EP0048579A1 - Method for the electro-deposition of lead alloys - Google Patents
Method for the electro-deposition of lead alloys Download PDFInfo
- Publication number
- EP0048579A1 EP0048579A1 EP81304194A EP81304194A EP0048579A1 EP 0048579 A1 EP0048579 A1 EP 0048579A1 EP 81304194 A EP81304194 A EP 81304194A EP 81304194 A EP81304194 A EP 81304194A EP 0048579 A1 EP0048579 A1 EP 0048579A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- lead
- solution
- anode
- tin
- cathode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/002—Cell separation, e.g. membranes, diaphragms
Definitions
- This invention relates to a method and apparatus for the electro-deposition of an alloy coating on to a backing member, such a process being of particular interest to the coating of a load carrying bearing surface on to the backing member of a plain bearing.
- Such a bearing may comprise for example a half shell backing member of steel with a bronze substrate bonded thereto and on to which is electro-deposited a bearing surface coating of lead-indium or lead-antimony-tin.
- Binary and ternary alloys can be co-deposited electrolytically as is described for example in British Patents 577335 and 628459 and in U.S.A Patent 2605149. In British Patent 577335 it is stated, and has been verified in tests, "that coatings of ternary alloys such as lead-antimony-tin or lead-tin-copper can replace the more usual lead-tin or lead- indium binary alloy coatings as bearing surfaces.
- apparatus for the electro-deposition of an alloy on to a cathode comprising a first chamber within which the cathode is located and which contains a catholyte solution; a second chamber within which the anode is located and which contains an anolyte solution, and said first and second chambers communicating with one another only through the medium of a cation exchange membrane.
- a method of electro-depositing an alloy on to a metal cathode comprising the steps of immersing the cathode in a first chamber containing a catholyte solution; immersing a metal anode in a second chamber containing an anolyte solution communicating with said catholyte solution only through the medium of a cation exchange membrane and applying a direct current between the anode and cathode.
- the anolyte will not contain elements capable of immersion plating on to the anode.
- the catholyte comprises a lead-antimony-tin plating solution then the anolyte will not contain any antimony.
- the catholyte comprises a lead-tin-copper plating solution then the anolyte will not contain copper.
- metal ions arising from the anode pass through the cation exchange membrane towards the cathode under the influence of the plating potential. Since the anolyte contains no metal capable of immersion plating on to the anode the anode will remain clean.
- the antimony or copper or arsenic in the catholyte (depending on what alloy is being co-deposited) is prevented from entering the anolyte by the physical barrier of the cation exchange membrane. That is to say, metal ions can pass in one direction only, i.e towards the cathode, and then only under the influence of the plating potential applied between the anode and cathode.
- the anolyte solution in the second chamber remains free of ions capable of immersion plating on to the anode.
- a further advantage of the use of a cation exchange membrane to physically separate the catholyte and anolyte solutions is that the composition of the catholyte may be controlled more readily since metal is not lost therefrom by immersion plating which in turn means that the electro-deposited alloys have more consistent compositions.
- first chamber 10 within which is locatable a member 12 to be plated and which comprises the cathode; such member may comprise a steel backing member with a bronze substrate bonded thereto and on to which is to be co-deposited a ternary alloy as a bearing surface.
- This first chamber 10 is capable of being filled with the catholyte solution.
- a second chamber 14 wholely contained within the first chamber and communicating therewith only through the medium of a cation exchange membrane 16.
- This second chamber 14 is conveniently of box like rectangular configuration having an open top and an open front across which is secured the exchange membrane 16 by means of detachable clamping plates and gaskets.
- a sheet 1 8 of porous polyethylene may be sealingly located by the gaskets on one or both sides of the membrane 16 the polyethylene sheeting 18 being provided to prevent physical damage to the exchange membrane 16 and also providing support against sag or swelling of the exchange membrane which may occur in use.
- the cation exchange membrane is a proprietary item and may be of the type available from Permutit-Boby of Brentford, Middlesex, England.
- the anode 20 is locatable within the second chamber 14 and the chamber 14 is capable of being filled with an anolyte solution to at least the same level as that of the catholyte solution in the first chamber 10. It may be preferable for the level of the anolyte solution to be above that of the catholyte solution to provide a slight hydrostatic pressure in favour of the anolyte.
