preferably provided with a self-adhesive coating.
- a flexible plastic film is preferably suitable as the carrier substrate, for example made of PP, OPP, PE, PEI, PEN, PBT, PET, PA, PC, COC, POM, ABS, PVC and the like.
- metal foils for example Al, Cu, Sn, Ni, Fe or stainless steel foils having a thickness of 5-200 ⁇ m, preferably 10 to 80 ⁇ m, particularly preferably 10 to 40 ⁇ m, may serve as the carrier substrate.
- the films can also be surface-treated, coated or laminated, for example, with plastics or painted.
- paper or composites with paper for example composites with plastics having a weight per unit area of 20 to 500 g / m 2 , preferably 40 to 200 g / m 2 , may also be used as the carrier substrates.
- nonwovens such as continuous fiber webs, staple fiber webs and the like, which may optionally be needled or calendered, can be used as carrier substrates.
- nonwovens consist of plastics such as PP 1 PET, PA, PPS and the like, but it can also be nonwovens made of natural, optionally treated fibers, such as Viscose fiber webs are used.
- the nonwovens used have a basis weight of about 20 g / m 2 to 500 g / m 2 .
- composites with fleeces and the like can also be used.
- this carrier substrate is peeled off from the carrier substrate provided with the metallic coating.
- the poorly adhering lacquer with the overlying metallic coating is detached from the first carrier substrate; metallic functional structures remain on the carrier substrate.
- the metallic structures forming the individualized code remain on the carrier substrate
- the partially metallized carrier substrate produced by the method according to the invention can be used for electronic components, for example for printed conductors, antennas, RF antennas, conductive contacts, pads for printed electronics or contact pins for ICs optionally with an individualized code and the like.
- the carrier substrate produced by the method according to the invention can be used as a security element in or on data carriers, such as entrance tickets, profit coupons, container sections with profit segments and the like, on or in documents of value, such as banknotes, ID cards, in or on packaging.
- data carriers such as entrance tickets, profit coupons, container sections with profit segments and the like
- documents of value such as banknotes, ID cards, in or on packaging.
- Lacquer based on methacrylate Lacquer based on methacrylate.
- Self-adhesive coating provided PET film laminated and then separated again.
- the lacquer layer dissolves with the overlying
- the metallic structure becomes visible on the first carrier substrate.
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Verfahren zur Herstellung von partiell metallisierten TrägersubstratenProcess for the preparation of partially metallised carrier substrates
Die Erfindung betrifft ein Verfahren zur Herstellung von partiell metallisiertenThe invention relates to a process for the preparation of partially metallized
Trägersubstraten.Carrier substrates.
Partiell metallisierte Trägersubstrate werden beispielsweise in derPartially metallized carrier substrates are used, for example, in US Pat
Elektronikindustrie als Leiterbahnen, Antennen, RF-Antennen, leitfähigeElectronics industry as interconnects, antennas, RF antennas, conductive
Kontakte, Anschlussflächen für gedruckte Elektronik oder Kontakt-Pins für ICs verwendet.Contacts, pads used for printed electronics or contact pins for ICs.
Ferner ist es bekannt metallisierte bzw. partiell metallisierte Trägersubstrate alsFurthermore, it is known metallized or partially metallized carrier substrates as
Sicherheitselemente in unterschiedlichen Formaten (Streifen, Fäden, Patches etc) in oder auf Datenträgern, Wertdokumenten, beispielsweise Banknoten,Security elements in different formats (stripes, threads, patches etc.) in or on data carriers, value documents, for example banknotes,
Ausweisen und dergleichen, in oder auf Verpackungen und dergleichen zu verwenden.ID cards and the like, to be used in or on packaging and the like.
