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EP1665391A1 - Module optique et systeme optique - Google Patents

Module optique et systeme optique

Info

Publication number
EP1665391A1
EP1665391A1 EP04741544A EP04741544A EP1665391A1 EP 1665391 A1 EP1665391 A1 EP 1665391A1 EP 04741544 A EP04741544 A EP 04741544A EP 04741544 A EP04741544 A EP 04741544A EP 1665391 A1 EP1665391 A1 EP 1665391A1
Authority
EP
European Patent Office
Prior art keywords
optical module
circuit carrier
lens
lens holder
module according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04741544A
Other languages
German (de)
English (en)
Inventor
Henryk Frenzel
Harald Schmidt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Automotive GmbH
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of EP1665391A1 publication Critical patent/EP1665391A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/022—Mountings, adjusting means, or light-tight connections, for optical elements for lenses lens and mount having complementary engagement means, e.g. screw/thread
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/407—Optical elements or arrangements indirectly associated with the devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers

Definitions

  • the invention relates to an optical module with a rigid circuit carrier comprising an assembly surface; an unhoused semiconductor element arranged by means of flip-chip technology on the assembly surface of the circuit carrier; and a lens unit which is arranged on the side of the circuit carrier facing away from the component surface; wherein the circuit carrier has an opening through which electromagnetic radiation is projected from the lens unit onto the semiconductor element; and wherein the lens unit comprises a lens holder and a lens arrangement with at least one lens.
  • Generic optical modules are known for example from DE 196 51 260 AI.
  • the invention further relates to an optical system with such an optical module.
  • Motor vehicles such as LD (lane departure warning) lane departure warning, BSD (blind spot detection) blind spot detection, or rear view cameras (rear view cameras) work, in particular the infrared radiation which is invisible to people in applications in the interior of a motor vehicle such as OOP (out of Position Detection) position-leaving detection or with additional external lighting of a night vision system is preferred.
  • Applications in the interior or exterior of a vehicle are subject to high demands due to external influences such as temperature, humidity, pollution and vibration.
  • the typical lifespan for systems in the vehicle is 10 to 15 years, whereby only extremely low failure rates are tolerated, so that the components of an optical system of the type mentioned at the outset may also only show very slow aging.
  • the optics have their exact focus at the point of conversion of light into information (e.g. film plane, optical surface CCD or CMOS sensor). Therefore, the distance between the camera chip and the optics must either be set and fixed once during production or the focus is reset for each image (focusing on the object, non-blurring rays). This leads to a considerable manufacturing effort. This also poses a quality risk.
  • Cameras for specific low-cost applications such as automotive, industry, digital cameras, cell phones, toys, etc. should, however, be possible from cost and quality assurance aspects can be produced without any adjustment processes between the optics and the camera chip, i.e. without adjusting the focus to the optical surface of the CMOS or CCD sensor. This is fundamentally contrary to the requirements mentioned.
  • One possibility of developing a focus-free system is to reduce the sum of the possible tolerances and elements, so that the module or system, due to the design, works without adjustment, at least in a certain distance and temperature range.
  • sharp images should be taken at distances of e.g. 15 cm to 130 cm and at temperatures of e.g. - 40 ° C to + 105 ° C can be guaranteed.
  • This is all the more realizable, the fewer elements are included in the tolerance chain.
  • the circuit carrier for the camera chip e.g. CCD or CMOS
  • the circuit carrier for the camera chip has a large share in the tolerance chain.
  • the necessary soldered and possibly adhesive connections or the like between the chip and the circuit carrier have a large proportion in the tolerance chain.
  • the lens holder itself which is preferably made of plastic, can be connected to the lens arrangement in various ways, so that an exact optical alignment of the lens arrangement and the semiconductor element with respect to the lens holder or the lens arrangement can always be ensured.
  • the camera chip being unhoused as a so-called flip chip on a suitable circuit carrier, it is difficult to avoid the problems mentioned in their entirety and at the same time to meet the quality requirements mentioned fulfill.
  • the lens itself must be adjusted to the camera chip and have a defined focus.
  • the object of the invention is to provide an optical module and an optical system with an unhoused semiconductor element arranged on a rigid circuit carrier
  • the invention builds on the generic optical module in that at least one permanently elastic or resilient element is arranged between the lens holder and circuit carrier, which presses the mounting surface of the circuit carrier away from the lens holder against at least one stop element which is positively related to the lens unit.