- the apparatus was used for the electro-deposition of a ternary alloy of lead-antimony-tin to give a coating having a basis of lead and containing between 9.5% and 10.5% by weight of antimony and between 5.5% and 6.5% by weight of tin in the deposited alloy.
- the anode was a lead-tin anode containing 5% to 25% by weight of tin
- the cathode comprised a steel backing member on to which was bonded a bronze substrate. It is preferable to electroplate a base coating of cobalt or nickel on to the bronze substrate thereby to give a better surface for the deposition of the required ternary alloy particularly for the prevention of dispersal of tin into the bronze.
- the catholyte solution in the first chamber was as follows:-
- the temperature of the catholyte was maintained at 40°C and a cathode current density of 30 amperes per square foot was utilised for approximately 20 minutes to give a deposited alloy thickness of 25 um.
- the second chamber was filled with an anolyte solution of the following composition
- the temperature of the anolyte solution was maintained at 40°C
- the temperature of the catholyte solution was maintained at 25 0 C and cathode current density of 20 amperes per square foot was utilised for approximately 20 minutes to give a deposited ternary alloy of 25 um thickness.
- the anolyte solution was identical in all respects with the catholyte solution with the exception that no copper fluoroborate was present in the anolyte.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Conductive Materials (AREA)
Abstract
Description
- This invention relates to a method and apparatus for the electro-deposition of an alloy coating on to a backing member, such a process being of particular interest to the coating of a load carrying bearing surface on to the backing member of a plain bearing.
- Such a bearing may comprise for example a half shell backing member of steel with a bronze substrate bonded thereto and on to which is electro-deposited a bearing surface coating of lead-indium or lead-antimony-tin. Binary and ternary alloys can be co-deposited electrolytically as is described for example in British Patents 577335 and 628459 and in U.S.A Patent 2605149. In British Patent 577335 it is stated, and has been verified in tests, "that coatings of ternary alloys such as lead-antimony-tin or lead-tin-copper can replace the more usual lead-tin or lead- indium binary alloy coatings as bearing surfaces.
- However in the electro-deposition of ternary alloys containing antimony or copper, there is a displacement reaction when a soluble metal anode is used. For example in British Patent 628459 it is stated that antimony will immersion plate on to a lead, lead-tin or lead-tin-antimony anode. In Patent 628459 it is stated that this immersion plating is adherent enough so that the anode may be used two or three times and then the antimony may be scrubbed off and reclaimed and, whereas such a procedure may be acceptable for small scale operation, it would not be feasible to operate a continuous production plating process wherein anodes were required to be removed many times during the working operation for scrubbing.
- Similarly if a lead-tin-copper electrolyte is utilised, the copper in the plating solution immersion plates out on to metal anodes such as lead or lead-tin and, although such an electrolyte has been in production use for many years, the removal of all the anodes from the bath during idle periods is required, and frequent additions of copper fluoroborate are necessary to replace losses from the electrolyte.
- It is the object of the present invention to provide an improved method and apparatus which will prevent the undesirable immersion plating of a soluble metal anode containing lead by metals from the plating solution which are more noble than lead.
- In accordance with one aspect of the invention there is provided apparatus. for the electro-deposition of an alloy on to a cathode comprising a first chamber within which the cathode is located and which contains a catholyte solution; a second chamber within which the anode is located and which contains an anolyte solution, and said first and second chambers communicating with one another only through the medium of a cation exchange membrane.
- In accordance with a further aspect of the invention there is provided a method of electro-depositing an alloy on to a metal cathode comprising the steps of immersing the cathode in a first chamber containing a catholyte solution; immersing a metal anode in a second chamber containing an anolyte solution communicating with said catholyte solution only through the medium of a cation exchange membrane and applying a direct current between the anode and cathode.
- In use of the apparatus and method according to the invention the anolyte will not contain elements capable of immersion plating on to the anode. Thus if the catholyte comprises a lead-antimony-tin plating solution then the anolyte will not contain any antimony. Similarly if the catholyte comprises a lead-tin-copper plating solution then the anolyte will not contain copper.
