EP0028180A1 - Offset printing plates comprising a hydrophilic layer of a tin-copper alloy, especially of speculum - Google Patents
Offset printing plates comprising a hydrophilic layer of a tin-copper alloy, especially of speculum Download PDFInfo
- Publication number
- EP0028180A1 EP0028180A1 EP80401461A EP80401461A EP0028180A1 EP 0028180 A1 EP0028180 A1 EP 0028180A1 EP 80401461 A EP80401461 A EP 80401461A EP 80401461 A EP80401461 A EP 80401461A EP 0028180 A1 EP0028180 A1 EP 0028180A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- tin
- speculum
- aquaphile
- couche
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229910000597 tin-copper alloy Inorganic materials 0.000 title description 3
- 238000007645 offset printing Methods 0.000 title 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 26
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910052802 copper Inorganic materials 0.000 claims abstract description 18
- 239000010949 copper Substances 0.000 claims abstract description 18
- 150000001875 compounds Chemical class 0.000 claims abstract description 7
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 5
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 239000011651 chromium Substances 0.000 claims description 4
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910052793 cadmium Inorganic materials 0.000 claims description 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- 230000005660 hydrophilic surface Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 62
- 229910000831 Steel Inorganic materials 0.000 description 11
- 239000010959 steel Substances 0.000 description 11
- 229910045601 alloy Inorganic materials 0.000 description 10
- 239000000956 alloy Substances 0.000 description 10
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 241001080024 Telles Species 0.000 description 2
- 240000008042 Zea mays Species 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000005028 tinplate Substances 0.000 description 2
- 229910017755 Cu-Sn Inorganic materials 0.000 description 1
- 229910017927 Cu—Sn Inorganic materials 0.000 description 1
- YXLXNENXOJSQEI-UHFFFAOYSA-L Oxine-copper Chemical compound [Cu+2].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 YXLXNENXOJSQEI-UHFFFAOYSA-L 0.000 description 1
- 101000621511 Potato virus M (strain German) RNA silencing suppressor Proteins 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 238000009924 canning Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical class [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/04—Printing plates or foils; Materials therefor metallic
- B41N1/08—Printing plates or foils; Materials therefor metallic for lithographic printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/04—Printing plates or foils; Materials therefor metallic
- B41N1/08—Printing plates or foils; Materials therefor metallic for lithographic printing
- B41N1/10—Printing plates or foils; Materials therefor metallic for lithographic printing multiple
Definitions
- the present invention relates to new offset plates comprising, as aquaphile layer, a tin-copper alloy and more particularly speculum.
- the present invention relates to offset plates having a steel support and an aquaphile surface based on tin making it possible to resolve all or part of the difficulties encountered to date in this use of tin.
- the speculum is a known alloy which is based on copper and tin and which, according to the authors, can comprise approximately 60 to 55% of copper and approximately 40 to 45% of tin.
- This alloy has been mainly used to date to produce surfaces of various objects in which hardness was used surface, unalterability and also the appearance of the product (i.e. its color).
- the present invention therefore relates to offset plates having an aquaphile surface based on a tin-copper alloy comprising from 40 to 90% by weight of tin and from 10 to 60% by weight of copper and more especially offset plates with a speculum surface.
- the aquaphile surfaces according to the invention are tin-copper bimetallic surfaces, they may comprise a third constituent chosen from zinc, cobalt, nickel and cadmium. This third compound is present in relatively small amounts, less than 20%, and preferably less than 5%.
- the speculum layer deposited on a suitable support, will be covered by known means with an aquaphile metallic layer (for example chrome or tin-nickel) and said aquaphile layer will itself be coated.
- an aquaphile metallic layer for example chrome or tin-nickel
- a layer of an encrophilic metal and / or a layer of photosensitive resin for example chrome or tin-nickel
- the aquaphile alloys according to the invention can be deposited and cling firmly on numerous surfaces
- tinplate c ' that is, iron (or steel) whose surface has been covered with a very thin layer of tin or a tin-based alloy.
- tin iron
- Such a material (tin) is commonly used in particular in the canning industry.
- Example 1 Speculum deposit.
- each anode is supplied with a particular circuit which is for copper from 2 to 3 volts with an amperage of 0 A , 62 per dm 2 and for the tin circuit from 3 to 5 volts with an amperage of 1 A , 8 amps by dm 2 .
- the deposition rate of the speculum under these conditions is approximately 3 microns in 5 minutes.