  • the present invention takes a new route in that the circuit carrier by means of a permanently elastic element in the opposite direction, i.e. is pressed away from the lens holder, and there a stop is positively related to the optics.
  • the entire tolerance of the circuit carrier and possibly. Adhesives not largely, but completely eliminated in an advantageous manner.
  • the present invention thus enables production technology with particularly small tolerances between an unhoused semiconductor element and a lens unit.
  • the form fit is realized by a form fit surface formed on the stop element.
  • this can be part of a snap connection.
  • the stop element is preferably realized by hooks formed on the lens holder. This not only makes assembly, but also subsequent recycling, especially the separation of optics and electronics, particularly environmentally friendly and easy.
  • the stop element is part of a screw or rivet connection or the like, where in the case of the stop element is preferably realized by spacer bolts or screw holes arranged on the lens holder, which interact with a screw, for example a plastic rivet or the like.
  • the permanently elastic or resilient element is preferably rectangular, ring-shaped or the like, preferably as a stamped part. This advantageously allows mass production.
  • the optical module according to the invention can be further developed in that a ventilation channel is provided in the connection area between the rigid printed circuit board and the permanently elastic or resilient element. In this way, a sealed module can “breathe”, particularly in the case of strong temperature fluctuations.
  • they are porous, in particular foam rubber-like, formed permanently elastic or resilient E elements of advantage by means of which the lens can be "breathed".
  • the invention consists of an optical system with an optical module of the type mentioned above.
  • the advantages of the optical module also come into play in the context of an overall system.
  • the invention is based on the knowledge that, contrary to the previous approaches, it is possible to use a permanently elastic or resilient element to move the circuit carrier in the opposite direction, i.e. away from the lens holder, pressing against a stop that is positively related to the optics, that a compact, highly integrated module solution with small dimensions is available, which is equally easy to assemble and disassemble and is therefore particularly cost-effective.
  • the optical module and the optical system are practically maintenance-free.
  • it is also not necessary to adjust the optical module optically since this is in any case due to the geometric design of the stop elements, the tolerance chain being shortened by a further measure by eliminating the circuit carrier and adhesive tolerance.
  • the tolerance of the stop element alone remains in the tolerance chain.
  • this dimension is tool-related.
  • the optical module or optical system according to the invention is thus significantly less tolerant than previously known.
  • the invention can be particularly useful in the implementation of video systems, possibly in combination with a radar system men, ultrasound systems or the like in the automotive field.
  • FIG. 1 shows a perspective, partially sectioned illustration of an optical module according to the invention
  • FIG. 2 shows the optical module according to the invention according to FIG. 1 in a sectional view
  • FIG 3 shows the lens holder of an optical module according to the invention with screw holes
  • FIG. 4 shows the lens holder according to FIG. 3 with the permanently elastic or resilient ring element placed or molded on;
  • FIG. 5 shows the lens holder according to FIGS. 3 and 4 with a prepositioned circuit carrier
  • FIG. 6 shows the lens holder according to FIG. 5 with a fixed circuit carrier
  • FIG. 7 shows an illustration of an optical module according to the invention, sectioned through the optical axis.
  • Fig. 8 is a sectional view of the fixation of an optical module according to the invention.
  • identical reference symbols designate identical or comparable components.
  • a lens unit 14; 16, 18, 20; 21 and a rigid circuit board 10, comprising an assembly area 10a can be seen.
  • the presently rigid printed circuit board 10 forms the circuit carrier 10 for an unhoused semiconductor element 12 which is sensitive to electromagnetic radiation and which is applied here as a so-called flip chip 12, which has the advantage that no additional tolerances within the sensor or component (eg carrier chip,
  • the presently rigid printed circuit board 10 is in operative contact with a ribbon cable or a flexible printed circuit board 27, at the opposite end of which it is provided with soldering pads 28, so that electrical contact between the optical module and a circuit board (not shown), for example by iron soldering Use of the solder pads 28 can be made.
  • the semiconductor element 12 is arranged on the circuit carrier 10 via solder bumps 30.
  • the semiconductor element 12 is arranged on the circuit carrier 10 using flip-chip technology. So that electromagnetic radiation from the lens arrangement 16, 18, 20; arranged on the side 10b facing away from the mounting surface 10a of the circuit carrier 10; 21 can reach the semiconductor element 12, the rigid circuit carrier 10 has an opening 24. This also has between the lens holder 14 and circuit carrier 10 or its second surface Before 10b, permanently elastic or resilient element 22 has an opening 32. Through these openings, electromagnetic radiation can reach a surface 34 of the semiconductor element 12 that is sensitive to electromagnetic radiation.
