EP0108375B1 - Inspection method for electron beam engraved printing surfaces - Google Patents
Inspection method for electron beam engraved printing surfaces Download PDFInfo
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- EP0108375B1 EP0108375B1 EP83110891A EP83110891A EP0108375B1 EP 0108375 B1 EP0108375 B1 EP 0108375B1 EP 83110891 A EP83110891 A EP 83110891A EP 83110891 A EP83110891 A EP 83110891A EP 0108375 B1 EP0108375 B1 EP 0108375B1
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- Prior art keywords
- electron beam
- engraving
- electron
- checking
- engraved
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- 238000010894 electron beam technology Methods 0.000 title claims abstract description 36
- 238000007639 printing Methods 0.000 title claims abstract description 30
- 238000000034 method Methods 0.000 title claims description 11
- 238000007689 inspection Methods 0.000 title description 2
- 230000003068 static effect Effects 0.000 claims description 2
- 238000000386 microscopy Methods 0.000 claims 1
- 230000001360 synchronised effect Effects 0.000 claims 1
- 238000012545 processing Methods 0.000 description 9
- 239000000523 sample Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 150000002500 ions Chemical class 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 238000010884 ion-beam technique Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000001493 electron microscopy Methods 0.000 description 2
- 230000015654 memory Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 101100033673 Mus musculus Ren1 gene Proteins 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- CKHJYUSOUQDYEN-UHFFFAOYSA-N gallium(3+) Chemical compound [Ga+3] CKHJYUSOUQDYEN-UHFFFAOYSA-N 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004626 scanning electron microscopy Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012800 visualization Methods 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
- B41C1/00—Forme preparation
- B41C1/02—Engraving; Heads therefor
- B41C1/04—Engraving; Heads therefor using heads controlled by an electric information signal
- B41C1/05—Heat-generating engraving heads, e.g. laser beam, electron beam
Definitions
- the present invention relates to a method for checking electron beam-engraved printing form surfaces according to the patent claim.
- a separate control beam path is provided, which is directed onto a radiation receiver 19.
- a photoelectric converter is provided as the radiation receiver, which is followed by a display device, from the deflection of which a conclusion can be drawn directly about the state of focus of the electron beam. This signal can then be used to control the intensity of the machining beam.
- DE-A-2 354 323 discloses a method for producing an engraved printing surface and a device for carrying out the method, in which both an ion and an electron beam are proposed for engraving printing plate surfaces.
- the visualization of the engraved printing form surface by means of the electron beam generation system is not addressed there, but without special precautions, the disadvantageous effect of post-engraving when scanning the surface would also occur here.
- Applied Physics Letters, Volume 34, No. 5, March 1, 1975, pages 310-312 also discloses a method for first processing semiconductor surfaces and then checking them with electron microscopy using the same device.
- a liquid metal gallium ion source is used for the maskless doping of semiconductors.
- Such an ion source with low power is indeed suitable for the processing of semiconductor substrates and their electron microscopic examination, but not for the engraving of printing forms, since their performance is far from sufficient to e.g. B. Engrave a complete rotogravure cylinder made of copper, the surface of which should accommodate several newspaper pages, in one go.
- Some of these devices are suitable for the direct optical inspection of engraved surfaces, but not for the engraving of printing form surfaces, since special electron beam generation systems are required for this.
- the invention is based on the object of specifying a method for producing printing forms in which a simpler and more reliable control of the cells produced is possible with an electron beam generation system specially developed for the engraving of printing form surfaces.
- the beam will be reduced to approximately 1 I lm diameter than the mode engraving according to the invention.
- the beam undergoes an x and y deflection in order to scan the cell area to be displayed.
- the secondary electrons generated in this way are detected and used as a video signal to control a monitor.
- a great advantage of the present invention lies in the fact that no special optical control device or a separate electron beam microscope has to be provided, but that the electron beam gun, which is designed for material processing, enables the electron beam microscope operation during engraving pauses in a simple manner due to the present invention becomes.
- Electron beam microscopes are known per se, but electron beam microscopes in turn cannot be used or modified for material processing. With regard to the known electron beam microscopes, reference is made to the book by L. Reimer and G. Pfefferkorn, scanning electron microscopy, Springer Verlag Berlin, Heidelberg, New York 1977, Chapter 1 Introduction, pages 1, 2 and 3, in which, in FIG associated description of the circuitry for the detection of the secondary electrons and the connection of the 4 monitor is given.
- Figure 1 shows a pressure cylinder (1) with engraved cups (2), which have been produced by an electron beam (3).
- Such printing cylinders are used as printing forms in gravure printing, the cups, which have different volumes depending on the tonal value to be printed, are filled with printing ink during the printing process and the printing ink is transferred to the printing substrate during printing.