Aus der WO 99/13157 A1 sind Sicherheitsfolien für Wertpapiere bekannt, bei denen auf einer transluzenten Folie eine metallische Beschichtung aufgebracht wird, die in der fertigen Folie nicht vollflächig ist, sondern Aussparungen aufweist, die im Durchlicht klar erkennbar sein sollen. Die Herstellung dieser Folien erfolgt dadurch, dass eine Trägerfolie mit einer hochpigmentierten Druckfarbe bedruckt wird, wobei der Farbauftrag nicht vollflächig erfolgt, die Druckfarbe unter Bildung eines porigen Farbauftrags getrocknet wird, anschließend eine metallische Deckschicht aufgebracht wird und in einem weiteren Schritt die hochpigmentierte Druckfarbe durch Auswaschen mit einem Lösungsmittel, gegebenenfalls auch unter mechanischer Einwirkung entfernt wird. Damit wird auch in jenen Bereichen, in denen die Druckfarbe entfernt wird, die metallische Abdeckschicht mitentfernt, wodurch die im Durchlicht erkennbaren Aussparungen gebildet werden. Die metallische Abdeckschicht weist eine Dicke von 0,01 bis 1 μm auf.Security films for securities are known from WO 99/13157 A1, in which on a translucent film, a metallic coating is applied, which is not the entire surface in the finished film, but has recesses that should be clearly visible in transmitted light. The production of these films takes place in that a carrier film is printed with a highly pigmented printing ink, wherein the inking is not the entire surface, the ink is dried to form a porous paint, then a metallic cover layer is applied and in a further step, the highly pigmented ink by washing is removed with a solvent, optionally also under mechanical action. Thus, even in those areas in which the ink is removed, the metallic cover layer mitentfernt, whereby the recognizable in transmitted light recesses are formed. The metallic cover layer has a thickness of 0.01 to 1 μm.
Aus der WO 02/31214 A1 ist eine partiell metallisierte Folie und ein Verfahren zu deren Herstellung bekannt wobei auf ein Substrat oder eine Trägerfolie entweder mit einer löslichen Farbe eine Struktur gedruckt wird, und/oder die Grundmaterialien direkt im Vakuum mittels einer Plasmabehandlung gereinigt und gleichzeitig mit Targetatomen bekeimt werden, worauf ein Metall aufgedampft und anschließend die strukturierte Schicht durch Auswaschen der löslichen Farbe oder durch Ätzen erzeugt wird.WO 02/31214 A1 discloses a partially metallized film and a method for the production thereof, wherein a structure is printed on a substrate or a carrier film either with a soluble color, and / or the Basic materials are cleaned directly in a vacuum by means of a plasma treatment and simultaneously germinated with target atoms, followed by vapor deposition of a metal and then the structured layer is produced by washing out of the soluble paint or by etching.
Insbesondere bei Verwendung eines Waschverfahrens zur Entfernung der partiell aufgebrachten löslichen Waschfarbe mit der darüber abgeschiedenen Metallschicht, ist meist eine mechanische Unterstützung des Waschvorgangs nötig. Dadurch wird allerdings auch oft die auf dem Substrat verbleibende Metallschicht zerkratzt.In particular, when using a washing process to remove the partially applied soluble wash with the deposited over the metal layer, usually a mechanical support of the washing process is necessary. However, this often also scratched the metal layer remaining on the substrate.
Ferner sind beide Verfahren relativ aufwändig, beinhalten zahlreiche Verfahrensschritte. Daher können im Allgemeinen keine hohen Produktionsgeschwindigkeiten erreicht werden.Furthermore, both methods are relatively complex, involve numerous process steps. Therefore, generally high production speeds can not be achieved.
Aufgabe der Erfindung war es, ein Verfahren zur Herstellung eines partiell metallisierten Trägersubstrats bereitzustellen, das hoheThe object of the invention was to provide a method for producing a partially metallized carrier substrate, the high
Produktionsgeschwindigkeiten bei gleichzeitig ausreichender Präzision und in hoher Qualität erlaubt.Production speeds with sufficient precision and high quality allowed.