- When the apparatus is in use, metal ions arising from the anode pass through the cation exchange membrane towards the cathode under the influence of the plating potential. Since the anolyte contains no metal capable of immersion plating on to the anode the anode will remain clean. At the end of a plating operation, when the plating potential is disconnected, the antimony or copper or arsenic in the catholyte (depending on what alloy is being co-deposited) is prevented from entering the anolyte by the physical barrier of the cation exchange membrane. That is to say, metal ions can pass in one direction only, i.e towards the cathode, and then only under the influence of the plating potential applied between the anode and cathode. Thus the anolyte solution in the second chamber remains free of ions capable of immersion plating on to the anode.
- A further advantage of the use of a cation exchange membrane to physically separate the catholyte and anolyte solutions is that the composition of the catholyte may be controlled more readily since metal is not lost therefrom by immersion plating which in turn means that the electro-deposited alloys have more consistent compositions.
- Other features of the invention will become apparent from the following description given herein solely by way of example and with reference to the accompanying drawing which shows, in diagrammatic form, a plan view of a plating bath in accordance with the invention.
- Referring to the drawings there is shown a
first chamber 10 within which is locatable amember 12 to be plated and which comprises the cathode; such member may comprise a steel backing member with a bronze substrate bonded thereto and on to which is to be co-deposited a ternary alloy as a bearing surface. Thisfirst chamber 10 is capable of being filled with the catholyte solution. - At the end of the
first chamber 10 remote from thecathode 12 there is provided asecond chamber 14 wholely contained within the first chamber and communicating therewith only through the medium of acation exchange membrane 16. Thissecond chamber 14 is conveniently of box like rectangular configuration having an open top and an open front across which is secured theexchange membrane 16 by means of detachable clamping plates and gaskets. To provide support and protection for the exchange membrane 16 a sheet 18 of porous polyethylene may be sealingly located by the gaskets on one or both sides of themembrane 16 thepolyethylene sheeting 18 being provided to prevent physical damage to theexchange membrane 16 and also providing support against sag or swelling of the exchange membrane which may occur in use. - The cation exchange membrane is a proprietary item and may be of the type available from Permutit-Boby of Brentford, Middlesex, England.
- The
anode 20 is locatable within thesecond chamber 14 and thechamber 14 is capable of being filled with an anolyte solution to at least the same level as that of the catholyte solution in thefirst chamber 10. It may be preferable for the level of the anolyte solution to be above that of the catholyte solution to provide a slight hydrostatic pressure in favour of the anolyte. - The following examples of use of the .apparatus will serve to illustrate the invention:-
- The apparatus was used for the electro-deposition of a ternary alloy of lead-antimony-tin to give a coating having a basis of lead and containing between 9.5% and 10.5% by weight of antimony and between 5.5% and 6.5% by weight of tin in the deposited alloy. The anode was a lead-tin anode containing 5% to 25% by weight of tin
- The cathode comprised a steel backing member on to which was bonded a bronze substrate. It is preferable to electroplate a base coating of cobalt or nickel on to the bronze substrate thereby to give a better surface for the deposition of the required ternary alloy particularly for the prevention of dispersal of tin into the bronze.
-
- The temperature of the catholyte was maintained at 40°C and a cathode current density of 30 amperes per square foot was utilised for approximately 20 minutes to give a deposited alloy thickness of 25 um.
-
- The temperature of the anolyte solution was maintained at 40°C
- In this example identical constructions of anode and cathode were utilised as in the preceding example but the electrolyte solutions were chosen to give a ternary alloy deposit on the cathode of lead-tin-copper having a basis of lead and containing between 8% and 12% by weight of tin and between 2% and 3% by weight of copper in the deposited alloy.
-
- The temperature of the catholyte solution was maintained at 250C and cathode current density of 20 amperes per square foot was utilised for approximately 20 minutes to give a deposited ternary alloy of 25 um thickness.
- The anolyte solution was identical in all respects with the catholyte solution with the exception that no copper fluoroborate was present in the anolyte.
- In both examples it was found that the anode remained clean and that the plating elements had been lost from the catholyte to the cathode at a controlled rate.
