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EP1861337A1 - Coated substrate and process for the manufacture of a coated substrate - Google Patents

Coated substrate and process for the manufacture of a coated substrate

Info

Publication number
EP1861337A1
EP1861337A1 EP06705400A EP06705400A EP1861337A1 EP 1861337 A1 EP1861337 A1 EP 1861337A1 EP 06705400 A EP06705400 A EP 06705400A EP 06705400 A EP06705400 A EP 06705400A EP 1861337 A1 EP1861337 A1 EP 1861337A1
Authority
EP
European Patent Office
Prior art keywords
substrate
crystalline
amorphous
substance
nitride
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06705400A
Other languages
German (de)
French (fr)
Inventor
Franz-Josef Empa Haug
Jörg Empa PATSCHEIDER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eidgenoessische Materialpruefungs und Forschungsanstalt
Original Assignee
Eidgenoessische Materialpruefungs und Forschungsanstalt
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eidgenoessische Materialpruefungs und Forschungsanstalt filed Critical Eidgenoessische Materialpruefungs und Forschungsanstalt
Priority to EP06705400A priority Critical patent/EP1861337A1/en
Publication of EP1861337A1 publication Critical patent/EP1861337A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/006—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character
    • C03C17/007—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character containing a dispersed phase, e.g. particles, fibres or flakes, in a continuous phase
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2217/00—Coatings on glass
    • C03C2217/40—Coatings comprising at least one inhomogeneous layer