Gegenstand der Erfindung ist daher ein Verfahren zur Herstellung eines partiell metallisierten Trägersubstrats, gekennzeichnet durch folgende Verfahrensschritte: a) Bereitstellen eines ersten Trägersubstrats b) partielles Bedrucken oder Beschichten des Trägersubstrats mit einem auf dem Trägersubstrat nur schwach haftenden Lack c) Aufbringen einer vollflächigen metallischen Schicht d) Kaschieren gegen ein klebebeschichtetes zweites Trägersubstrat und e) Ablösen dieses zweiten klebebeschichteten Trägersubstrats, wodurch der schwach haftende Lack mit der darüberliegenden metallischen Schicht vom ersten Trägersubstrat abgelöst wird und so eine strukturierte metallische Schicht auf dem ersten Trägersubstrat zurückbleibt. Als Trägersubstrat kommen beispielsweise Trägerfolien, vorzugsweise flexible Kunststofffolien, beispielsweise aus PI, PP, OPP, PE, PPS, PEEK, PEK, PEI, PSU, PAEK, LCP, PEN, PBT, PET, PA, PC, COC, POM, ABS, PVC Fluorpolymere wie Teflon und dergleichen in Frage. Die Trägerfolien weisen vorzugsweise eine Dicke von 5 - 700 μm, bevorzugt 5 - 200 μm, besonders bevorzugt 36 - 75 μm auf.The invention therefore provides a process for producing a partially metallized carrier substrate, characterized by the following process steps: a) providing a first carrier substrate b) partial printing or coating of the carrier substrate with a lacquer which adheres only weakly to the carrier substrate c) applying a full-surface metallic layer d Laminating against an adhesive-coated second carrier substrate and e) detaching this second adhesive-coated carrier substrate, whereby the weakly adhering lacquer with the overlying metallic layer is detached from the first carrier substrate, leaving a structured metallic layer on the first carrier substrate. Carrier foils are for example carrier foils, preferably flexible plastic foils, for example of PI, PP, OPP, PE, PPS, PEEK, PEK, PEI, PSU, PAEK, LCP, PEN, PBT, PET, PA, PC, COC, POM, ABS, PVC fluoropolymers such as Teflon and the like in question. The carrier films preferably have a thickness of 5 to 700 μm, preferably 5 to 200 μm, particularly preferably 36 to 75 μm.
Ferner können als Trägersubstrat auch Metallfolien, beispielsweise AI-, Cu-, Sn-, Ni-, Fe- oder Edelstahlfolien mit einer Dicke von 5 - 200 μm, vorzugsweise 10 bis 80 μm, besonders bevorzugt 10 - 40 μm dienen. Die Folien können auch oberflächenbehandelt, beschichtet oder kaschiert beispielsweise mit Kunststoffen oder lackiert sein.Furthermore, metal foils, for example Al, Cu, Sn, Ni, Fe or stainless steel foils having a thickness of 5-200 μm, preferably 10 to 80 μm, particularly preferably 10 to 40 μm, may serve as the carrier substrate. The films can also be surface-treated, coated or laminated, for example, with plastics or painted.
Ferner können als Trägersubstrate auch Papier oder Verbünde mit Papier, beispielsweise Verbünde mit Kunststoffen mit einem Flächengewicht von 20 - 500 g/m2, vorzugsweise 40 - 200 g/m2 verwendet werden.Furthermore, paper or composites with paper, for example composites with plastics having a weight per unit area of 20 to 500 g / m 2 , preferably 40 to 200 g / m 2 , may also be used as the carrier substrates.
Ferner können als Trägersubstrate Vliese, wie Endlosfaservliese, Stapelfaservliese und dergleichen, die gegebenenfalls vernadelt oder kalandriert sein können, verwendet werden. Vorzugsweise bestehen solche Vliese aus Kunststoffen, wie PP, PET, PA, PPS und dergleichen, es können aber auch Vliese aus natürlichen, gegebenenfalls behandelten Fasern, wie Viskosefaservliese eingesetzt werden. Die eingesetzten Vliese weisen ein Flächengewicht von etwa 20 g/m2 bis 500 g/m2 auf.Furthermore, nonwovens, such as continuous fiber webs, staple fiber webs and the like, which may optionally be needled or calendered, can be used as carrier substrates. Preferably such nonwovens consist of plastics, such as PP, PET, PA, PPS and the like, but it is also possible to use nonwovens of natural, optionally treated fibers, such as viscose fiber webs. The nonwovens used have a basis weight of about 20 g / m 2 to 500 g / m 2 .
