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EP1083781B1 - Boîtier pour équipement électronique - Google Patents

Boîtier pour équipement électronique Download PDF

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Publication number
EP1083781B1
EP1083781B1 EP00116829A EP00116829A EP1083781B1 EP 1083781 B1 EP1083781 B1 EP 1083781B1 EP 00116829 A EP00116829 A EP 00116829A EP 00116829 A EP00116829 A EP 00116829A EP 1083781 B1 EP1083781 B1 EP 1083781B1
Authority
EP
European Patent Office
Prior art keywords
housing
profiles
profile
cooling blocks
side cheek
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP00116829A
Other languages
German (de)
English (en)
Other versions
EP1083781A3 (fr
EP1083781A2 (fr
Inventor
Wolfgang Kummle
Dieter Stolle
Alfred Schreiber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Diehl Aerospace GmbH
Original Assignee
Diehl Aerospace GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Diehl Aerospace GmbH filed Critical Diehl Aerospace GmbH
Publication of EP1083781A2 publication Critical patent/EP1083781A2/fr
Publication of EP1083781A3 publication Critical patent/EP1083781A3/fr
Application granted granted Critical
Publication of EP1083781B1 publication Critical patent/EP1083781B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/04—Metal casings

Definitions

  • the invention relates to a housing for electronic assemblies with circuit boards and mounted on the circuit boards cooling blocks.
  • DE 38 41 893 C2 discloses a power shift module for motor vehicles with a housing open on one side for receiving a printed circuit board.
  • the housing opening is closed by a housing cover connected to the circuit board.
  • the heat dissipation of the electronic components provided on the printed circuit board takes place via a specially designed heat sink.
  • the heat sink contains a crowd of rod-shaped beams with a T-profile.
  • the individual carriers are arranged parallel next to one another in a holder fastened to the printed circuit board and form a substantially closed thermal contact surface which rests on the inner surface of a metallic outer wall of the housing in a heat-conducting manner.
  • a housing for an electronic circuit arrangement which consists of at least two housing parts and is suitable for cooling of electrical components, wherein a simple as possible thermally conductive Connection between the housing and an electrical component to be produced. This is done by a holding spring held in one of the housing parts, which presses the electrical component against the inner wall of another housing part.
  • an electrical device with a multi-part housing in which a plurality of printed circuit boards are arranged in at least two housing parts and cooling power components.
  • the power components are pressed by retaining spring to the inner wall or projections of the housing, whereby the heat loss is dissipated.
  • the housing consists of two channel-shaped half-shells.
  • the half-shells have female fingers and strips, which match each other in pairs, so that screw channels are formed, in which engages an end plate, which holds the half-shells together. In this way, the cohesion of the housing after the pushing together of the half-shells is secured.
  • FR-A-2 598 585 a mechanically sealed housing for electronic components is known which consists of two housing parts and is suitable for cooling these components.
  • the housing consists of two assembled, interlocking extrusion profiles. These U-profiles are identical and asymmetrical with respect to their median plane (see Fig. 6).
  • the inner side cheeks have grooves on their entire length to allow the holding of printed circuit boards. The heat generated by the electronic components is dissipated through the housing.
  • the invention is based on the object to build a dimensionally stable housing in such electronic assemblies with simple means, with a good heat transfer between the cooling blocks and the housing is guaranteed.
  • this object is achieved in that the side walls of the housing of two extruded U-profiles, each with a central part and at right angles to the middle part angled side cheeks, the U-profiles along the longitudinal edges of the side cheeks intermesh with play and the middle parts of the U-profiles are connected to opposite end faces of the cooling blocks.