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT81304194T ATE10862T1 (en) | 1980-09-23 | 1981-09-14 | PROCESS FOR ELECTROPLATING OF LEAD ALLOYS. |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8030638A GB2084191A (en) | 1980-09-23 | 1980-09-23 | Electro-deposition of alloys |
GB8030638 | 1980-09-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0048579A1 true EP0048579A1 (en) | 1982-03-31 |
EP0048579B1 EP0048579B1 (en) | 1984-12-19 |
Family
ID=10516222
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP81304194A Expired EP0048579B1 (en) | 1980-09-23 | 1981-09-14 | Method for the electro-deposition of lead alloys |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0048579B1 (en) |
AT (1) | ATE10862T1 (en) |
BR (1) | BR8106041A (en) |
CA (1) | CA1172599A (en) |
DE (1) | DE3167841D1 (en) |
GB (1) | GB2084191A (en) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0218772A1 (en) * | 1984-08-22 | 1987-04-22 | MIBA Gleitlager Aktiengesellschaft | Galvanically deposited running layer for a slide bearing |
WO1997031138A1 (en) * | 1996-02-24 | 1997-08-28 | Glyco-Metall-Werke, Glyco B.V. & Co. Kg | Method of producing layered material for sliding bearings and an electroplating bath for carrying out this method |
US6740221B2 (en) | 2001-03-15 | 2004-05-25 | Applied Materials Inc. | Method of forming copper interconnects |
WO2005003411A1 (en) * | 2003-06-06 | 2005-01-13 | Taskem, Inc. | Tin alloy electroplating system |
FR2864553A1 (en) * | 2003-12-31 | 2005-07-01 | Coventya | Apparatus for the deposition of zinc or zinc alloys using a porous separator to divide the electrolyte bath into cathodic and anodic compartments |
US7239747B2 (en) | 2002-01-24 | 2007-07-03 | Chatterbox Systems, Inc. | Method and system for locating position in printed texts and delivering multimedia information |
US20130334052A1 (en) * | 2012-06-05 | 2013-12-19 | Novellus Systems, Inc. | Protecting anodes from passivation in alloy plating systems |
CN103849915A (en) * | 2012-12-06 | 2014-06-11 | 北大方正集团有限公司 | Electroplating device and method of plating copper in via hole of PCB (Printed Circuit Board) |
US9139927B2 (en) | 2010-03-19 | 2015-09-22 | Novellus Systems, Inc. | Electrolyte loop with pressure regulation for separated anode chamber of electroplating system |
US9404194B2 (en) | 2010-12-01 | 2016-08-02 | Novellus Systems, Inc. | Electroplating apparatus and process for wafer level packaging |
RU2739899C1 (en) * | 2020-07-27 | 2020-12-29 | Алексей Игоревич Буянов | Acid electrolyte for application of antifriction coating with lead-tin-copper alloy |
US10927475B2 (en) | 2017-11-01 | 2021-02-23 | Lam Research Corporation | Controlling plating electrolyte concentration on an electrochemical plating apparatus |
CN113195798A (en) * | 2019-11-28 | 2021-07-30 | 油研工业股份有限公司 | Method for suppressing increase in zinc concentration in plating solution and method for producing zinc-based plated member |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3335716A1 (en) * | 1983-10-01 | 1985-05-02 | Glyco-Metall-Werke Daelen & Loos Gmbh, 6200 Wiesbaden | SLIDING BEARING AND METHOD FOR THE PRODUCTION THEREOF |
CA2034568C (en) * | 1990-01-19 | 1995-08-29 | Yoshikazu Fujisawa | Slide member |
CA2069988C (en) * | 1991-05-31 | 1997-03-04 | Yoshikazu Fujisawa | Slide member with surface composed of pyramidal microprojections |
FR2678693B1 (en) * | 1991-06-11 | 1995-04-21 | Honda Motor Co Ltd | SLIDING CAPACITY. |
CA2074114C (en) * | 1991-07-18 | 1999-01-19 | Yoshikazu Fujisawa | Slide member |