- FIG. 1 shows in detail the electron optics and the beam path of an electron beam generator, by means of which the invention can be carried out.
- the electron beam (3) goes from a heated cathode (4), which lies in a heating circuit (41), which has a voltage source V k (z. B. 6 volts).
- the beam passes through the Wehnelt cylinder (5) and the anode (6) and comes to a first lens system (7), which is shown in more detail in FIG. 2.
- the Wehnelt cylinder (5) is in the circuit (51) with the voltage source Vw (e.g. 100 volts) and the anode (6) in a circuit (61) with a voltage source Va for the anode voltage (5 to -50 KV ).
- an aperture diaphragm (8) is provided and the beam transmitted by the diaphragm passes through a deflection unit (9) and a second lens system (10) before it hits the engraving cylinder (1).
- the deflection unit (9) serves to move the deflection beam in a row over the wells (2) to be scanned. This scanning movement is carried out simultaneously by the electron beam (11) of a picture tube (12) by means of a second deflection unit (13).
- the corresponding deflection currents are generated in a raster generator (14), and the two deflection booklets (9) and (13) are connected to one another via a unit (15) for varying the magnification.
- FIG. 2 shows the electron beam generating system and the beam path for the various operating modes, engraving and microscope operation in more detailed form, the actual electron beam generating system comprising the cathode, Wehnelt and anode and the deflection coils being omitted for the sake of clarity.
- the first lens system (7) which brings about a first reduction, consists of two lenses (71) and (72), and a further lens (73) is provided inside the lens (71) for the engraving mode.
- three operating cases are explained on the basis of the drawn beam paths (30), (31) and (32), namely beam path (30), engraving of a large cell, beam path (31), engraving of a small cell and beam path (32), microscope operation.
- the lens system (71), (72) and (73) forms a variable reduction stage, the radiation source shown schematically being reduced 12 times when the lens is maximally tightened and 3 times when the lens (73) is not tightened.
- the aperture diaphragm 8 is dimensioned such that an angle ao of 0.08 rd is given, which results in an opening error disk of 25 ⁇ m in diameter.
- the lens (10) makes a 4-fold reduction, and the lens (101) serves to focus and defocus the beam, thereby producing cells.
- a processing effect occurs when the beam is focused, but not when the beam is defocused.
- the beam path (30) is set for engraving large cells, the beam having a diameter of approximately 100 ⁇ m at the point of impact and having a beam current in the processing spot of 50 mA.
- the beam path (31) is used to produce small cells.
- the beam has a diameter of about 20 ⁇ m at the point of impact and the current in the spot is 3 mA.
- the tonal value-dependent variation of the cell size is carried out by varying the tension of the dynamic lens (73).
- the deflection system (9) shown in FIG. 1 generates a beam entrainment for cylinder rotation, so that the beam always hits the same point when the cylinder is rotating.
- an acceleration voltage of 50 KV is used, and the beam emerging from the cathode has a current of approximately 50 mA.
- the dynamic lens (73) is switched off.
- the static lens (71) is more excited and the reduction in the radiation source is approximately 250.
- the lens (10) remains almost unchanged and the dynamic focus lens (101) is switched off.
- the probe diameter on the cylinder surface is 1 to 1.5 ⁇ m.
- the deflection system (9) shown in FIG. 1 is used to generate the scanning grid in accordance with the line and image frequency of the picture tube (12).
- the scanned field is approximately 1 mm 2 .
- a secondary electron detector (16) is provided for microscope operation, which is also pivoted in like the aperture (8 ') during microscope operation.
- the image of the well on the picture tube appears as if the wells were illuminated from the side, since the detector (16) is directed from one side towards the wells of the printing form surface and the electrons, which are on the inside of the detector opposite the Wells are reflected, give a better yield on the detector (16).
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
- Electron Beam Exposure (AREA)
- Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Description
Die vorliegende Erfindung betrifft ein Verfahren zur Kontrolle von elektronenstrahlgravierten Druckformoberflächen gemäß dem Patentanspruch.The present invention relates to a method for checking electron beam-engraved printing form surfaces according to the patent claim.
Es sind bereits Verfahren zur Herstellung von Druckformen mittels Elektronerstrahl bekannt, bei denen das Matenal der Druckformoberfläche mittels des Elektronenstrahls entfernt wird, siehe beispielsweise DD-A 55 965, in der das Prinzip Elektronenstrahlgravur beschrieben ist. Es ist aber wünschenswert, das Resultat der Gravur, d.h. die in die Druckformoberfläche eingravierten Näpfchen zu kontrollieren, d.h. sichtbar zu machen. Bei Geräten zur Materialbearbeitung, z. B. DE-B-1 099 695, ist zu diesem Zweck ein Stereomikroskop in dem elektronischen Strahlerzeuger eingebaut.Methods for producing printing forms by means of an electron beam are already known, in which the material of the printing form surface is removed by means of the electron beam, see for example DD-A 55 965, in which the principle of electron beam engraving is described. However, it is desirable to have the result of the engraving, i.e. to control the wells engraved on the printing form surface, i.e. make visible. For devices for material processing, e.g. B. DE-B-1 099 695, a stereomicroscope is installed in the electronic beam generator for this purpose.