Definitions

  • the invention relates to a coated substrate according to the preamble of the independent apparatus claim, as well as to a process for the manufacture of a coated substrate according to the independent process claim.
  • Coatings for wear protection that make use of nano- structures are generally known.
  • multi-layer structures such as WC/TiC (tungsten carbide/titanium carbide) as well as two-phase single-layer structures of immiscible substances that are deposited simultaneously (TiN/SiN x ) .
  • these coatings suffer from the disadvantage that they are non-transparent to visible light.
  • hard coatings that are used for ophthalmic applications (e.g. on glass or plastic substrates for spectacle glasses) are called “hard” but their hardness is only up to 10 GPa. They are usually made from silicon oxide or titanium oxide. Scratch resistant coatings having a hardness of about 20 GPa or more are extremely difficult to produce and are often limited to thin film thicknesses such as up to a few tens of nanometers (e.g. up to 50 nm) .
  • the instant invention now suggests a coated substrate comprising a substrate and a crystalline/amorphous two-phase coating having a hardness of at least 20 GPa.
  • the coating comprises a crystalline substance and an amorphous substance as a matrix.
  • the crystalline substance and the amorphous substance are immiscible and are deposited on the substrate simultaneously so as to form the crystalline/amorphous two- phase coating.
  • the crystalline substance is selected from the group consisting of aluminium nitride, boron nitride, gallium nitride and indium nitride, or alloys thereof, and the amorphous substance is silicon nitride.
  • the term "immiscible” as used herein is to be understood such that up to 12% of silicon atoms can be contained in the crystalline phase, e.g. in the aluminium nitride phase.
  • the crystalline substances (including the alloys thereof) show the desired hardness and are at the same time highly transparent at least to visible light, so that coatings obtained using these substances can be applied to glass which may be used, by way of example, for scanners, displays, sensors or architectural glass. Also, the coatings may be used for ophthalmic applications, such as for spectacle glasses or plastics.
  • the crystalline substance is aluminium nitride.
  • Substrates using aluminium nitride as the crystalline substance are comparatively easy to manufacture in a well-controlled process, for example by using a physical vapour deposition process (PVD-process) as will be described " in more detail further below.
  • PVD-process physical vapour deposition process
  • the thickness of the coating is up to 2 ⁇ m.
  • Conventional transparent coatings having a thickness in this range are hitherto not known, since the substances used for manufacturing of the coatings were not suitable to obtain coatings having the afore-mentioned hardness.
  • a further aspect of the invention is related to a process for the manufacture of a coated substrate.
  • a substrate is coated with a crystalline/amorphous two-phase coating having a hardness of at least 20 GPa.
  • the crystalline substance and the amorphous substance are immiscible (as to the meaning of the term "immiscible” see above) and are applied to the substrate simultaneously so as to form the two phase crystalline/amorphous coating.
  • the crystalline substance is selected from the group consisting of aluminium nitride, boron nitride, gallium nitride and indium nitride, or alloys thereof, and the amorphous substance is silicon nitride. More preferably, aluminium nitride is selected as the crystalline substance.
  • the crystalline/amorphous two-phase coating formed on the substrate is transparent at least to visible light.
  • the crystalline and amorphous substances in accordance with a variant of the process are deposited on the substrate using a reactive physical vapour deposition (e.g. magnetron sputtering) process.
  • a reactive physical vapour deposition e.g. magnetron sputtering
  • at least two spatially separated targets may be used for the deposition of the two substances.
  • a single compound target may be used, so that the compound target comprises an alloy of the two substances (e.g. Al, Si) in the respective required amounts.
  • the unmixing of the two substances occurs even in this case, and in case of too low a reactivity of the deposited substances at the surface of the substrate, reactivity may be improved by supplying a high frequency voltage to the substrate holder or to the surface of the substrate (see below) .
  • the substrate may be heated to a temperature above room temperature, for example to a temperature of 200 0 C.
  • a high frequency bias voltage is applied between a holder of the substrate or the surface of the substrate, respectively, and a grounded wall of the vacuum chamber in which the coating is deposited on the substrate. It is thus possible to improve deposition of the crystalline/amorphous substances to form the crystalline/amorphous transparent two-phase coating.
  • an inert gas is supplied in the spatial area of the target of the crystalline substance, while in the spatial area of the target of the amorphous substance the reactive gas, e.g. nitrogen, is supplied.