  • the semiconductor element 12 can, for example, be designed as CMOS or CCD.
  • an adhesive connection can also be provided.
  • An underfill (not shown) can be applied for reinforcement.
  • a glob top 26 is provided.
  • a groove for ventilation (not shown) can be provided in the flexible element 22, for example. It is also possible to arrange an adhesive DAE (adhesive pressure compensation element) on an opening (not shown) in the flexible element 22 or in the lens holder 14.
  • the optical quality can be improved by a lens with a plurality of lenses, which is also possible within the scope of the present invention, in particular since it is possible to work with small tolerances.
  • the lenses 16, 18, 20 and the diaphragm 21 are shaped such that they assume a defined position within the lens holder 14 relative to one another.
  • one of the lenses is Any artwork least 20 configured so that these 20 (play, as shown in Fig. 7 and 8 cooperating with ⁇ via locking means 38 with the lens holder 14 and with respect to the lens holder 14 and ultimately be as well a defined position takes on the semiconductor element 12. In this way, all lenses 16, 18, 20 or diaphragms 21 are adjusted with respect to the semiconductor element 12.
  • circuit carrier 10 and lens unit 14; 16, 18, 20; 21 takes place according to the invention via the at least one permanently elastic or resilient element 22 which is arranged between the lens holder 14 and the circuit carrier 10 and which moves the mounting surface 10a of the circuit carrier 10 away from the lens holder 14 against at least one stop element 13; 35 presses, which positively to the lens unit 14; 16, 18, 20; 21 related.
  • the stop element 33; 35 a positive locking surface 37 is formed.
  • the stop element 13 is, for example, part of a snap connection, which is realized by hooks arranged on the lens holder 14. Said positive-locking surface 37 is formed on the hook 13 in such a way that the mounting surface 10a flies against it 37.
  • Fig. 3 shows an alternative embodiment according to the invention.
  • the stop element 35 is part of a screw or rivet connection, with spacer elements 35 designed as screw holes 35 being arranged on the lens holder 14.
  • FIG. 4 shows the lens holder 14 according to FIG. 3 with a permanently elastic or resilient ring element 22 placed thereon.
  • the element 22 can also be molded onto the lens holder 14, for example by means of a two-component injection molding process or the like. It can be clearly seen how the shape at the end of the screw holes 35 facing away from the lens unit end faces 37 are formed, the mode of operation of which is described below.
  • FIG. 5 shows the lens holder 14 according to FIGS. 3 and 4 with a pre-positioned rigid PCB circuit carrier 10, this 10 not yet forming a surface connection with the form-fitting surfaces 37 of the spacer elements 35. In other words - the circuit carrier 10 has not yet been pressed down over the contact with the permanently elastic element 22.
  • FIG. 6 shows the lens holder 14 according to FIG. 5 with a fixed PCB circuit carrier 10. Fixing elements such as screws 33, plastic rivets or similar elements are introduced into the spacer elements 35 until they 33 rest against the form-fitting surface 37. As a result, the flip-chip surface or mounting surface 10a of the PCB circuit carrier 10 is aligned in a defined manner with respect to the lens unit.
  • FIG. 7 shows this in a representation cut through the optical axis
  • FIG. 8 in a representation cut through the fixation of an optical module according to the invention.
  • the permanently elastic or resilient element 22 presses the mounting surface 10a of the circuit carrier 10 against the fixing elements 33.
  • the circuit carrier has so far been pressed against a lens holder.
  • the present invention now goes a new way in that the circuit carrier is pressed in the opposite direction, ie away from the lens holder 14, by means of a permanently elastic or resilient element 22 and there a stop 13; 33, 35 is positively related to the optics. This completely eliminates the entire tolerance of the circuit carrier 10 and any adhesives.
  • the present invention is based on an optical module with a lens unit, which comprises a lens holder 14, in which a lens arrangement comprising, for example, three lenses 16, 18, 20 and a diaphragm 21 is inserted.
  • the lenses 16, 18, 20 and the diaphragm 21 are preferably clearly aligned with one another and with respect to the lens holder 14 due to their geometric design, so that no further optical adjustment of the optical module is required.
  • the lens holder 14 also stands over at least one stop element 13 formed on the lens holder 14; 35 with the mounting surface 10a of a rigid printed circuit board 10, which at the same time serves as a circuit carrier for an unhoused semiconductor element 12 sensitive to electromagnetic radiation, in such a way that for the first time the thickness tolerance of the circuit carrier 10 and any adhesive connections advantageously not in the tolerance chain of generic optical modules or systems.
  • the semiconductor element 12 is arranged at a defined position with respect to the other optical elements, ie in particular the lenses 16, 18, 20 or the diaphragm 21, the type of circuit carrier 10, for example FR4, CEM, etc., needs previously customary, can no longer be committed. Rather, "normal”, uncritical and therefore less expensive circuit carriers can be used.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Lens Barrels (AREA)
  • Studio Devices (AREA)

