EP0098343A2 - Erwärmung von metallischen Substraten durch Laserstrahlen - Google Patents
Erwärmung von metallischen Substraten durch Laserstrahlen Download PDFInfo
- Publication number
- EP0098343A2 EP0098343A2 EP83101764A EP83101764A EP0098343A2 EP 0098343 A2 EP0098343 A2 EP 0098343A2 EP 83101764 A EP83101764 A EP 83101764A EP 83101764 A EP83101764 A EP 83101764A EP 0098343 A2 EP0098343 A2 EP 0098343A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- substrate
- inches
- disk substrate
- cms
- melting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 41
- 229910001092 metal group alloy Inorganic materials 0.000 title claims description 4
- 238000005224 laser annealing Methods 0.000 title 1
- 230000007547 defect Effects 0.000 claims abstract description 18
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 9
- 238000005498 polishing Methods 0.000 claims abstract description 7
- 238000010438 heat treatment Methods 0.000 claims abstract description 6
- 238000002844 melting Methods 0.000 claims description 18
- 230000008018 melting Effects 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 12
- 229910000861 Mg alloy Inorganic materials 0.000 claims description 5
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 2
- 239000011777 magnesium Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 230000003993 interaction Effects 0.000 description 5
- 230000009466 transformation Effects 0.000 description 5
- 230000035939 shock Effects 0.000 description 4
- 239000002344 surface layer Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 238000001000 micrograph Methods 0.000 description 3
- 230000035515 penetration Effects 0.000 description 3
- 238000009834 vaporization Methods 0.000 description 3
- 229910001282 5086 aluminium alloy Inorganic materials 0.000 description 2
- GANNOFFDYMSBSZ-UHFFFAOYSA-N [AlH3].[Mg] Chemical compound [AlH3].[Mg] GANNOFFDYMSBSZ-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910018084 Al-Fe Inorganic materials 0.000 description 1
- 229910018134 Al-Mg Inorganic materials 0.000 description 1
- 229910018192 Al—Fe Inorganic materials 0.000 description 1
- 229910018467 Al—Mg Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000009533 lab test Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F3/00—Changing the physical structure of non-ferrous metals or alloys by special physical methods, e.g. treatment with neutrons
Definitions
- This invention relates to a method of improving the microstructure homogeneity of a metallic alloy disk substrate having second phase defects on the surface thereof.
- shock hardening uses extremely high power densities and short interaction times to produce a metal vapour cloud which leaves the metal surface with a high enough velocity to create a shock wave at the metal surface.
- Hole drilling uses a laser to produce holes in materials by vapourization of the substrate by the laser beam.
- Deep penetration welding uses a moderate power density and a moderate interaction time to produce deep melting in metal articles to be joined. The melting is usually accompanied by the formation of a hollow cavity which is filled with plasma and metal vapour.
- transformation hardening is performed at low power densities and long interaction times.
- Shock hardening and hole drilling are usually performed using pulsed lasers since pulsed lasers are the most reasonable way to achieve the desired combination of power density and interaction time.
- Deep penetration welding and transformation hardening are usually performed using a continuous laser and the interaction time is controlled by sweeping the laser beam over the area to be welded or hardened.
- the region of the present invention is shown as "skin melting". This region is bounded on one side by conditions where surface vapourization will occur and on the other side by conditions where surface melting will occur. Transformation hardening is performed at conditions where surface melting will not occur while shock hardening, hole drilling and deep penetration welding all involve a significant amount of surface vapourization.
- U.S. 4,122,240 discloses the melting of a metal surface layer by a high energy source such as a laser to produce metallurgical changes in the surface. This patent does not teach any subsequent polishing of a surface made more homogeneous by melting.
- a method of improving the microstructure homogeneity of a metallic alloy disk substrate having second phase defects on the surface thereof characterised in that the method comprises the steps of rotating said disk substrate at a predetermined velocity, heating said rotating substrate with a laser beam to melt said substrate surface including said second phase defects, whereby said melted second phase defects are diffused into said melted surface to produce a single phase layer on said substrate surface, and polishing said single phase surface to produce an essentially defect-free surface.
- the present invention is applicable for use with aluminium alloy disk substrates which contain second phase defects therein.
- An example is an aluminium-magnesium alloy containing second phase defects of other material.
- the present invention employs a high energy source to first melt the surface layer of an aluminium substrate including melting the second phase defects thereon. The melted second phase defects diffuse into the surrounding melted material and the cooling is such that the second phase defect material can not reform the substrate surface. This produces a single phase layer which makes the substrate surface more homogeneous. This is followed by a polishing process of the cooled surface to produce a highly polished, essentially defect-free surface without changing the bulk properties of the substrate.
- the present invention is particularly adapted for use in the fabrication of metallic substrates which are to be used as substrates for magnetic recording disks.
- Such substrates especially those intended for use with thin film magnetic recording layers thereon produced by some type of evaporative technique, require a very smooth surface.
- the nature of the aluminium alloys used for these substrates is such that they usually contain second phase defects which render their topography inhomogeneous. Such inhomogeneities remain in the surface of present substrates, even after efforts to remove them, such as by machining, polishing, grinding, etc.