  • the physical vapour deposition apparatus 1 (here: a magnetron sputtering apparatus) comprises a vacuum chamber 2 that is evacuated by means of a suitable vacuum pump VP that is known per se.
  • a typical range for the pressure within vacuum chamber 2 during the reaction is from 0.1 to 1 Pa.
  • a holder 3 for a substrate S to be coated is arranged within vacuum chamber 2. Between substrate holder 3 (or between the surface of substrate S) and the grounded wall 20 surrounding vacuum chamber 2 a high frequency bias voltage may be applied. This measure may assist the deposition process by generating a plasma in the area of the surface of substrate S thus improving the deposition of the substances of the coating as will be described further below.
  • targets Tl and T2 are arranged spatially separated within vacuum chamber 2.
  • target Tl may be a silicon target and target T2 may be an aluminium target.
  • Targets Tl and T2 form the cathode of respective magnetrons Ml and M2, which serve for sputtering the substances onto the surface of substrate S.
  • the magnetrons Ml and M2 assist in concentrating the plasma density in the area near targets Tl and T2 thus improving the sputtering rate.
  • Two gas inlets Gl and G2 are also shown in the drawing figure. They supply a reactive gas, e.g. nitrogen, and an inert gas (e.g. argon), respectively, into vacuum chamber 2.
  • a reactive gas e.g. nitrogen
  • an inert gas e.g. argon
  • the supply rate is dependent from the respective PVD-apparatus used and from the pumping speed of vacuum pump VP.
  • the sputtering of the substances is a known process and operates essentially such, that plasma ions of the argon plasma erode atoms or clusters of atoms from targets Tl and T2.
  • the magnetrons Ml and M2 serve for local concentration of the plasma density in the area of targets Tl and T2 so as to increase the erosion rate.
  • the power densities (power/area) at the targets are, for example, 10 W/cm 2 at aluminium target T2 and about 1-2 W/cm 2 at silicon target Tl.
  • it is essential that the substances are sputtered simultaneously onto the surface of substrate S so that the crystalline and amorphous substances are deposited on the surface of substrate S simultaneously in order to form the desired two- phase transparent hard coating.
  • gas inlet Gl through which the reactive gas, e.g. nitrogen, is supplied into vacuum chamber 2, may be arranged in the area of silicon target Tl (or even the inlet extends through target Tl) , so that the surface of silicon target Tl is nitrided and thus silicon nitride is sputtered onto the surface of substrate S rather than pure silicon.
  • argon is supplied into vacuum chamber 2 may be arranged in the area of aluminium target T2, so that the surface of aluminium target T2 is not nitrided but rather it is aluminium that is sputtered onto the surface of substrate S.
  • aluminium has a reactivity sufficient to form the aluminium nitride on the surface of substrate S so that aluminium nitride is thus deposited on the surface of substrate S.
  • reactivity can be improved by means of a high frequency voltage that is applied by a high frequency voltage source HF to substrate holder 3 or to the surface of substrate S.
  • a heater H may be arranged within vacuum chamber 2 in order to heat substrate S to a certain temperature above room temperature, e.g. to about 200 0 C.
  • substrate S may be preheated outside vacuum chamber 2 and be introduced into vacuum chamber 2 in a preheated state.
  • room temperature e.g. to about 200 0 C.
  • lower temperatures or even room temperature of substrate S may be possible, so that heating substrate S is only optional.
  • the hardness of the thus obtained coatings (for the above-described example an AlN/Si 3 N 4 coating) of a glass substrate may be in the range of from 20 GPa to 25 GPa and may have a thickness of up to 2 ⁇ m (in particular l-2 ⁇ m) .
  • the hardness is a Vickers hardness but does not necessarily need to be measured with the standard geometry for obtaining the Vickers hardness but may be measured with a geometry according to Berkovich (see, for example: G. M. Pharr, W. C. Oliver, F. R. Brotzen J. Mat. Res. 7 (1992), page 1 ff.; W. C. Oliver, G. M. Pharr, J. Mat. Res.
  • the coating is resistant to corrosion.
  • the size of the grains of the crystalline substance (here: AlN) is up to 20 nm and may be determined using x-ray diffraction methods and/or transmission electron microscopy.
  • aluminium nitride As the crystalline substance (aluminium target) of the two-phase transparent hard coating. Transparency is at least given in the wavelength range of the visible light (i.e. between about 400 nm and 800 nm) .
  • aluminium nitride (AlN) is a preferred crystalline substance, other substances can also be used.
  • boron nitride BN; boron target
  • gallium nitride GaN; gallium target
  • indium nitride InN; indium target
  • alloys thereof alloys thereof.
  • the process for manufacturing the coating has been described by way of example using a PVD-process (here: magnetron sputtering) .
  • CVD chemical vapour deposition