- the speculum is covered with approximately 1.8 micron with a sensitive printing layer (layer PR12 from the company PCAS) on a spinner rotating at approximately 80 rpm.
- the layer is dried for 5 min in hot air and then in an oven.
- the plate After insolation, the plate is developed with the developer corresponding to the sensitive layer used. The soluble parts are eliminated thus exposing parts of the speculum. After rinsing the excess water is removed with a squeegee and a 3% solution of phosphoric acid is spread over the plate for 2 minutes. Then, after rinsing and drying, the plate is erased.
- plates A, B, C, D and E it is possible, in plates A, B, C, D and E, to replace the steel support with a support in stainless steel or in tinplate (that is to say steel covered with a thin layer of tin) or by an aluminum support suitably treated such as, for example, tinning.
- hydrophilic layer chromium
- another hydrophilic metallic layer such as, for example, a tin-nickel layer.
- the thicknesses of the speculum layer can be very variable depending on the conditions (support, function of the speculum layer, etc.); we can thus, in the case of layer intermediate in particular, having layers as thin as 0.005 microns and having layers up to 5 microns thick beyond which there is no appreciable gain in properties.
- the surface obtained is perfectly hydrophilic and encrophobic and the plate can be used as an offset plate (after coating with a suitable photosensitive layer).
- steel plates were coated with tin-copper bimetallic compounds.
- the hardness of the layer obtained was measured on the one hand and the hydrophilic nature (+) of said layer on the other hand.
Landscapes
- Printing Plates And Materials Therefor (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
- Chemically Coating (AREA)
Abstract
Description
La présente invention concerne de nouvelles plaques offset comportant comme couche aquaphile un alliage d'étain-cuivre et plus particulièrement du spéculum.The present invention relates to new offset plates comprising, as aquaphile layer, a tin-copper alloy and more particularly speculum.
On a déjà décrit le caractère aquaphile des surfaces d'étain et l'utilisation potentielle de ces surfaces dans la réalisation des plaques offset. Mais dans la pratique les plaques offset de ce type (c'est-à-dire avec une couche aquaphile constituée par de l'étain) n'ont jamais été commercialisées parce que :
- - d'une part, il est apparu difficile d'accrocher, sur les surfaces d'étain habituellement commercialisées, les couches encrophiles nécessaires,
- - d'autre part, l'étain se raye trop aisément par suite d'une dureté insuffisante.
- on the one hand, it appeared difficult to hang, on the tin surfaces usually sold, the necessary ink-absorbing layers,
- - on the other hand, the tin is scratched too easily due to insufficient hardness.
La présente invention concerne des plaques offset présentant un support en acier et une surface aquaphile à base d'étain permettant de résoudre tout ou partie des difficultés rencontrées jusqu'à ce jour dans cette utilisation de l'étain.The present invention relates to offset plates having a steel support and an aquaphile surface based on tin making it possible to resolve all or part of the difficulties encountered to date in this use of tin.
Il a été trouvé que,parmi les métaux que l'on peut incorporer à l'étain pour lui conférer une plus grande dureté superficielle, le cuivre est le métal préféré. Et il a été trouvé :
- - d'une part que les composés bimétalliques étain-cuivre contenant jusqu'à environ 45 à 55 % de cuivre peuvent très facilement être déposés sous forme de couches mates, ou semi-mates,
- - d'autre part, que malgré le caractère encrophile connu du cuivre les composés bimétalliques étain-cuivre contenant jusqu'à environ 45 à 60 % de cuivre conservent le caractère aquaphile et encrophobe de l'étain,
- - qu'enfin parmi les composés bimétalliques étain-cuivre utilisables le spéculum constituait le produit préféré de l'invention.
- on the one hand, that the tin-copper bimetallic compounds containing up to about 45 to 55% of copper can very easily be deposited in the form of matt or semi-matt layers,
- - on the other hand, that despite the known ink-absorbing nature of copper, the tin-copper bimetallic compounds containing up to approximately 45 to 60% of copper retain the aquaphile and encrophobic nature of tin,
- - Finally, among the tin-copper bimetallic compounds which can be used, the speculum constituted the preferred product of the invention.