GB2324805A (en) * | 1997-04-30 | 1998-11-04 | Platt Electromeck Limited | Electroplating |
RU2166568C1 (en) * | 1999-11-30 | 2001-05-10 | Кузнецов Анатолий Сергеевич | Electrolyte for depositing triple-component antifriction coating |
CN105350063B (en) * | 2015-11-09 | 2018-10-30 | 科文特亚环保电镀技术(江苏)有限公司 | A kind of anode system of electroplate liquid separation |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB577335A (en) * | 1944-02-10 | 1946-05-14 | Vandervell Products Ltd | Improvements in and relating to bearings and bearing surfaces |
GB628459A (en) * | 1945-07-10 | 1949-08-30 | Cleveland Graphite Bronze Co | Electrodeposition of lead-antimony-tin alloys |
GB679947A (en) * | 1950-06-09 | 1952-09-24 | Cleveland Graphite Bronze Co | Improvements in bearings |
US2793990A (en) * | 1952-06-04 | 1957-05-28 | Silvercrown Ltd | Electrodeposition of alloys containing copper and tin |
US3616305A (en) * | 1967-01-18 | 1971-10-26 | Eugene Arbez Ets | Process for depositing lead |
GB2007713A (en) * | 1977-10-21 | 1979-05-23 | Dipsol Chem | Method for stabilizing tin or tin alloy electroplating baths |
US4217198A (en) * | 1979-03-23 | 1980-08-12 | Olin Corporation | Coated perfluorosulfonic acid resin membranes and a method for their preparation |
-
1980
- 1980-09-23 GB GB8030638A patent/GB2084191A/en not_active Withdrawn
-
1981
- 1981-09-14 DE DE8181304194T patent/DE3167841D1/en not_active Expired
- 1981-09-14 EP EP81304194A patent/EP0048579B1/en not_active Expired
- 1981-09-14 AT AT81304194T patent/ATE10862T1/en not_active IP Right Cessation
- 1981-09-21 CA CA000386328A patent/CA1172599A/en not_active Expired
- 1981-09-22 BR BR8106041A patent/BR8106041A/en not_active IP Right Cessation
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB577335A (en) * | 1944-02-10 | 1946-05-14 | Vandervell Products Ltd | Improvements in and relating to bearings and bearing surfaces |
GB628459A (en) * | 1945-07-10 | 1949-08-30 | Cleveland Graphite Bronze Co | Electrodeposition of lead-antimony-tin alloys |
GB679947A (en) * | 1950-06-09 | 1952-09-24 | Cleveland Graphite Bronze Co | Improvements in bearings |
US2793990A (en) * | 1952-06-04 | 1957-05-28 | Silvercrown Ltd | Electrodeposition of alloys containing copper and tin |
US3616305A (en) * | 1967-01-18 | 1971-10-26 | Eugene Arbez Ets | Process for depositing lead |
GB2007713A (en) * | 1977-10-21 | 1979-05-23 | Dipsol Chem | Method for stabilizing tin or tin alloy electroplating baths |
US4217198A (en) * | 1979-03-23 | 1980-08-12 | Olin Corporation | Coated perfluorosulfonic acid resin membranes and a method for their preparation |
Non-Patent Citations (1)
Title |
---|
METAL FINISHING, vol. 74, no. 1, January 1976, METALS AND PLASTICS PUBLICATIONS, INC., Hackensach, N.J. USA Pages 30-34 * Page 34, especially "Lead Alloy Deposition " * * |
Cited By (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0218772A1 (en) * | 1984-08-22 | 1987-04-22 | MIBA Gleitlager Aktiengesellschaft | Galvanically deposited running layer for a slide bearing |
WO1997031138A1 (en) * | 1996-02-24 | 1997-08-28 | Glyco-Metall-Werke, Glyco B.V. & Co. Kg | Method of producing layered material for sliding bearings and an electroplating bath for carrying out this method |
US6086742A (en) * | 1996-02-24 | 2000-07-11 | Glyco-Metall-Werke, Glyco B.V. & Co. Kg | Method of producing layered material for sliding bearings and an electroplating bath for carrying out this method |
US6740221B2 (en) | 2001-03-15 | 2004-05-25 | Applied Materials Inc. | Method of forming copper interconnects |