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  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Composite Materials (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Surface Treatment Of Glass (AREA)
  • Laminated Bodies (AREA)

Abstract

A coated substrate comprises a substrate (S) and a crystalline/amorphous two-phase coating of a hardness of at least 20 GPa. The coating comprises a crystalline substance and an amorphous substance as a matrix. The crystalline substance and the amorphous substance are immiscible and are deposited on the substrate (S) simultaneously. The crystalline/ amorphous two-phase coating is transparent at least to visible light. The crystalline substance is selected from the group consisting of aluminium nitride (AlN) , boron nitride (BN), gallium nitride (GaN) and indium nitride (InN), or alloys thereof, while the amorphous substance is silicon nitride (Si3N4).

Description

Coated substrate and process for the manufacture of a coated substrate
The invention relates to a coated substrate according to the preamble of the independent apparatus claim, as well as to a process for the manufacture of a coated substrate according to the independent process claim.
Coatings for wear protection that make use of nano- structures are generally known. For example, multi-layer structures such as WC/TiC (tungsten carbide/titanium carbide) as well as two-phase single-layer structures of immiscible substances that are deposited simultaneously (TiN/SiNx) . However, these coatings suffer from the disadvantage that they are non-transparent to visible light.
Conventional hard coatings that are used for ophthalmic applications (e.g. on glass or plastic substrates for spectacle glasses) are called "hard" but their hardness is only up to 10 GPa. They are usually made from silicon oxide or titanium oxide. Scratch resistant coatings having a hardness of about 20 GPa or more are extremely difficult to produce and are often limited to thin film thicknesses such as up to a few tens of nanometers (e.g. up to 50 nm) .
The instant invention now suggests a coated substrate comprising a substrate and a crystalline/amorphous two-phase coating having a hardness of at least 20 GPa. The coating comprises a crystalline substance and an amorphous substance as a matrix. The crystalline substance and the amorphous substance are immiscible and are deposited on the substrate simultaneously so as to form the crystalline/amorphous two- phase coating. The crystalline substance is selected from the group consisting of aluminium nitride, boron nitride, gallium nitride and indium nitride, or alloys thereof, and the amorphous substance is silicon nitride. The term "immiscible" as used herein is to be understood such that up to 12% of silicon atoms can be contained in the crystalline phase, e.g. in the aluminium nitride phase. The crystalline substances (including the alloys thereof) show the desired hardness and are at the same time highly transparent at least to visible light, so that coatings obtained using these substances can be applied to glass which may be used, by way of example, for scanners, displays, sensors or architectural glass. Also, the coatings may be used for ophthalmic applications, such as for spectacle glasses or plastics.
In a preferred embodiment, the crystalline substance is aluminium nitride. Substrates using aluminium nitride as the crystalline substance are comparatively easy to manufacture in a well-controlled process, for example by using a physical vapour deposition process (PVD-process) as will be described" in more detail further below.
In still a further embodiment of the coated substrate the thickness of the coating is up to 2μm. Conventional transparent coatings having a thickness in this range are hitherto not known, since the substances used for manufacturing of the coatings were not suitable to obtain coatings having the afore-mentioned hardness.
A further aspect of the invention is related to a process for the manufacture of a coated substrate. In this process a substrate is coated with a crystalline/amorphous two-phase coating having a hardness of at least 20 GPa. The crystalline substance and the amorphous substance are immiscible (as to the meaning of the term "immiscible" see above) and are applied to the substrate simultaneously so as to form the two phase crystalline/amorphous coating. The crystalline substance is selected from the group consisting of aluminium nitride, boron nitride, gallium nitride and indium nitride, or alloys thereof, and the amorphous substance is silicon nitride. More preferably, aluminium nitride is selected as the crystalline substance. The crystalline/amorphous two-phase coating formed on the substrate is transparent at least to visible light.
The crystalline and amorphous substances in accordance with a variant of the process are deposited on the substrate using a reactive physical vapour deposition (e.g. magnetron sputtering) process. In particular, for the deposition of the two substances at least two spatially separated targets may be used. Alternatively, a single compound target may be used, so that the compound target comprises an alloy of the two substances (e.g. Al, Si) in the respective required amounts. The unmixing of the two substances occurs even in this case, and in case of too low a reactivity of the deposited substances at the surface of the substrate, reactivity may be improved by supplying a high frequency voltage to the substrate holder or to the surface of the substrate (see below) . Also, prior to depositing the two substances on the substrate the substrate may be heated to a temperature above room temperature, for example to a temperature of 2000C.
In a further variant of the process a high frequency bias voltage is applied between a holder of the substrate or the surface of the substrate, respectively, and a grounded wall of the vacuum chamber in which the coating is deposited on the substrate. It is thus possible to improve deposition of the crystalline/amorphous substances to form the crystalline/amorphous transparent two-phase coating.
In a further variant of the process an inert gas is supplied in the spatial area of the target of the crystalline substance, while in the spatial area of the target of the amorphous substance the reactive gas, e.g. nitrogen, is supplied.