Le spéculum est un alliage connu qui est à base de cuivre et d'étain et qui peut comporter selon les auteurs environ 60 à 55 % de cuivre et environ 40 à 45 % d'étain. Cet alliage a été essentiellement utilisé jusqu'à ce jour pour réaliser des surfaces d'objets divers dans lesquels on mettait en oeuvre la dureté superficielle, l'inaltérabilité et également l'aspect du produit (c'est-à-dire sa teinte).The speculum is a known alloy which is based on copper and tin and which, according to the authors, can comprise approximately 60 to 55% of copper and approximately 40 to 45% of tin. This alloy has been mainly used to date to produce surfaces of various objects in which hardness was used surface, unalterability and also the appearance of the product (i.e. its color).
La présente invention concerne donc les plaques offset présentant une surface aquaphile à base d'un alliage d'étain-cuivre comportant de 40 à 90 % en poids d'étain et de 10 à 60 % en poids de cuivre et plus spécialement les plaques offset présentant une surface en spéculum.The present invention therefore relates to offset plates having an aquaphile surface based on a tin-copper alloy comprising from 40 to 90% by weight of tin and from 10 to 60% by weight of copper and more especially offset plates with a speculum surface.
Lorsque les surfaces aquaphiles selon l'invention sont des surfaces bimétalliques étain-cuivre elles peuvent comporter un troisième constituant choisi parmi le zinc, le cobalt,le nickel et le cadmium. Ce troisième composé est présent en quantités relativement faibles, inférieures à 20 %, et de préférence inférieures à 5 %.When the aquaphile surfaces according to the invention are tin-copper bimetallic surfaces, they may comprise a third constituent chosen from zinc, cobalt, nickel and cadmium. This third compound is present in relatively small amounts, less than 20%, and preferably less than 5%.
Mais l'alliage préféré utilisé selon l'invention est le spéculum. Cet alliage possède en effet toute une série de propriétés hautement souhaitables dans l'emploi dudit alliage sur des plaques offset; ces propriétés sont essentiellement :
- - une dureté superficielle suffisante pour l'application visée,
- - un aspect de surface (matité) appréciable
- - une bonne compatibilité avec les couches métalliques et éventuellement organiques que l'on peut employer dans l'application visée,
- - une résistance remarquable aux solutions de morsures généralement utilisées dans cette industrie,
- - un potentiel qui est voisin de zéro,
- - et une aptitude certaine à "prendre l'eau" et à repousser l'encre.
- - sufficient surface hardness for the intended application,
- - an appreciable surface appearance (mattness)
- - good compatibility with the metallic and possibly organic layers which can be used in the intended application,
- - remarkable resistance to bite solutions generally used in this industry,
- - a potential which is close to zero,
- - and a certain ability to "take the water" and repel the ink.
La couche de spéculum aquaphile peut être utilisée de deux façons :
- a) On peut tout d'abord l'utiliser comme couche aquaphile c'est-à-dire comme couche qui, lors de l'emploi de la plaque pour effectuer les impressions, prendra l'eau et "ne prendra pas l'encre". Pour réaliser une plaque offset de ce type la couche de spéculum, déposée sur un support convenable, sera recouverte, grâce à des moyens connus, par une couche d'un métal (ou d'un alliage) encrophile connu (par exemple du cuivre) ou par une couche d'une résine photosensible également connue.
- b) Mais on peut également et de préférence utiliser cette couche de spéculum comme sous-couche d'une couche métallique aquaphile. Ainsi on pourra déposer sur la couche de spéculum une couche de chrome ou une couche d'étain-nickel. Dans une telle réalisation la couche qui, lors de l'emploi de la plaque pour effectuer les impressions, prendra l'eau ne sera pas la couche de spéculum mais la couche aquaphile qui la recouvre. Cependant le caractère aquaphile de la couche de spéculum pourra, même dans une telle application, avoir une importance très grande car il sera possible de déposer, sur ladite couche de spéculum, une couche très mince de métal aquaphile. On conçoit en effet que, même dans l'hypothèse où la couche de métal aquaphile superficiel serait soit "poreuse" soit imparfaite, le caractère aquaphile de cette partie de la surface de la plaque offset serait assuré. Dans cette deuxième possibilité d'utilisation où le spéculum est utilisé comme sous-couche d'une couche métallique aquaphile, on apprécie également d'une part la propriété du spéculum de pouvoir avoir un aspect mat (aspect qui se retrouve à la surface de la couche métallique aquaphile déposée sur le spéculum) et d'autre part la propriété du spéculum de résister aux solutions de morsures utilisées notamment lors de l'emploi des plaques bimétalliques.
- a) It can first of all be used as an aquaphile layer, that is to say as a layer which, when the plate is used to make the prints, will take on water and "will not take ink ". To make an offset plate of this type, the layer of speculum, deposited on a suitable support, will be covered, by known means, with a layer of a metal (or an alloy) known encrophile (for example copper) or by a layer of a also known photosensitive resin.