Bei der DE-B-1 299 498 ist ein separater Kontrollstrahlengang vorgesehen, der auf einen Strahlungsempfänger 19 gerichtet ist. Als Strahlungsempfänger ist ein fotoelektrischer Wandler vorgesehen, dem ein Anzeigegerät nachgeschaltet ist, aus dessen Ausschlag direkt auf den Fokussierungszustand des Elektronenstrahls geschlossen werden kann. Dieses Signal kann dann zur Intensitätssteuerung des Bearbeitungsstrahls verwendet werden.In DE-B-1 299 498, a separate control beam path is provided, which is directed onto a radiation receiver 19. A photoelectric converter is provided as the radiation receiver, which is followed by a display device, from the deflection of which a conclusion can be drawn directly about the state of focus of the electron beam. This signal can then be used to control the intensity of the machining beam.
Aus dem Dokument US-A-3 881 108 ist eine lonen-Mikro-Prüfsonde bekannt, um Proben in Richtung von mit der Sonde geätzten Vertiefungen zu analysieren. Fig. 9 dieses Dokumentes zeigt den prinzipiellen Aufbau eines entsprechenden lonenstrahlerzeugers mit dem in eine Probe zuerst eine Oberflächenvertiefung geätzt und dann mit demselben lonenstrahlerzeugungssystem die geätzte Oberfläche der Probe elektronenmikroskopisch abgetastet und sichtbar gemacht wird, indem die dabei emittierten Sekundärionen mittels eines Massenspektrometers aufgefangen werden und einer Katodenstrahlröhre, deren Elektronenstrahl synchron mit der Abtastbewegung des lonenstrahls abgelenkt wird, steuern. Ein Nachteil dieser Anordnung besteht darin, daß auch während des Mikroskopbetriebes ein Ätzen der Probe stattfindet.From document US-A-3 881 108 an ion micro test probe is known for analyzing samples in the direction of wells etched with the probe. 9 of this document shows the basic structure of a corresponding ion beam generator with which a surface recess is first etched into a sample and then the etched surface of the sample is scanned and made visible by electron microscopy using the same ion beam generation system, by collecting the secondary ions emitted by means of a mass spectrometer and one Control the cathode ray tube, the electron beam of which is deflected in synchronism with the scanning movement of the ion beam. A disadvantage of this arrangement is that the sample is etched even during microscope operation.
Aus DE-A-2 354 323 ist ein Verfahren zur Herstellung einer gravierten Druckfläche und eine Vorrichtung zur Durchführung des Verfahrens bekannt, bei dem sowohl ein Ionen als auch ein Elektronenstrahl zur Gravur von Druckformoberflächen vorgeschlagen wird. Die Sichtbarmachung der gravierten Druckformoberfläche mittels des Elektronenstrahlerzeugungssystems ist dort zwar nicht angesprochen, aber ohne besondere Vorkehrungen würde auch hier der nachteilige Effekt einer Nachgravur beim Abtasten der Oberfläche auftreten. Aus Applied Physics Letters, Band 34, Nr. 5, 1 März 1975, Seiten 310-312 ist weiterhin ein Verfahren bekannt, um Halbleiteroberflächen zuerst zu bearbeiten und dann elektronenmikroskopisch mit derselben Einrichtung zu überprüfen.DE-A-2 354 323 discloses a method for producing an engraved printing surface and a device for carrying out the method, in which both an ion and an electron beam are proposed for engraving printing plate surfaces. The visualization of the engraved printing form surface by means of the electron beam generation system is not addressed there, but without special precautions, the disadvantageous effect of post-engraving when scanning the surface would also occur here. Applied Physics Letters, Volume 34, No. 5, March 1, 1975, pages 310-312 also discloses a method for first processing semiconductor surfaces and then checking them with electron microscopy using the same device.
Hierbei wird eine Flüssigmetall-Gallium-lonenquelle zum maskenlosen Dotieren von Halbleitern verwendet. Eine solche Ionenquelle mit geringer Leistung ist zwar für die Bearbeitung von Halbleitersubstraten und deren elektronenmikroskopische Untersuchung, aber nicht zur Gravur von Druckformen geeignet, da ihre Leistungsfähigkeit bei weitem nicht ausreicht, um z. B. einen kompletten Tiefdruckzylinder aus Kupfer, dessen Oberfläche mehrere Zeitungsseiten aufnehmen soll, in einem Zuge zu gravieren.A liquid metal gallium ion source is used for the maskless doping of semiconductors. Such an ion source with low power is indeed suitable for the processing of semiconductor substrates and their electron microscopic examination, but not for the engraving of printing forms, since their performance is far from sufficient to e.g. B. Engrave a complete rotogravure cylinder made of copper, the surface of which should accommodate several newspaper pages, in one go.