Anschließend wird ein schwach haftender Lack oder eine schwach haftende Beschichtung partiell auf dieses erste Trägersubstrat aufgebracht. Der Lack kann dabei in Form von Linien, Mustern, Bahnen, Symbolen, Zeichen und dergleichen aufgebracht werden.Subsequently, a weakly adhering lacquer or a weakly adhering coating is applied partially to this first carrier substrate. The paint can be applied in the form of lines, patterns, tracks, symbols, signs and the like.
Dabei wird der Lack in jenen Bereichen aufgebracht, in denen im fertigen Produkt metallfreie Bereiche vorliegen sollen. In einer besonderen Ausführungsform kann die auf dem zweiten Trägersubstrat nach dem Abziehen vorhandene Struktur das fertige Produkt darstellen. Dadurch können auch beispielsweise Leiterbahnen auf Materialien wie Polypropylen hergestellt werden, die bei Direktbedampfung zu wenig temperaturstabil sind.The paint is applied in those areas in which metal-free areas are to be present in the finished product. In a particular embodiment, the structure present on the second carrier substrate after peeling may constitute the finished product. As a result, it is also possible, for example, to produce printed conductors on materials such as polypropylene, which are not sufficiently thermally stable in the case of direct vapor deposition.
Die Aufbringung des auf dem Trägersubstrat schwach haftenden Lacks kann durch ein beliebiges Verfahren, beispielsweise durch Tiefdruck, Flexodruck, Siebdruck, Digitaldruck und dergleichen erfolgen.The application of the weakly adhering to the carrier substrate paint can be done by any method, for example by gravure, flexographic, screen printing, digital printing and the like.
Als schlecht haftende Lackschichten kommen insbesondere beispielsweise Lacke oder Beschichtungen auf Methacrylatbasis, auf Basis von Polyamid-, Polyethylen-, Fluorpolymerwachs, Silikon-, Stärke- oder dünne Ölschichten in Frage.Examples of poorly adhering coating layers are paints or coatings based on methacrylate, based on polyamide, polyethylene, fluoropolymer wax, silicone, starch or thin oil layers.
Anschließend wird die metallische Schicht aufgebracht. Diese Schicht besteht aus einem Metall, einer Metallverbindung, oder einer Legierung. Als Metallschicht sind Schichten aus AI, Cu, Fe, Ag, Au, Cr, Ni, Zn und dergleichen geeignet. Als Metallverbindungen sind beispielsweise Oxide oder Sulfide von Metallen, insbesondere TiO2, Cr-Oxide, ZnS, ITO, ATO, FTO, ZnO, AI2O3 oder Siliciumoxide geeignet. Geeignete Legierungen sind beispielsweise Cu-Al Legierungen, Cu-Zn Legierungen und dergleichen.Subsequently, the metallic layer is applied. This layer consists of a metal, a metal compound, or an alloy. As the metal layer, layers of Al, Cu, Fe, Ag, Au, Cr, Ni, Zn and the like are suitable. Examples of suitable metal compounds are oxides or sulfides of metals, in particular TiO 2 , Cr oxides, ZnS, ITO, ATO, FTO, ZnO, Al 2 O 3 or silicon oxides. Suitable alloys are, for example, Cu-Al alloys, Cu-Zn alloys and the like.
Vorzugsweise besteht die metallische Schicht aus Kupfer, Aluminium, Silber oder Gold.Preferably, the metallic layer consists of copper, aluminum, silver or gold.