- b) However, it is also possible and preferably to use this layer of speculum as a sublayer of an aquaphile metallic layer. Thus, a layer of chromium or a layer of tin-nickel can be deposited on the speculum layer. In such an embodiment, the layer which, when the plate is used to make the prints, will take up water will not be the speculum layer but the aquaphile layer which covers it. However, the aquaphile character of the speculum layer may, even in such an application, be of great importance since it will be possible to deposit, on said speculum layer, a very thin layer of aquaphile metal. It is in fact understood that, even if the surface aquaphile metal layer is either "porous" or imperfect, the aquaphile character of this part of the surface of the offset plate would be ensured. In this second possibility of use where the speculum is used as an undercoat of an aquaphile metallic layer, we also appreciate on the one hand the property of the speculum of being able to have a matt appearance (aspect which is found on the surface of the aquaphile metallic layer deposited on the speculum) and on the other hand the property of the speculum to resist the bite solutions used in particular when using bimetallic plates.
Pour réaliser une plaque offset de ce type la couche de spéculum, déposée sur un support convenable, sera recouverte grâce à des moyens connus d'une couche métallique aquaphile (par exemple chrome ou étain-nickel) et ladite couche aquaphile sera elle-même revêtue d'une couche d'un métal encrophile et/ou d'une couche de résine photosensible.To make an offset plate of this type, the speculum layer, deposited on a suitable support, will be covered by known means with an aquaphile metallic layer (for example chrome or tin-nickel) and said aquaphile layer will itself be coated. a layer of an encrophilic metal and / or a layer of photosensitive resin.
Bien que les alliages aquaphiles selon l'invention, et notamment le spéculum, peuvent être déposés et s'accrocher fermement sur de nombreuses surfaces il est particulièrement intéressant de mettre en oeuvre la présente invention en utilisant, comme support, du fer-blanc c'est-à-dire du fer (ou de l'acier) dont la surface a été recouverte d'une très mince couche d'étain ou d'un alliage à base d'étain. Un tel matériau (fer-blanc) est couramment utilisé notamment dans l'industrie de la conserve.Although the aquaphile alloys according to the invention, and in particular the speculum, can be deposited and cling firmly on numerous surfaces, it is particularly advantageous to practice the present invention using, as support, tinplate c ' that is, iron (or steel) whose surface has been covered with a very thin layer of tin or a tin-based alloy. Such a material (tin) is commonly used in particular in the canning industry.
Les exemples non limitatifs suivants illustrent l'invention.The following nonlimiting examples illustrate the invention.
Des bains d'électrolyse actuellement connus pour le dépôt du spéculum sont décrits dans la littérature; leurs principales caractéristiques sont les suivantes :
- a) composition (moyenne) étain 40 g/1
- cuivre 8 g/1
- cyanure libre 16 g/1
- soude caustique libre 15 g/1.
- b) conditions opératoires
- a) composition (medium) tin 40 g / 1
- copper 8 g / 1
- free cyanide 16 g / 1
- free caustic soda 15 g / 1.
- b) operating conditions
On opère à une température de l'ordre de 65°C; les anodes sont d'une part en cuivre électrolytique et d'autre part en étain pur; chaque anode est alimentée en un circuit particulier qui est pour le cuivre de 2 à 3 volts avec un ampérage de 0 A,62 par dm2 et pour le circuit d'étain de 3 à 5 volts avec un ampérage de 1A,8 ampères par dm2. La vitesse de dépôt du spéculum dans ces conditions est d'environ 3 microns en 5 minutes.We operate at a temperature of about 65 ° C; the anodes are on the one hand of electrolytic copper and on the other hand of pure tin; each anode is supplied with a particular circuit which is for copper from 2 to 3 volts with an amperage of 0 A , 62 per dm 2 and for the tin circuit from 3 to 5 volts with an amperage of 1 A , 8 amps by dm 2 . The deposition rate of the speculum under these conditions is approximately 3 microns in 5 minutes.
Sur une plaque en acier USINOR on dépose, après dégraissage, rinçage, décapage et à nouveau rinçage,une couche de 3 microns d'épaisseur de spéculum (58 % en cuivre et 42 % en étain) en utilisant le bain décrit ci-dessus; la couche de spéculum a une apparence mate et laiteuse.On a USINOR steel plate, after degreasing, rinsing, pickling and rinsing again, a layer 3 microns thick of speculum (58% copper and 42% tin) is used using the bath described above; the speculum layer has a dull, milky appearance.