- such substrates are first subjected to annealing by a high energy source such as a laser to melt the outer layer of the substrate surface.
- a high energy source such as a laser to melt the outer layer of the substrate surface.
- This melting melts both the regular aluminium alloy on the surface as well as any second phase defects present thereon.
- the second phase defects diffuse into the surrounding melted.aluminium alloy, and because of the rapid cooling after melting, these second phase defects do not reform on the substrate surface.
- the surface layer is a single phase layer.
- the circular substrate is rotated while the laser scans the rotating disk to produce the desired heating.
- the heating is carried out in the presence of an inert gas, primarily to prevent plasma formation, which tends to reflect incident energy from the surface to be heated and to defocus the laser beam.
- a coupon of an aluminium magnesium alloy having a thickness of 0.381 cms (0.150 inches) and identified as 5086 Al-Mg was moved at a linear velocity of 2.54 cms (1 inch)/second while a 500 watt pulsed Co 2 layer scanned the coupon surface. After treating the entire coupon surface, the annealed surface was polished to remove about .0025 cms (.001 inch) of the melted/solidified layer.
- Comparison of microphotographs of the coupon surface before and after the annealing and polishing treatment of this invention showed a significant improvement in the quality of surface finish.
- the resulting surface was essentially defect-free and showed a smooth single phase layer extending some distance into the coupon.
- Cross-sectional microphotographs showed a melting of approximately the upper 0.005 inches of the substrate material.
- a disk 35.56 cms (14 inches) in diameter with a thickness of 0.381 cms (0.150 inch) and composed of the 5086 aluminium alloy was rotated at a maximum velocity of 25.4 cms (10 inches)/second while being scanned radially by a continuous wave Co 2 laser having a maximum output of 4.4 kw. Following this, the annealed layer was polished. Again, microphotographs of the surface before and after treatment in accordance with the present invention showed a major improvement in the homogeneity of the surface.
- the figure is a graph illustrating the surface melt depth as a function of the linear velocity of rotation of the disk substrate for different levels of applied laser power.
- the shaded area from a linear velocity of 25.4 cms (10 inches)/second and lower represents the operating area for carrying out the present invention, since as indicated above, higher velocities than 25.4 cms (10 inches)/second can result in undesirable micro-voids and micro-cracks in the treated layer. As would be expected, higher levels of laser power result in greater melt depth for a given linear velocity.
Landscapes
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Heat Treatment Of Nonferrous Metals Or Alloys (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US39325582A | 1982-06-29 | 1982-06-29 | |
| US393255 | 1982-06-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP0098343A2 true EP0098343A2 (de) | 1984-01-18 |
| EP0098343A3 EP0098343A3 (de) | 1985-01-23 |
Family
ID=23553947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP83101764A Withdrawn EP0098343A3 (de) | 1982-06-29 | 1983-02-23 | Erwärmung von metallischen Substraten durch Laserstrahlen |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP0098343A3 (de) |
| JP (1) | JPS599158A (de) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0942075A1 (de) * | 1998-03-09 | 1999-09-15 | Hans u. Ottmar Binder GbR | Verfahren zur Oberfächenbehandlung von Aluminium, Aluminiumlegierungen, Magnesium oder Magnesiumlegierungen |
| US7622374B2 (en) | 2005-12-29 | 2009-11-24 | Infineon Technologies Ag | Method of fabricating an integrated circuit |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1095387A (en) * | 1976-02-17 | 1981-02-10 | Conrad M. Banas | Skin melting |
| CA1067256A (en) * | 1976-02-17 | 1979-12-04 | Bernard H. Kear | Skin melted articles |
| US4151014A (en) * | 1977-05-31 | 1979-04-24 | Western Electric Company, Inc. | Laser annealing |
| JPS5451919A (en) * | 1977-10-03 | 1979-04-24 | Toshiba Corp | Method of hardening surface of metallic body with high melting point |
-
1983
- 1983-02-23 EP EP83101764A patent/EP0098343A3/de not_active Withdrawn
- 1983-04-20 JP JP6852583A patent/JPS599158A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0942075A1 (de) * | 1998-03-09 | 1999-09-15 | Hans u. Ottmar Binder GbR | Verfahren zur Oberfächenbehandlung von Aluminium, Aluminiumlegierungen, Magnesium oder Magnesiumlegierungen |
| US7622374B2 (en) | 2005-12-29 | 2009-11-24 | Infineon Technologies Ag | Method of fabricating an integrated circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS599158A (ja) | 1984-01-18 |
| EP0098343A3 (de) | 1985-01-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
| AK | Designated contracting states |
Designated state(s): DE FR GB |
|
| 17P | Request for examination filed |
Effective date: 19840426 |
|
| PUAL | Search report despatched |
Free format text: ORIGINAL CODE: 0009013 |
|
| AK | Designated contracting states |
Designated state(s): DE FR GB |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
| 18D | Application deemed to be withdrawn |
Effective date: 19850724 |
|
| RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: LIN, FLOSSIE LI-SHENG |