Diese metallische Schicht kann durch bekannte Verfahren, beispielsweise durch Bedampfen, Sputtem, Drucken (Tief-, Flexo-, Sieb-, Digitaldruck und dergleichen), Sprühen, Galvanisieren und dergleichen aufgebracht werden. Die Dicke der funktionellen Schicht beträgt 0,001 bis 50 μm, vorzugsweise 0,1 bis 20 μm. Zur eindeutigen Identifikation einer bestimmten Produktionscharge oder eines einzelnen Bestandteils oder Abschnitts einer Produktionscharge des erfindungsgemäß hergestellten metallisierten Trägersubstrats kann in einer besonderen Ausführungsform der schwach haftende Lack oder die schwach haftende Beschichtung mittels eines Digitaldruckverfahrens individualisiert aufgebracht werden. Dabei wird der schwach haftende Lack bzw. die schwach haftende Beschichtung gegebenenfalls zusätzlich zu den im vorangehenden beschriebenen funktionellen Strukturen derart aufgebracht, dass er die Kontur des gewünschten individualisierten Codes umschließt.This metallic layer can be applied by known methods such as sputtering, sputtering, printing (gravure, flexo, screen, digital printing and the like), spraying, electroplating and the like. The thickness of the functional layer is 0.001 to 50 μm, preferably 0.1 to 20 μm. For unambiguous identification of a particular production batch or of a single component or section of a production batch of the metallized carrier substrate produced according to the invention, in a particular embodiment the weakly adhering lacquer or the weakly adhering coating can be applied individually by means of a digital printing process. In this case, the weakly adhering lacquer or the weakly adhering coating is optionally applied in addition to the functional structures described above in such a way that it encloses the contour of the desired individualized code.
Anschließend wird der so hergestellte Aufbau auf übliche Weise gegen ein mit einer Klebebeschichtung versehenes Trägersubstrat kaschiert. Vorzugsweise ist das Trägersubstrat mit einer Selbstklebebeschichtung versehen Als Trägersubstrat kommt vorzugsweise eine flexible Kunststofffolie in Frage, beispielsweise aus PP, OPP, PE, PEI, PEN, PBT, PET, PA, PC, COC, POM, ABS, PVC und dergleichen.Subsequently, the structure thus produced is laminated in the usual way against a provided with an adhesive coating carrier substrate. The carrier substrate is preferably provided with a self-adhesive coating. A flexible plastic film is preferably suitable as the carrier substrate, for example made of PP, OPP, PE, PEI, PEN, PBT, PET, PA, PC, COC, POM, ABS, PVC and the like.
Ferner können als Trägersubstrat auch Metallfolien, beispielsweise AI-, Cu-, Sn-, Ni-, Fe- oder Edelstahlfolien mit einer Dicke von 5 - 200 μm, vorzugsweise 10 bis 80 μm, besonders bevorzugt 10 - 40 μm dienen. Die Folien können auch oberflächenbehandelt, beschichtet oder kaschiert beispielsweise mit Kunststoffen oder lackiert sein.Furthermore, metal foils, for example Al, Cu, Sn, Ni, Fe or stainless steel foils having a thickness of 5-200 μm, preferably 10 to 80 μm, particularly preferably 10 to 40 μm, may serve as the carrier substrate. The films can also be surface-treated, coated or laminated, for example, with plastics or painted.
Ferner können als Trägersubstrate auch Papier oder Verbünde mit Papier, beispielsweise Verbünde mit Kunststoffen mit einem Flächengewicht von 20 - 500 g/m2, vorzugsweise 40 - 200 g/m2 verwendet werden.Furthermore, paper or composites with paper, for example composites with plastics having a weight per unit area of 20 to 500 g / m 2 , preferably 40 to 200 g / m 2 , may also be used as the carrier substrates.
Ferner können als Trägersubstrate Vliese, wie Endlosfaservliese, Stapelfaservliese und dergleichen, die gegebenenfalls vernadelt oder kalandriert sein können, verwendet werden. Vorzugsweise bestehen solche Vliese aus Kunststoffen, wie PP1 PET, PA, PPS und dergleichen, es können aber auch Vliese aus natürlichen, gegebenenfalls behandelten Fasern, wie Viskosefaservliese eingesetzt werden. Die eingesetzten Vliese weisen ein Flächengewicht von etwa 20 g/m2 bis 500 g/m2 auf. Ferner können auch Verbünde mit Vliesen und dergleichen eingesetzt werden.Furthermore, nonwovens, such as continuous fiber webs, staple fiber webs and the like, which may optionally be needled or calendered, can be used as carrier substrates. Preferably, such nonwovens consist of plastics such as PP 1 PET, PA, PPS and the like, but it can also be nonwovens made of natural, optionally treated fibers, such as Viscose fiber webs are used. The nonwovens used have a basis weight of about 20 g / m 2 to 500 g / m 2 . Furthermore, composites with fleeces and the like can also be used.