Einige dieser Einrichtungen sind zwar zur direkten optischen Kontrolle von gravierten Oberflächen, aber nicht zur Gravur von Druckformoberflächen geeignet, da hierzu besondere Elektronenstrahlerzeugungssysteme erforderlich sind.Some of these devices are suitable for the direct optical inspection of engraved surfaces, but not for the engraving of printing form surfaces, since special electron beam generation systems are required for this.
Der Erfindung liegt die Aufgabe zugrunde, ein Verfahren zum Herstellen von Druckformen anzugeben, bei dem eine einfachere und sichere Kontrolle der erzeugten Näpfchen mit einem speziell für die Gravur von Druckformoberflächen entwickelten Elektronenstrahlerzeugungssystem möglich wird.The invention is based on the object of specifying a method for producing printing forms in which a simpler and more reliable control of the cells produced is possible with an electron beam generation system specially developed for the engraving of printing form surfaces.
Die Erfindung erreicht dies durch die im Patentanspruch angegebenen Merkmale und wird wie folgt näher erläutert.The invention achieves this through the features specified in the patent claim and is explained in more detail as follows.
Um den Elektronenstrahlerzeuger zur Materialbearbeitung auf Elektronenstrahlmikroskop-Betrieb umzuschalten, wird erfindungsgemäß der Strahl auf ca. 1 Ilm Durchmesser gegenüber der Betriebsartgravur verkleinert. Außerdem erfährt der Strahl eine x- und y-Ablenkung, um den darzustellenden Näpfchenbereich abzutasten. Die dabei erzeugten Sekundärelektronen werden detektiert, und als Videosignal zur Ansteuerung eines Monitors verwendet.To switch the electron beam generator for material processing on electron microscope mode, the beam will be reduced to approximately 1 I lm diameter than the mode engraving according to the invention. In addition, the beam undergoes an x and y deflection in order to scan the cell area to be displayed. The secondary electrons generated in this way are detected and used as a video signal to control a monitor.
Ein großer Vorteil der vorliegenden Erfindung liegt darin, daß keine besondere optische Kontrolleinrichtung oder ein separates Elektronenstrahlmikroskop vorgesehen werden muß, sondern daß mit der Elektronenstrahlkanone, die für die Materialbearbeitung ausgelegt ist, aufgrund der vorliegenden Erfindung auf einfache Weise ein Elektronenstrahlmikroskop-Betrieb während der Gravurpausen ermöglicht wird. Elektronenstrahlmikroskope sind zwar an sich bekannt, aber Elektronenstrahlmikroskope wiederum können nicht zur Materialbearbeitung verwendet oder umgebaut werden. Bezüglich der bekannten Elektronenstrahlmikroskope wird auf das Buch von L. Reimer und G. Pfefferkorn, Raster-Elektronenmikroskopie, Springer Verlag Berlin, Heidelberg, New York 1977, Kapitel 1 Einführung, Seiten 1, 2 und 3 verwiesen, in dem in der Figur 1.1 mit dazugehöriger Beschreibung der schaltungstechnische Aufbau für die Detektion der Sekundärelektronen sowie des Anschlusses des'4Monitors angegeben ist.A great advantage of the present invention lies in the fact that no special optical control device or a separate electron beam microscope has to be provided, but that the electron beam gun, which is designed for material processing, enables the electron beam microscope operation during engraving pauses in a simple manner due to the present invention becomes. Electron beam microscopes are known per se, but electron beam microscopes in turn cannot be used or modified for material processing. With regard to the known electron beam microscopes, reference is made to the book by L. Reimer and G. Pfefferkorn, scanning electron microscopy, Springer Verlag Berlin, Heidelberg, New York 1977,
Bei der vorliegenden Erfindung wird von einem Elektronenstrahlerzeugungssystem ausgegangen, daß speziell für die Materialbearbeitung und Druckformherstellung entwickelt worden ist. Die Erfindung wird im folgenden anhand der Figuren 1 und 2 näher erläutert. Es zeigen:
Figur 1 den Aufbau einer Einrichtung zur Durchführung des Verfahrens undFigur 2 den Aufbau des Elektronenstrahlerzeugungssystems für Gravur- und Mikroskopbetrieb.
- Figure 1 shows the structure of a device for performing the method and
- Figure 2 shows the structure of the electron gun for engraving and microscope operation.