Abstract

L'invention concerne un module optique qui comporte un support d'objectif (14), dans lequel est disposé un ensemble objectif constitué, par exemple, de trois lentilles (16, 18, 20) et d'un diaphragme (21). De préférence, les lentilles (16, 18, 20) et le diaphragme (21) sont alignés de façon définie grâce à leur forme géométrique, de telle sorte qu'un autre ajustage optique n'est pas nécessaire. En outre, l'ajustage du support de circuit (10) et de l'ensemble objectif (14; 16, 18, 20; 21) se fait par l'intermédiaire d'au moins un élément (22) à élasticité permanente ou faisant ressort qui est disposé entre le support d'objectif (14) et le support de circuit (10) et maintient à distance du support d'objectif (14) la face équipée (10a) du support de circuit (10), de façon qu'elle repose contre au moins un élément de butée (13; 35) qui est en liaison de forme (37) avec l'ensemble objectif (14; 16, 18, 20; 21). Avec la structure présentée, on obtient un module ou un système optique dans lequel, de façon avantageuse, pour la première fois, la tolérance d'épaisseur du support de circuit (10) et d'éventuels adhésifs n'influe pas sur la chaîne de tolérance. L'invention trouve en particulier des applications dans la zone intérieure et dans la zone extérieure d'un véhicule automobile.
EP04741544A 2003-09-26 2004-05-11 Module optique et systeme optique Withdrawn EP1665391A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10344768A DE10344768B3 (de) 2003-09-26 2003-09-26 Optisches Modul mit federndem Element zwischen Linsenhalter und Schaltungsträger und optisches System
PCT/EP2004/050755 WO2005031878A1 (fr) 2003-09-26 2004-05-11 Module optique et systeme optique

Publications (1)

Publication Number Publication Date
EP1665391A1 true EP1665391A1 (fr) 2006-06-07

Family

ID=34384303

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04741544A Withdrawn EP1665391A1 (fr) 2003-09-26 2004-05-11 Module optique et systeme optique

Country Status (5)

Country Link
US (1) US7268957B2 (fr)
EP (1) EP1665391A1 (fr)
JP (1) JP4891771B2 (fr)
DE (1) DE10344768B3 (fr)
WO (1) WO2005031878A1 (fr)

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DE10344768B3 (de) 2005-08-18
US7268957B2 (en) 2007-09-11
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US20060222300A1 (en) 2006-10-05
WO2005031878A1 (fr) 2005-04-07

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