US7239747B2 (en) | 2002-01-24 | 2007-07-03 | Chatterbox Systems, Inc. | Method and system for locating position in printed texts and delivering multimedia information |
WO2005003411A1 (en) * | 2003-06-06 | 2005-01-13 | Taskem, Inc. | Tin alloy electroplating system |
US7195702B2 (en) | 2003-06-06 | 2007-03-27 | Taskem, Inc. | Tin alloy electroplating system |
FR2864553A1 (en) * | 2003-12-31 | 2005-07-01 | Coventya | Apparatus for the deposition of zinc or zinc alloys using a porous separator to divide the electrolyte bath into cathodic and anodic compartments |
WO2005073438A1 (en) * | 2003-12-31 | 2005-08-11 | Coventya Sas | Zinc or zinc alloy deposition installation |
US9139927B2 (en) | 2010-03-19 | 2015-09-22 | Novellus Systems, Inc. | Electrolyte loop with pressure regulation for separated anode chamber of electroplating system |
US9404194B2 (en) | 2010-12-01 | 2016-08-02 | Novellus Systems, Inc. | Electroplating apparatus and process for wafer level packaging |
TWI585823B (en) * | 2010-12-01 | 2017-06-01 | 諾菲勒斯系統公司 | Electroplating apparatus and process for wafer level packaging |
US10309024B2 (en) | 2010-12-01 | 2019-06-04 | Novellus Systems, Inc. | Electroplating apparatus and process for wafer level packaging |
US9982357B2 (en) | 2010-12-01 | 2018-05-29 | Novellus Systems, Inc. | Electroplating apparatus and process for wafer level packaging |
US9534308B2 (en) | 2012-06-05 | 2017-01-03 | Novellus Systems, Inc. | Protecting anodes from passivation in alloy plating systems |
US20170137960A1 (en) * | 2012-06-05 | 2017-05-18 | Novellus Systems, Inc. | Protecting anodes from passivation in alloy plating systems |
US10106907B2 (en) | 2012-06-05 | 2018-10-23 | Novellus Systems, Inc. | Protecting anodes from passivation in alloy plating systems |
US20130334052A1 (en) * | 2012-06-05 | 2013-12-19 | Novellus Systems, Inc. | Protecting anodes from passivation in alloy plating systems |
US10954605B2 (en) | 2012-06-05 | 2021-03-23 | Novellus Systems, Inc. | Protecting anodes from passivation in alloy plating systems |
CN103849915A (en) * | 2012-12-06 | 2014-06-11 | 北大方正集团有限公司 | Electroplating device and method of plating copper in via hole of PCB (Printed Circuit Board) |
CN103849915B (en) * | 2012-12-06 | 2016-08-31 | 北大方正集团有限公司 | Electroplanting device and pcb board via copper coating |
US10927475B2 (en) | 2017-11-01 | 2021-02-23 | Lam Research Corporation | Controlling plating electrolyte concentration on an electrochemical plating apparatus |
US11401623B2 (en) | 2017-11-01 | 2022-08-02 | Lam Research Corporation | Controlling plating electrolyte concentration on an electrochemical plating apparatus |
CN113195798A (en) * | 2019-11-28 | 2021-07-30 | 油研工业股份有限公司 | Method for suppressing increase in zinc concentration in plating solution and method for producing zinc-based plated member |
US20220298668A1 (en) * | 2019-11-28 | 2022-09-22 | Yuken Industry Co., Ltd. | Method for suppressing increase in zinc concentration of plating solution and method for manufacturing zinc-based plating member |
RU2739899C1 (en) * | 2020-07-27 | 2020-12-29 | Алексей Игоревич Буянов | Acid electrolyte for application of antifriction coating with lead-tin-copper alloy |
Also Published As
Publication number | Publication date |
---|---|
EP0048579B1 (en) | 1984-12-19 |
CA1172599A (en) | 1984-08-14 |
ATE10862T1 (en) | 1985-01-15 |
DE3167841D1 (en) | 1985-01-31 |
BR8106041A (en) | 1982-06-08 |
GB2084191A (en) | 1982-04-07 |
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