Figur 1 zeigt einen Druckzylinder (1) mit eingravierten Näpfchen (2), welche von einem Elektronenstrahl (3) hergestellt worden sind. Solche Druckzylinder werden als Druckformen im Tiefdruck verwendet, wobei beim Druckprozeß die Näpfchen, die je nach zu druckendem Tonwert unterschiedliches Volumen haben, mit Druckfarbe gefüllt und die Druckfarbe beim Drucken auf den Bedruckstoff übertragen wird.Figure 1 shows a pressure cylinder (1) with engraved cups (2), which have been produced by an electron beam (3). Such printing cylinders are used as printing forms in gravure printing, the cups, which have different volumes depending on the tonal value to be printed, are filled with printing ink during the printing process and the printing ink is transferred to the printing substrate during printing.
In Figur 1 sind im einzelnen die Elektronenoptik und der Strahlengang eines Elektronenstrahlerzeugers dargestellt, mittels dessen die Erfindung durchgeführt werden kann. Der Elektronenstrahl (3) geht von einer beheizten Kathode (4), welche in einem Heizstromkreis (41) liegt, der eine Spannungsquelle Vk (z. B. 6 Volt) aufweist. Der Strahl durchläuft den Wehnelt-Zylinder (5) und die Anode (6) und kommt zu einem ersten Linsensystem (7), das in Figur 2 näher dargestellt ist. Der Wehnelt-Zylinder (5) liegt im Stromkreis (51) mit der Spannungsquelle Vw (z. B. 100 Volt) und die Anode (6) in einem Stromkreis (61) mit einer Spannungsquelle Va für die Anodenspannung (5 bis -50 KV).FIG. 1 shows in detail the electron optics and the beam path of an electron beam generator, by means of which the invention can be carried out. The electron beam (3) goes from a heated cathode (4), which lies in a heating circuit (41), which has a voltage source V k (z. B. 6 volts). The beam passes through the Wehnelt cylinder (5) and the anode (6) and comes to a first lens system (7), which is shown in more detail in FIG. 2. The Wehnelt cylinder (5) is in the circuit (51) with the voltage source Vw (e.g. 100 volts) and the anode (6) in a circuit (61) with a voltage source Va for the anode voltage (5 to -50 KV ).
Weiterhin ist eine Aperturblende (8) vorgesehen und der von der Blende durchgelassene Strahl durchläuft eine Ablenkeinheit (9) und ein zweites Linsensystem (10), bevor er auf den Gravurzylinder (1) auftrifft. Die Ablenkeinheit (9) dient dazu, den Ablenkstrahl zeilenförmig über die abzutastenden Näpfchen (2) zu bewegen. Diese Abtastbewegung wird gleichzeitig vom Elektronenstrahl (11) einer Bildröhre (12) mittels einer zweiten Ablenkeinheit (13) durchgeführt. Die Erzeugung der entsprechenden Ablenkströme erfolgt in einem Rastergenerator (14), und die beiden Ablenkeinheften (9) und (13) sind über eine Einheit (15) zur Variation der Vergrößerung miteinander verbunden. Im Vakuum befindet sich seitlich der gravierten Näpfchen eine Sonde (16), welche die von der Druckformoberfläche ausgehenden Sekundärelektronen und reflektierten Elektronen auffängt und an einen Videoverstärker (17) weitergibt, von dem aus die Helligkeitssteuerung der Bildröhre (12) erfolgt. Das Abtastraster ist auf dem Bildschirm der Bildröhre (12) dargestellt.Furthermore, an aperture diaphragm (8) is provided and the beam transmitted by the diaphragm passes through a deflection unit (9) and a second lens system (10) before it hits the engraving cylinder (1). The deflection unit (9) serves to move the deflection beam in a row over the wells (2) to be scanned. This scanning movement is carried out simultaneously by the electron beam (11) of a picture tube (12) by means of a second deflection unit (13). The corresponding deflection currents are generated in a raster generator (14), and the two deflection booklets (9) and (13) are connected to one another via a unit (15) for varying the magnification. In the vacuum there is a probe (16) on the side of the engraved cell, which collects the secondary electrons and reflected electrons emanating from the printing form surface and passes them on to a video amplifier (17), from which the brightness control of the picture tube (12) takes place. The scanning grid is shown on the screen of the picture tube (12).