  • the dimensions of the housing are then determined by the dimensions of the cooling blocks, It is always a good heat transfer between the cooling blocks and the housing guaranteed.
  • the tolerances of the U-profiles are relatively low requirements.
  • Embodiments of the invention are the subject of the dependent claims.
  • the U-profile 1 shows a cross section of a rectangular housing jacket with four side walls 10, 12, 14 and 16 of an electronic component housing.
  • the four side walls are formed by two angular U-profiles 18 and 20.
  • the U-profiles are manufactured as extruded profiles.
  • the U-profile 18 has a central portion 22, a first side wall 24 and a second side wall 26.
  • the U-profile 20 has a central portion 28, a first side wall 30 and a second side wall 32.
  • the middle portions 22 and 28 form the two opposite side walls 10 and 14.
  • the aligned side walls 26 and 30 together form the side walls 10 and 12 perpendicular side wall 12.
  • the aligned side walls 24 and 32 together form the side walls 10 and 12 also perpendicular to the side wall 12 opposite side wall 16.
  • the two U-profiles 18 and 20 are designed to be unequal and asymmetric with respect to their center line 34.
  • the free longitudinal edges of the 36 and 38 of the first side cheeks 24 and 30 have a projecting bar 40 and 42, respectively.
  • the free longitudinal edges 44 and 46 of the second side cheeks 26 and 32 form grooves 48 and 50.
  • the strips 40 and 42 of the side cheeks 24 and 30 engage in the grooves 50 and 48 of the aligned side cheeks 26 and 32 of the other U-profile 20 and 18 a.
  • the grooves 48 and 50 are slightly narrowed at their opening by a longitudinal bead 52 and 54, respectively.
  • the strips 42 and 40 each have at their ends a longitudinal bead 56 and 58, respectively. The strips 42 and 40 can therefore be inserted only in the longitudinal direction of the end face in the grooves 48 and 50, as shown in Fig.2.
  • the two U-profiles are secured against pulling apart.
  • the strips 42 and 40 are held by the beads 52, 56 and 54, 58 in the grooves 48 and 50, respectively.
  • the grooves 48 and 50 are slightly lower than the height of the associated strips 42nd or, 40.
  • the two U-profiles 18 and 20 are held vertically in Fig. 1 with some play.
  • the electronic assembly has three printed circuit boards 60, 62 and 64.
  • the circuit boards carry electrical and electronic components whose specific nature and circuit in the present case for the invention are irrelevant and therefore not described in detail. These electrical and electronic components produce heat that must be dissipated through the housing.
  • cooling blocks 66 and 68 mounted.
  • the cooling blocks 66 and 68 have a cuboid shape.
  • the printed circuit board 64 is seated on the rear side, away from the printed circuit board, of the cooling block 68.
  • the printed circuit boards extend parallel to the side walls and between the middle parts 22 and 28 of the housing jacket.
  • the cooling blocks 66 and 68 extend parallel to the Side cheeks between the middle parts 22 and 28.
  • the cooling blocks 66 and 68 are precisely machined.
  • the height of the cooling blocks 66 and 68 between the end faces 70, 72 and 74, 76 is precisely defined. With these end faces 70, 72 and 74, 76, the cooling blocks 66 and 68 are connected to the middle parts 22 and 28 respectively.
  • the connection is made by screws 78, 80 and 82, 84th
  • cover 86 At the end faces, the housing is closed by cover 86, as shown in Figure 5.
  • the covers 86 secure the two U-profiles in the longitudinal direction and prevent them from being pulled apart, as shown in FIG.
  • the described construction simultaneously achieves various advantages:
  • the housing is manufactured from inexpensive extruded parts. By screwing these extrusions with the precisely dimensioned cooling blocks 66, 68 still accurate dimensions of the housing are guaranteed. Through the game between the U-profiles 18 and 20 a secure contact without an air gap between the U-profiles and the cooling blocks 66, 68 is ensured, so that the heat is dissipated safely through the housing.
  • the U-profiles 18 and 20 are provided on the outside with dovetail guides 86, 88, 90, 92, 94, 96, 98 and 100.
  • this dovetail guide By means of this dovetail guide, the housing thus formed can be supported by any structures interacting with the dovetail guides.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Claims (4)