Further advantageous embodiments or variants of the invention will now be described with the aid of the drawing, in which the only drawing figure shows an embodiment of an apparatus for performing an embodiment of the process according to the invention, which forms the coated substrate with the crystalline/amorphous two-phase transparent coating. The process described in the following is, however, only one example of how to perform the process according to the invention.
The physical vapour deposition apparatus 1 (here: a magnetron sputtering apparatus) comprises a vacuum chamber 2 that is evacuated by means of a suitable vacuum pump VP that is known per se. A typical range for the pressure within vacuum chamber 2 during the reaction is from 0.1 to 1 Pa. A holder 3 for a substrate S to be coated is arranged within vacuum chamber 2. Between substrate holder 3 (or between the surface of substrate S) and the grounded wall 20 surrounding vacuum chamber 2 a high frequency bias voltage may be applied. This measure may assist the deposition process by generating a plasma in the area of the surface of substrate S thus improving the deposition of the substances of the coating as will be described further below.
Two targets Tl and T2 are arranged spatially separated within vacuum chamber 2. For example, target Tl may be a silicon target and target T2 may be an aluminium target. Targets Tl and T2 form the cathode of respective magnetrons Ml and M2, which serve for sputtering the substances onto the surface of substrate S. The magnetrons Ml and M2 assist in concentrating the plasma density in the area near targets Tl and T2 thus improving the sputtering rate.
Two gas inlets Gl and G2 are also shown in the drawing figure. They supply a reactive gas, e.g. nitrogen, and an inert gas (e.g. argon), respectively, into vacuum chamber 2. The supply rate may for example, be 2 seem nitrogen (seem = cmVs in a standard environment with a pressure of 101.3 kPa and a temperature of 00C) and 20 seem argon. However, the supply rate is dependent from the respective PVD-apparatus used and from the pumping speed of vacuum pump VP.
The sputtering of the substances is a known process and operates essentially such, that plasma ions of the argon plasma erode atoms or clusters of atoms from targets Tl and T2. The magnetrons Ml and M2 serve for local concentration of the plasma density in the area of targets Tl and T2 so as to increase the erosion rate. The power densities (power/area) at the targets are, for example, 10 W/cm2 at aluminium target T2 and about 1-2 W/cm2 at silicon target Tl. However, it is essential that the substances are sputtered simultaneously onto the surface of substrate S so that the crystalline and amorphous substances are deposited on the surface of substrate S simultaneously in order to form the desired two- phase transparent hard coating.
In a specific embodiment it may be desirable that silicon nitride is directly sputtered onto the surface of substrate S, since silicon may only be comparatively poorly reactive on the surface of substrate S. For that reason, gas inlet Gl, through which the reactive gas, e.g. nitrogen, is supplied into vacuum chamber 2, may be arranged in the area of silicon target Tl (or even the inlet extends through target Tl) , so that the surface of silicon target Tl is nitrided and thus silicon nitride is sputtered onto the surface of substrate S rather than pure silicon. The gas inlet G2 through which the inert gas, e.g. argon, is supplied into vacuum chamber 2 may be arranged in the area of aluminium target T2, so that the surface of aluminium target T2 is not nitrided but rather it is aluminium that is sputtered onto the surface of substrate S. However, aluminium has a reactivity sufficient to form the aluminium nitride on the surface of substrate S so that aluminium nitride is thus deposited on the surface of substrate S.
Alternatively or in combination, reactivity can be improved by means of a high frequency voltage that is applied by a high frequency voltage source HF to substrate holder 3 or to the surface of substrate S. In addition, a heater H may be arranged within vacuum chamber 2 in order to heat substrate S to a certain temperature above room temperature, e.g. to about 2000C. Also, substrate S may be preheated outside vacuum chamber 2 and be introduced into vacuum chamber 2 in a preheated state. However, also lower temperatures or even room temperature of substrate S may be possible, so that heating substrate S is only optional.
The hardness of the thus obtained coatings (for the above-described example an AlN/Si3N4 coating) of a glass substrate may be in the range of from 20 GPa to 25 GPa and may have a thickness of up to 2 μm (in particular l-2μm) . The hardness is a Vickers hardness but does not necessarily need to be measured with the standard geometry for obtaining the Vickers hardness but may be measured with a geometry according to Berkovich (see, for example: G. M. Pharr, W. C. Oliver, F. R. Brotzen J. Mat. Res. 7 (1992), page 1 ff.; W. C. Oliver, G. M. Pharr, J. Mat. Res. 7 (1992) page 1564 ff.; T. F. Page, S. V. Hainsworth, Surface Coating Technol. 61 81993, pages 201 ff.). Also, the coating is resistant to corrosion. The size of the grains of the crystalline substance (here: AlN) is up to 20 nm and may be determined using x-ray diffraction methods and/or transmission electron microscopy.
The afore-described variant of the process has been described for aluminium nitride (AlN) as the crystalline substance (aluminium target) of the two-phase transparent hard coating. Transparency is at least given in the wavelength range of the visible light (i.e. between about 400 nm and 800 nm) . While aluminium nitride (AlN) is a preferred crystalline substance, other substances can also be used. For example, it is as well possible to use boron nitride (BN; boron target) , gallium nitride (GaN; gallium target), or indium nitride (InN; indium target), or alloys thereof. Also, the process for manufacturing the coating has been described by way of example using a PVD-process (here: magnetron sputtering) . However, it is also conceivable that other processes like CVD (chemical vapour deposition) be used.