Anschließend wird dieses Trägersubstrat vom mit der metallischen Beschichtung versehenen Trägersubstrat abgezogen.Subsequently, this carrier substrate is peeled off from the carrier substrate provided with the metallic coating.
Dadurch löst sich der schlecht haftende Lack mit der darüberliegenden metallischen Beschichtung vom ersten Trägersubstrat, auf dem Trägersubstrat bleiben metallische funktionelle Strukturen zurück. Ebenso bleiben gegebenenfalls die metallischen Strukturen, die den individualisierten Code bilden auf dem Trägersubstrat zurückAs a result, the poorly adhering lacquer with the overlying metallic coating is detached from the first carrier substrate; metallic functional structures remain on the carrier substrate. Likewise, if appropriate, the metallic structures forming the individualized code remain on the carrier substrate
Das erfindungsgemäße Verfahren ist einfach und wirtschaftlich mit wenigen Verfahrensschritten durchführbar.The process according to the invention can be carried out simply and economically with a few process steps.
Da keine Wasch- oder Ätzlösung zur Herstellung der partiell metallisierten Strukturen verwendet wird, ist das Verfahren gegenüber den aus dem Stand der Technik bekannten Verfahren umweltschonender und kostengünstigerSince no washing or etching solution is used to prepare the partially metallised structures, the process is more environmentally friendly and less expensive than the processes known from the prior art
Das durch das erfindungsgemäße Verfahren hergestellte partiell metallisierte Trägersubstrat kann für elektronische Bauteile, beispielsweise für Leiterbahnen, Antennen, RF-Antennen, leitfähige Kontakte, Anschlussflächen für gedruckte Elektronik oder Kontakt-Pins für ICs gegebenenfalls mit einem individualisierten Code und dergleichen verwendet werden.The partially metallized carrier substrate produced by the method according to the invention can be used for electronic components, for example for printed conductors, antennas, RF antennas, conductive contacts, pads for printed electronics or contact pins for ICs optionally with an individualized code and the like.
Ferner kann das nach dem erfindungsgemäßen Verfahren hergestellte Trägersubstrat als Sicherheitselement in oder auf Datenträgern, wie Eintrittskarten, Gewinnkupons, Behälterabdeckungen mit Gewinnabschnitten und dergleichen, auf oder in Wertdokumenten, wie Banknoten, Ausweisen, in oder auf Verpackungen verwendet werden. Beispiel:Furthermore, the carrier substrate produced by the method according to the invention can be used as a security element in or on data carriers, such as entrance tickets, profit coupons, container sections with profit segments and the like, on or in documents of value, such as banknotes, ID cards, in or on packaging. Example:
Auf eine 50 μm dicke PEN Folie wird in einem Tiefdruckverfahren partiell einOn a 50 micron thick PEN film is partially in a gravure printing
Lack auf Methacrylatbasis aufgebracht.Lacquer based on methacrylate.
Anschließend wird eine vollflächige metallische Schicht aus Kupfer (0,5 μm) in einem PVD-Verfahren aufgebracht.Subsequently, a full-surface metallic layer of copper (0.5 microns) is applied in a PVD process.
Der so hergestellte Aufbau wird gegen eine mit einer konventionellenThe structure thus produced is compared with one with a conventional
Selbstklebebeschichtung versehene PET-Folie kaschiert und anschließend wieder getrennt.Self-adhesive coating provided PET film laminated and then separated again.
Durch den Trennvorgang löst sich die Lackschicht mit der darüberliegendenThrough the separation process, the lacquer layer dissolves with the overlying
Beschichtung, es wird die metallische Struktur auf dem ersten Trägersubstrat sichtbar. Coating, the metallic structure becomes visible on the first carrier substrate.