  1. Boîtier destiné à des modules électroniques comportant des cartes à circuit imprimé (60,62,64) et des blocs de refroidissement (66,68) appliqués contre les cartes à circuit imprimé (60,62,64), caractérisé en ce que les parois latérales (10,12,14,16) du boîtier sont constituées de deux profilés en U extrudés (18,20) présentant chacun une partie centrale (22,28) et des flasques latéraux (24,26 ;30,32) pliés perpendiculairement à la partie centrale (22,28), les profilés en U (18,20) sont en prise l'un avec l'autre le long des bords longitudinaux (36,44 ;38,46) des flasques latéraux (30, 26 ;24,32) en laissant un jeu et les parties centrales (22,28) des profilés en U (18,20) sont raccordées aux faces frontales opposées (70,72 ;74,76) des blocs de refroidissement (66,68).
  2. Boîtier selon la revendication 1, caractérisé en ce que les profilés en U (18,20) sont conformés de façon à concorder et de manière asymétrique par rapport à leur plan central (34).
  3. Boîtier selon la revendication 1, caractérisé en ce que les profilés en U (18,20) présentent chacun le long d'un bord (38,44) d'un premier flasque latéral (26,32) une rainure (48,50) et le long du bord (44, 46) de l'autre second flasque latéral (24,30) un listeau (40,42), les profilés en U (18,20) décalés de 180° étant assemblés de telle façon que le listeau (40) sur un premier flasque latéral (24) d'un profilé en U (18) soit en prise avec la rainure (50) du second flasque latéral (32) de l'autre profilé en U (20), lequel est aligné sur ladite rainure et que le listeau (42) sur le premier flasque latéral (30) de l'autre profilé en U (20) soit en prise avec la rainure (48) du second flasque latéral (26) dudit un profilé en U (18), lequel est aligné sur cette dernière rainure.
  4. Boîtier selon l'une quelconque des revendications 1 à 3, caractérisé en ce que des guides en queue d'aronde (86,88,90,92,94,96,98,100) sont prévus sur les faces extérieures des profilés en U (18,20).
EP00116829A 1999-09-08 2000-08-04 Boîtier pour équipement électronique Expired - Lifetime EP1083781B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19942826 1999-09-08
DE19942826A DE19942826C1 (de) 1999-09-08 1999-09-08 Gehäuse für elektronische Baugruppen

Publications (3)

Publication Number Publication Date
EP1083781A2 EP1083781A2 (fr) 2001-03-14
EP1083781A3 EP1083781A3 (fr) 2001-09-26
EP1083781B1 true EP1083781B1 (fr) 2007-05-23

Family

ID=7921182

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00116829A Expired - Lifetime EP1083781B1 (fr) 1999-09-08 2000-08-04 Boîtier pour équipement électronique

Country Status (3)

Country Link
US (1) US6278612B1 (fr)
EP (1) EP1083781B1 (fr)
DE (2) DE19942826C1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6707670B2 (en) * 2001-09-12 2004-03-16 Dorsal Networks, Inc. Systems and methods for mounting devices
US20030064815A1 (en) * 2001-09-28 2003-04-03 Burnside John W. Removable power supply module and kit for a gaming machine
DE202014101849U1 (de) * 2014-04-17 2015-07-21 Weidmüller Interface GmbH & Co. KG Gehäuseanordnung
DE202019101972U1 (de) 2019-04-05 2019-04-17 Thomas Haug Sendergehäuse

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4027206A (en) * 1975-01-27 1977-05-31 L. H. Research Electronic cooling chassis
US4656559A (en) * 1984-05-10 1987-04-07 Ultima Electronics Ltd. Holder and heat sink for electronic components
FR2598585A1 (fr) * 1986-05-07 1987-11-13 Monnet Didier Boitier destine a supporter et proteger une installation comportant des composants electriques et/ou electroniques de puissance degageant de la chaleur et appareil realise avec un tel boitier
DE3841893A1 (de) * 1988-12-13 1990-06-21 Reinshagen Kabelwerk Gmbh Lastschaltmodul fuer kraftfahrzeuge
DE9213671U1 (de) * 1991-11-11 1992-12-03 Tridonic-Bauelemente GmbH, Dornbirn Gehäuse für eine elektronische Schaltungsanordnung
DE4242944C2 (de) * 1992-12-18 2002-04-25 Bosch Gmbh Robert Elektrisches Steuergerät
DE9308537U1 (de) * 1993-05-26 1993-08-12 Fahrzeugausrüstung Berlin GmbH, 12681 Berlin Schwingungsfestes Gehäuse für elektronische Baugruppen
US5999406A (en) * 1995-02-23 1999-12-07 Avid Technology, Inc. Dockable electronic equipment container
DE19700558C1 (de) * 1997-01-10 1998-06-25 Fischer Elektronik Gmbh & Co K Gehäuse für elektronische Bauteile
DE29712951U1 (de) * 1997-07-22 1998-11-19 bopla Gehäuse Systeme GmbH, 32257 Bünde Gehäuse zur Aufnahme von elektrischen oder elektronischen Bauelementen

Also Published As

Publication number Publication date
DE19942826C1 (de) 2001-02-08
EP1083781A3 (fr) 2001-09-26
US6278612B1 (en) 2001-08-21
EP1083781A2 (fr) 2001-03-14
DE50014340D1 (de) 2007-07-05

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