Figur 2 zeigt in detaillierterer Form das Elektronenstrahlerzeugungssystem und den Strahlengang für die verschiedenen Betriebsarten, Gravur- und Mikroskopbetrieb, wobei das eigentliche Elektronenstrahlerzeugungssystem aus Kathode, Wehnelt und Anode sowie die Ablenkspulen der Übersichtlichkeit halber weggelassen wurden. Das erste Linsensystem (7), das eine erste Verkleinerung herbeiführt, besteht in der Praxis aus zwei Linsen (71) und (72), und für die Betriebsart Gravur ist eine weitere Linse (73) innerhalb der Linse (71) vorgesehen. Im folgenden werden anhand der eingezeichneten Strahlengänge (30), (31) und (32) drei Betriebsfälle erläutert nämlich, Strahlengang (30), Gravur eines großen Näpfchens, Strahlengang (31), Gravur eines kleinen Näpfchens und Strahlengang (32), Mikroskopbetrieb.FIG. 2 shows the electron beam generating system and the beam path for the various operating modes, engraving and microscope operation in more detailed form, the actual electron beam generating system comprising the cathode, Wehnelt and anode and the deflection coils being omitted for the sake of clarity. In practice, the first lens system (7), which brings about a first reduction, consists of two lenses (71) and (72), and a further lens (73) is provided inside the lens (71) for the engraving mode. In the following, three operating cases are explained on the basis of the drawn beam paths (30), (31) and (32), namely beam path (30), engraving of a large cell, beam path (31), engraving of a small cell and beam path (32), microscope operation.
Das Linsensystem (71), (72) und (73) bildet eine variable Verkleinerungsstufe, wobei die schematisch dargestellte Strahlungsquelle bei maximaler Anspannung der Linse 12-mal und bei nicht angespannter Linse (73) 3-mal verkleinert wird. Die Aperturblende 8 wird so dimensioniert, daß ein Winkel ao von 0,08 rd gegeben ist, wodurch sich ein Öffnungsfehlerscheibchen von 25 µm Durchmesser ergibt. Die Linse (10) macht eine 4-fache Verkleinerung, und die Linse (101) dient zur Fokussierung und Defokussierung des Strahls, wodurch Näpfchen erzeugt werden. Bei fokussiertem Strahl tritt ein Bearbeitungseffekt auf, bei defokussiertem Strahl nicht. Wie bereits erwähnt, wird zur Gravur großer Näpfchen der Strahlengang (30) eingestellt, wobei der Strahl am Auftreffpunkt einen Durchmesser von etwa 100 µm hat und einen Strahlstrom im Bearbeitungsfleck von 50 mA aufweist.The lens system (71), (72) and (73) forms a variable reduction stage, the radiation source shown schematically being reduced 12 times when the lens is maximally tightened and 3 times when the lens (73) is not tightened. The
Der Strahlengang (31) dient zur Herstellung kleiner Näpfchen. Der Strahl hat am Auftreffpunkt einen Durchmesser von etwa 20 µm, und der Strom im Fleck beträgt 3 mA. Durch unterschiedliche Anspannung der dynamischen Linse (73) wird die tonwertabhängige Variation der Näpfchengröße vorgenommen.The beam path (31) is used to produce small cells. The beam has a diameter of about 20 µm at the point of impact and the current in the spot is 3 mA. The tonal value-dependent variation of the cell size is carried out by varying the tension of the dynamic lens (73).
Bei der Betriebsart Gravur erzeugt das in Figur 1 dargestellte Ablenksystem (9) eine Strahlmitführung zur Zylinderrotation, damit der Strahl bei rotierendem Zylinder immer auf die gleiche Stelle trifft.In the engraving mode, the deflection system (9) shown in FIG. 1 generates a beam entrainment for cylinder rotation, so that the beam always hits the same point when the cylinder is rotating.
Beim Gravurbetrieb und auch beim Mikroskopbetrieb wird mit einer Beschleunigungsspannung von 50 KV gearbeitet, und der aus der Kathode austretende Strahl hat eine Stromstärke von ca. 50 mA.In the engraving mode and also in the microscope mode, an acceleration voltage of 50 KV is used, and the beam emerging from the cathode has a current of approximately 50 mA.
Die dynamische Linse (73) ist abgeschaltet. Die statische Linse (71) ist stärker erregt, und die Verkleinerung der Strahlungsquelle beträgt ca. 250.The dynamic lens (73) is switched off. The static lens (71) is more excited and the reduction in the radiation source is approximately 250.
Es wird mit einer kleineren Aperturblende (8'), die in der Figur gestrichelt gezeichnet ist, gearbeitet, welche zu diesem Zweck in den Strahlengang geschwenkt wird. Die Apertur dieser Blende beträgt α1 = 0,025 rd. Dies ergibt ein Öffnungsfehlerscheibchen von ca. 1 µm.A smaller aperture diaphragm (8 '), which is shown in broken lines in the figure, is used, which is pivoted into the beam path for this purpose. The aperture of this aperture is α 1 = 0.025 rd. This results in an opening error disc of approx. 1 µm.
Die Linse (10) bleibt nahezu unverändert, und die dynamische Fokuslinse (101) ist abgeschaltet.The lens (10) remains almost unchanged and the dynamic focus lens (101) is switched off.