Claims

Claims
1. Coated substrate comprising a substrate (S) and a crystalline/amorphous two-phase coating of a hardness of at least 20 GPa, the coating comprising a crystalline substance and an amorphous substance as a matrix, the crystalline substance and the amorphous substance being immiscible and being deposited on the substrate (S) simultaneously with the crystalline/amorphous two-phase coating being transparent at least to visible light, characterized in that the crystalline substance is selected from the group consisting of aluminium nitride (AlN) , boron nitride (BN) , gallium nitride (GaN) and indium nitride (InN), or alloys thereof, and in that the amorphous substance is silicon nitride (Si3N4) .
2. Coated substrate according to claim 1, wherein the crystalline substance is aluminium nitride (AlN) .
3. Coated substrate according to any one of the preceding claims wherein the thickness of the coating is up to 2μm.
4. Process for the manufacture of a coated substrate, in which a substrate (S) . is coated with a crystalline/ amorphous two-phase coating having a hardness of at least 20 GPa, wherein the crystalline substance and the amorphous substance are immiscible and are applied to the substrate (S) simultaneously so as to form the two phase crystalline/amorphous coating, with the crystalline and amorphous substances being selected such that the crystalline/amorphous two-phase coating formed on the substrate is transparent at least to visible light, characterized in that the crystalline substance is selected from the group consisting of aluminium nitride (AlN) , boron nitride (BN), gallium nitride (GaN) and indium nitride (InN), or alloys thereof, and in that the amorphous substance is silicon nitride (Si3N/j) .
5. Process according to claim 4, wherein aluminium nitride (AlN) is selected as the crystalline substance.
6. Process according to claim 4 or claim 5, wherein the crystalline and amorphous substances are deposited on the substrate (S) using a reactive physical vapour deposition process .
7. Process according to claim 6, wherein for the deposition of the two substances a single compound target is used.
8. Process according to claim 6, wherein for the deposition of the two substances at least two spatially separated targets (Tl, T2) are used.
9. Process according to any one of claims 6 or 7, wherein prior to depositing the two substances on the substrate (S) the substrate (S) is heated to a temperature up to a temperature above room temperature, e.g. to a temperature of 2000C.
10. Process according to any one of claims 6 to 9, wherein between a holder (3.) of the substrate (S) or the surface of the substrate (S) , respectively, and a grounded wall (20) of the vacuum chamber (2) in which the two substances are deposited on the substrate (S) , a high frequency bias voltage (HF) is applied.
11. Process according to any one of claims 8 to 10, wherein in the spatial area of the target (T2) of the crystalline substance an inert gas is supplied, and wherein in the spatial area of the target (Tl) of the amorphous substance the reactive gas, e.g. nitrogen, is supplied.
EP06705400A 2005-03-23 2006-03-17 Coated substrate and process for the manufacture of a coated substrate Withdrawn EP1861337A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP06705400A EP1861337A1 (en) 2005-03-23 2006-03-17 Coated substrate and process for the manufacture of a coated substrate

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP05405259A EP1705162A1 (en) 2005-03-23 2005-03-23 Coated substrate and process for the manufacture of a coated substrate
PCT/CH2006/000160 WO2006099765A1 (en) 2005-03-23 2006-03-17 Coated substrate and process for the manufacture of a coated substrate
EP06705400A EP1861337A1 (en) 2005-03-23 2006-03-17 Coated substrate and process for the manufacture of a coated substrate

Publications (1)

Publication Number Publication Date
EP1861337A1 true EP1861337A1 (en) 2007-12-05

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