Claims
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP07722786A EP1982002A1 (en) | 2006-02-06 | 2007-02-05 | Process for producing partially metallized substrates |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP06002358A EP1818425A1 (en) | 2006-02-06 | 2006-02-06 | Method for making partially metallized substrates |
| EP07722786A EP1982002A1 (en) | 2006-02-06 | 2007-02-05 | Process for producing partially metallized substrates |
| PCT/EP2007/000941 WO2007090586A1 (en) | 2006-02-06 | 2007-02-05 | Process for producing partially metallized substrates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP1982002A1 true EP1982002A1 (en) | 2008-10-22 |
Family
ID=36615591
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP06002358A Withdrawn EP1818425A1 (en) | 2006-02-06 | 2006-02-06 | Method for making partially metallized substrates |
| EP07722786A Withdrawn EP1982002A1 (en) | 2006-02-06 | 2007-02-05 | Process for producing partially metallized substrates |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP06002358A Withdrawn EP1818425A1 (en) | 2006-02-06 | 2006-02-06 | Method for making partially metallized substrates |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20090139640A1 (en) |
| EP (2) | EP1818425A1 (en) |
| WO (1) | WO2007090586A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT507353B1 (en) | 2008-09-29 | 2012-04-15 | Hueck Folien Gmbh | METHOD OF STRUCTURING INORGANIC OR ORGANIC LAYERS |
| WO2010043422A1 (en) * | 2008-10-15 | 2010-04-22 | Jan Thiele | Planar data carrier |
| DE102012223779A1 (en) | 2012-12-19 | 2014-06-26 | BSH Bosch und Siemens Hausgeräte GmbH | Household appliance with capacitive control panel and method for its production |
| DE102015201427A1 (en) | 2015-01-28 | 2016-07-28 | BSH Hausgeräte GmbH | Touch-sensitive, illuminable control panel, method for its operation as well as this control panel containing domestic appliance |
| EP3211027B1 (en) * | 2016-02-26 | 2020-07-01 | Hueck Folien Gesellschaft m.b.H. | Transfer film with metallic layer and method for its production |
| US12342449B2 (en) * | 2021-09-28 | 2025-06-24 | The Board Of Trustees Of The University Of Illinois | Multilayered nonpolar, chromium, copper material coatings of power electronics boards for thermal management |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4720315A (en) * | 1984-02-03 | 1988-01-19 | Transfer Print Foils, Inc. | Method for preparing a selectively decorated resin film |
| US5186787A (en) * | 1988-05-03 | 1993-02-16 | Phillips Roger W | Pre-imaged high resolution hot stamp transfer foil, article and method |
| DE19739193B4 (en) | 1997-09-08 | 2006-08-03 | Giesecke & Devrient Gmbh | Method for producing security films for securities |
| DE10026714A1 (en) * | 2000-05-30 | 2001-12-13 | Hueck Folien Gmbh | Composite film, process for its production and its use |
| EP2034039B1 (en) | 2000-10-09 | 2012-06-20 | Hueck Folien Ges.m.b.H. | Metallic film and method of its manufacture and use |
| US6817527B2 (en) * | 2002-06-28 | 2004-11-16 | Nokia Corporation | Carriers for printed circuit board marking |
-
2006
- 2006-02-06 EP EP06002358A patent/EP1818425A1/en not_active Withdrawn
-
2007
- 2007-02-05 WO PCT/EP2007/000941 patent/WO2007090586A1/en not_active Ceased
- 2007-02-05 EP EP07722786A patent/EP1982002A1/en not_active Withdrawn
- 2007-02-05 US US12/086,171 patent/US20090139640A1/en not_active Abandoned
Non-Patent Citations (1)
| Title |
|---|
| See references of WO2007090586A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| US20090139640A1 (en) | 2009-06-04 |
| EP1818425A1 (en) | 2007-08-15 |
| WO2007090586A1 (en) | 2007-08-16 |
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