Durch diese Modifikation ergibt sich der Strahlengang (32), wobei die Linse (10) lediglich zur Scharfstellung dient. Der Sondendurchmesser auf der Zylinderoberfläche beträgt 1 bis 1,5 µm.This modification results in the beam path (32), the lens (10) only serving for focusing. The probe diameter on the cylinder surface is 1 to 1.5 µm.
Das in Figur 1 gezeigte Ablenksystem (9) dient zur Erzeugung des Abtastrasters entsprechend der Zeilen- und Bildfrequenz der Bildröhre (12). Das abgetastete Feld beträgt etwa 1 mm2. Wie in Figur 1 beschrieben, ist für den Mikroskopbetrieb ein Sekundärelektronendetektor (16) vorgesehen, der beim Mikroskopbetrieb ebenfalls wie die Blende (8') eingeschwenkt wird. Die Abbildung des Näpfchens auf der Bildröhre erscheint so, als ob die Näpfchen von der Seite beleuchtet worden seien, da der Detektor (16) von einer Seite her auf die Näpfchen der Druckformoberfläche gerichtet ist und die Elektronen, die auf der im Detektor gegenüberliegenden Innenseite der Näpfchen reflektiert werden, am Detektor (16) eine bessere Ausbeute ergeben.The deflection system (9) shown in FIG. 1 is used to generate the scanning grid in accordance with the line and image frequency of the picture tube (12). The scanned field is approximately 1 mm 2 . As described in FIG. 1, a secondary electron detector (16) is provided for microscope operation, which is also pivoted in like the aperture (8 ') during microscope operation. The image of the well on the picture tube appears as if the wells were illuminated from the side, since the detector (16) is directed from one side towards the wells of the printing form surface and the electrons, which are on the inside of the detector opposite the Wells are reflected, give a better yield on the detector (16).
Bei der Durchführung des Verfahrens kann mit stillstehenden Druckformzylindern gearbeitet werden, wobei die gesamte x- und y-Ablenkung für den Scan-Vorgang durch die Ablenksysteme des Elektronenstrahlerzeugungssystems erzeugt werden. Es liegt auch im Rahmen der Erfindung, daß die Abtastung der zu untersuchenden Näpfchen bei rotierendem Druckzylinder erfolgt. Hierbei wird ebenfalls der Elektronenstrahl feinfokussiert, und die sich durch die Drehung des Druckformzylinders und den Vorschub ergebenden einzelnen Bildlinien werden zwischengespeichert und ebenfalls zur Ansteuerung des Monitors benutzt. Solche Zwischenspeicher sind als Bildwiederholspeicher oder sogenannte Refresh-Memories bekannt.When carrying out the method, it is possible to work with stationary printing form cylinders, the entire x and y deflection for the scanning process being generated by the deflection systems of the electron gun. It is also within the scope of the invention that the scanning of the wells to be examined takes place with the printing cylinder rotating. Here, too, the electron beam is finely focused, and the individual image lines resulting from the rotation of the printing form cylinder and the feed are buffered and also used to control the monitor. Such buffers are known as refresh memories or so-called refresh memories.
Claims (1)
- A method for checking electron beam engraved printing block surfaces which are produced by means of an electron beam generating system, the engraving and checking being carried out by the same electron beam generating system, which has a first reduction stage (71, 72, 73) and a second reduction stage (10, 101) of which each comprises a dynamic lens (73 or 101) which are arranged respectively within a static lens (71, 10) as well as an aperture shutter (8) arranged between the two reduction systems, small cup-shaped depressions (2) being engraved into the printing block surface (1) during the engraving operation, the electron beam generator being operated in known manner as a screen electron microscope during the checking operation for checking the engraved small cups (2), by causing the electron beam (30, 31) to be switched over to microscopy operation with respect to its intensity and its deflection parameters, by deactivating the dynamic lenses (73 and 101) in the two reduction systems and by inserting a smaller aperture shutter (8') instead of the aperture shutter (8) utilised during the engraving operation and scanning the area of small cups which is to be depicted, obtaining a video signal by means of a secondary electron multiplier (16) from the secondary electrons generated by the beam for energising an electron beam tube (12) of a monitor and feeding said signal to the electron beam tube (12) which is synchronised with the electron beam generator with respect to its beam deflection, to make the small cups (2) visible.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AT83110891T ATE49534T1 (en) | 1982-11-04 | 1983-11-02 | METHOD OF INSPECTION OF ELECTRON BEAM ENGRAVED PRINTING FORM SURFACES. |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19823240653 DE3240653A1 (en) | 1982-11-04 | 1982-11-04 | METHOD FOR CONTROLLING PRINTING FORM SURFACES BY MEANS OF ELECTRON BEAM |