Après rinçage et séchage le spéculum est recouvert de 1,8 micron environ d'une couche sensible imprimante (couche PR12 de la Société PCAS) sur une tournette tournant à environ 80 tr/min. On sèche la couche pendant 5 min à l'air chaud puis dans une étuve.After rinsing and drying, the speculum is covered with approximately 1.8 micron with a sensitive printing layer (layer PR12 from the company PCAS) on a spinner rotating at approximately 80 rpm. The layer is dried for 5 min in hot air and then in an oven.
Aprèsinsolation la plaque est développée avec le révélateur correspondant à la couche sensible utilisée. Les parties solubles sont éliminées mettant ainsi des parties de spéculum à nu. Après rinçage l'excès d'eau est chassé avec une raclette et on répand sur la plaque pendant 2 minutes une solution à 3 % d'acide phosphorique. Puis, après rinçage et séchage,la plaque est gommée.After insolation, the plate is developed with the developer corresponding to the sensitive layer used. The soluble parts are eliminated thus exposing parts of the speculum. After rinsing the excess water is removed with a squeegee and a 3% solution of phosphoric acid is spread over the plate for 2 minutes. Then, after rinsing and drying, the plate is erased.
Cette plaque utilisée sur machine n'a graissé à aucun moment et était encore utilisable après plus de 10.000 exemplaires.This plate used on machine never greased and was still usable after more than 10,000 copies.
Selon la même technique que celle décrite ci-dessus (pour ce qui concerne le dépôt de la couche de spéculum) on a réalisé les plaques suivantes :
- A) Acier (support)
- Spéculuml,9microns (couche hydrophile)
- Couche sensible imprimante
- B) Acier (support)
- Spéculum 2,5 microns (couche hydrophile)
- Cuivre 0,09 micron (couche intermédiaire de protection)
- Couche sensible imprimante
- C) Acier (support)
- Spéculum 2,5 microns (couche hydrophile)
- Cuivre 2,5 microns (couche encrophile)
- D) Acier (support)
- Spéculum 1,5 microns (couche intermédiaire)
- Chrome 0,5 micron (couche hydrophile)
- Couche sensible imprimante
- E) Acier (support)
- Spéculum 1 microns (couche intermédiaire)
- Chrome 1 micron (couche hydrophile)
- Cuivre 0,09 (couche intermédiaire)
- Couche sensible imprimante.
- A) Steel (support)
- Speculuml, 9microns (hydrophilic layer)
- Printer sensitive layer
- B) Steel (support)
- 2.5 micron speculum (hydrophilic layer)
- 0.09 micron copper (intermediate protective layer)
- Printer sensitive layer
- C) Steel (support)
- 2.5 micron speculum (hydrophilic layer)
- 2.5 micron copper (ink coating)
- D) Steel (support)
- 1.5 micron speculum (middle layer)
- 0.5 micron chromium (hydrophilic layer)
- Printer sensitive layer
- E) Steel (support)
- 1 micron speculum (middle layer)
- Chrome 1 micron (hydrophilic layer)
- 0.09 copper (middle layer)
- Printer sensitive layer.
On peut, dans les plaques A, B, C, D et E, remplacer le support en acier par un support en acier inoxydable ou en fer-blanc (c'est-à-dire en acier recouvert d'une mince couche d'étain) ou par un support en aluminium convenablement traité comme, par exemple, par étamage.It is possible, in plates A, B, C, D and E, to replace the steel support with a support in stainless steel or in tinplate (that is to say steel covered with a thin layer of tin) or by an aluminum support suitably treated such as, for example, tinning.
Dans les plaques D et E la couche hydrophile (chrome) peut être remplacée par une autre couche métallique hydrophile telle que, par exemple, une couche d'étain-nickel.In plates D and E the hydrophilic layer (chromium) can be replaced by another hydrophilic metallic layer such as, for example, a tin-nickel layer.
Les épaisseurs de la couche de spéculum peuvent être très variables selon les conditions (support, fonction de la couche de spéculum...); on peut ainsi, dans le cas de couche intermédiaire notamment, avoir des couches d'épaisseur aussi faible qne 0,005 micron et avoir des couches jusqu'à 5 microns d'épaisseur au-delà de laquelle n'apparaît aucun gain appréciable des propriétés.The thicknesses of the speculum layer can be very variable depending on the conditions (support, function of the speculum layer, etc.); we can thus, in the case of layer intermediate in particular, having layers as thin as 0.005 microns and having layers up to 5 microns thick beyond which there is no appreciable gain in properties.