| DE3240653 | 1982-11-04 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP0108375A2 EP0108375A2 (en) | 1984-05-16 |
| EP0108375A3 EP0108375A3 (en) | 1987-04-01 |
| EP0108375B1 true EP0108375B1 (en) | 1990-01-17 |
Family
ID=6177236
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP83110891A Expired - Lifetime EP0108375B1 (en) | 1982-11-04 | 1983-11-02 | Inspection method for electron beam engraved printing surfaces |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US4549067A (en) |
| EP (1) | EP0108375B1 (en) |
| JP (2) | JPS5998848A (en) |
| AT (1) | ATE49534T1 (en) |
| DE (2) | DE3240653A1 (en) |
| SU (1) | SU1240347A3 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT386297B (en) * | 1985-09-11 | 1988-07-25 | Ims Ionen Mikrofab Syst | ION RADIATION DEVICE AND METHOD FOR CARRYING OUT CHANGES, IN PARTICULAR. REPAIRS ON SUBSTRATES USING AN ION RADIATOR |
| AT392857B (en) * | 1987-07-13 | 1991-06-25 | Ims Ionen Mikrofab Syst | DEVICE AND METHOD FOR INSPECTING A MASK |
| DE4031547A1 (en) * | 1990-10-05 | 1992-04-09 | Hell Rudolf Dr Ing Gmbh | METHOD AND DEVICE FOR PRODUCING TEXTURE ROLLERS |
| US5515182A (en) * | 1992-08-31 | 1996-05-07 | Howtek, Inc. | Rotary scanner |
| DE19840926B4 (en) * | 1998-09-08 | 2013-07-11 | Hell Gravure Systems Gmbh & Co. Kg | Arrangement for material processing by means of laser beams and their use |
| JP4178741B2 (en) * | 2000-11-02 | 2008-11-12 | 株式会社日立製作所 | Charged particle beam apparatus and sample preparation apparatus |
| DE102006032303B4 (en) * | 2006-07-11 | 2010-08-19 | Ellcie Maintenance Gmbh | Surface treatment device |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE55965C (en) * | AKTIENGESELLSCHAFT „FABRIK LEIPZIGER MUSIKWERKE", VORM. PAUL EHRLICH & Co. in Gohlis bei Leipzig | Drive device for mechanical musical works | ||
| DE1099659B (en) * | 1958-08-30 | 1961-02-16 | Zeiss Carl Fa | Shielding device |
| NL268860A (en) * | 1959-04-17 | |||
| DE1299498B (en) * | 1964-07-24 | 1969-07-17 | Steigerwald Strahltech | Device for monitoring the beam impact area in corpuscular beam processing devices |
| US3404254A (en) * | 1965-02-26 | 1968-10-01 | Minnesota Mining & Mfg | Method and apparatus for engraving a generally cross-sectionally circular shaped body by a corpuscular beam |
| JPS532599B2 (en) * | 1972-10-30 | 1978-01-30 | ||
| GB1410518A (en) * | 1972-10-30 | 1975-10-15 | Crosfield Electronics Ltd | Preparation of printing surfaces |
| US4041311A (en) * | 1976-07-12 | 1977-08-09 | Iowa State University Research Foundation, Inc. | Scanning electron microscope with color image display |
| JPS57132657A (en) * | 1981-02-06 | 1982-08-17 | Akashi Seisakusho Co Ltd | Inclined moving body tube type scanning electron microscope and its similar apparatus |
| JPS57135172A (en) * | 1981-02-13 | 1982-08-20 | Hell Rudolf Dr Ing Gmbh | Electron beam-working method |
-
1982
- 1982-11-04 DE DE19823240653 patent/DE3240653A1/en not_active Withdrawn
-
1983
- 1983-11-02 DE DE8383110891T patent/DE3381109D1/en not_active Expired - Lifetime
- 1983-11-02 EP EP83110891A patent/EP0108375B1/en not_active Expired - Lifetime
- 1983-11-02 AT AT83110891T patent/ATE49534T1/en not_active IP Right Cessation
- 1983-11-03 US US06/548,518 patent/US4549067A/en not_active Expired - Lifetime
- 1983-11-03 SU SU833663179A patent/SU1240347A3/en active
- 1983-11-04 JP JP58206069A patent/JPS5998848A/en active Pending
-
1992
- 1992-11-02 JP JP1992075919U patent/JPH088102Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP0108375A3 (en) | 1987-04-01 |
| JPS5998848A (en) | 1984-06-07 |
| US4549067A (en) | 1985-10-22 |
| EP0108375A2 (en) | 1984-05-16 |
| SU1240347A3 (en) | 1986-06-23 |
| DE3240653A1 (en) | 1984-05-10 |
| JPH088102Y2 (en) | 1996-03-06 |
| JPH067933U (en) | 1994-02-01 |
| DE3381109D1 (en) | 1990-02-22 |
| ATE49534T1 (en) | 1990-02-15 |
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