A l'aide d'un bain connu à base de cyanure, de cuivre et d'étain (bain contenant également notamment des pyrophosphates de potassium et du cyanure de potassium) on a déposé sur une plaque en acier à surface satinée un alliage contenant environ 60 % d'étain et 40 % de cuivre.Using a known bath based on cyanide, copper and tin (bath also containing in particular potassium pyrophosphates and potassium cyanide), an alloy containing approximately 60% tin and 40% copper.
La surface obtenue est parfaitement hydrophile et encrophobe et la plaque peut être utilisée comme plaque offset (après enduction par une couche photosensible convenable).The surface obtained is perfectly hydrophilic and encrophobic and the plate can be used as an offset plate (after coating with a suitable photosensitive layer).
Selon la même technique du dépôt électrolytique on a revêtu des plaques d'acier à l'aide de composés bimétalliques étain-cuivre.According to the same electroplating technique, steel plates were coated with tin-copper bimetallic compounds.
On a mesuré d'une part la dureté de la couche obtenue et d'autre part le caractère hydrophile (+) de ladite couche.The hardness of the layer obtained was measured on the one hand and the hydrophilic nature (+) of said layer on the other hand.
Les résultats sont présentés dans le tableau ci-après :
Il semble que, compte tenu de ce que le caractère aquaphile de la couche bimétallique doive être très net et très sûr, on puisse utiliser des alliages Cu-Sn contenant jusqu'à environ 40 % en poids d'étain.It seems that, taking into account that the aquaphile character of the bimetallic layer must be very clear and very safe, it is possible to use Cu-Sn alloys containing up to about 40% by weight of tin.
Claims (4)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7925605 | 1979-10-15 | ||
| FR7925605A FR2467087A1 (en) | 1979-10-15 | 1979-10-15 | Offset printing plate having tin-copper alloy layer - giving high hardness, hydrophilicity and ink-repellency |
| FR7928622A FR2470009A1 (en) | 1979-11-20 | 1979-11-20 | Offset printing plate having tin-copper alloy layer - giving high hardness, hydrophilicity and ink-repellency |
| FR7928622 | 1979-11-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP0028180A1 true EP0028180A1 (en) | 1981-05-06 |
Family
ID=26221392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP80401461A Withdrawn EP0028180A1 (en) | 1979-10-15 | 1980-10-13 | Offset printing plates comprising a hydrophilic layer of a tin-copper alloy, especially of speculum |
Country Status (1)
| Country | Link |
|---|---|
| EP (1) | EP0028180A1 (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE243663C (en) * | ||||
| NL58534C (en) * | 1900-01-01 | |||
| FR498598A (en) * | 1919-04-24 | 1920-01-15 | Mumford Ltd Ag | Improvements in the manufacture of metal alloys and their use |
| DE1965231A1 (en) * | 1969-02-19 | 1970-09-10 | Svu Materialu | Pressure measuring probe arrangement for compacted material |
| FR2098784A5 (en) * | 1970-07-28 | 1972-03-10 | Kodak Pathe | Lithographic plate prepn - by treatment of copper plate with ferrocyanide ions |
| FR2417795A1 (en) * | 1978-02-15 | 1979-09-14 | Rhone Poulenc Graphic | NEW LITHOGRAPHIC PLATE SUPPORT AND IMPLEMENTATION PROCESS |
-
1980
- 1980-10-13 EP EP80401461A patent/EP0028180A1/en not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE243663C (en) * | ||||
| NL58534C (en) * | 1900-01-01 | |||
| FR498598A (en) * | 1919-04-24 | 1920-01-15 | Mumford Ltd Ag | Improvements in the manufacture of metal alloys and their use |
| DE1965231A1 (en) * | 1969-02-19 | 1970-09-10 | Svu Materialu | Pressure measuring probe arrangement for compacted material |
| FR2098784A5 (en) * | 1970-07-28 | 1972-03-10 | Kodak Pathe | Lithographic plate prepn - by treatment of copper plate with ferrocyanide ions |
| FR2417795A1 (en) * | 1978-02-15 | 1979-09-14 | Rhone Poulenc Graphic | NEW LITHOGRAPHIC PLATE SUPPORT AND IMPLEMENTATION PROCESS |
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